Browsing by Author "Benedetti, Alessandro"
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Publication A finite element study of process induced stress in the transistor channel: effects of silicide contact and gate stack
Proceedings paper2004, EuroSimE: 5th Int. Conf. on Thermal & Mechanical Simulation and Experiments in Micro-Electronics and Micro-Systems, 9/05/2004, p.61-68Publication Analysis of depth-inhomogeneous strains in deep sub-micron silicon devices by TEM/CBED
;Spessot, A. ;Armigliato, A. ;Balboni, R. ;Frabboni, S.Benedetti, AlessandroProceedings paper2005, Proceedings 7th Multinational Congress on Microscopy, 26/06/2005, p.157-158Publication Comparison of electric properties of ultra-thin thermal and plasma nitrided silicon oxides with different post-deposition treatments using C-AFM
Journal article2005, Microelectronic Engineering, 80, p.436-439Publication Defect removal, dopant diffusion and activation issues in ion-implanted shallow junctions fabricated in crystalline germanium substrates
Proceedings paper2005, Gettering and Defect Engineering in Semiconductor Technology XI. Proceedings of the 11th International Autumn Meeting, 25/09/2005, p.691-696Publication Diffusion, activation and recrystallization of boron implanted in preamorphized and crystalline germanium
Journal article2005, Applied Physics letters, (87) 17, p.172109-1-172109-3Publication Effect of amorphization on activation and deactivation of boron in source/drain, channel and poly gate
Proceedings paper2005, Advanced Gate Stack, Source/Drain, and Channel Engineering for Si-based CMOS: New Materials, Processes, and Equipment, 15/05/2005, p.43-49Publication FEG-TEM analysis of the effects of Ge segregation and germane flux on the Ge profile across nm-scale SiGe layers, grown by both MBE and CVD
;Benedetti, Alessandro ;Norris, D.J. ;Hetherington, C.J.D. ;Cullis, A.G.Robbins, D.J.Proceedings paper2003, Microscopy of Semiconducting Materials XIII, 31/03/2003, p.151-154Publication Focused ion beam sample preparation: applications in materials science
Oral presentation2003, Microscopies in Mediterranean Area, 8th Congress of the French Society of Microscopie - MiMeAPublication Germanium content dependence of the leakage current of recessed SiGe source/drain junctions
Journal article2007, Journal of Materials Science: Materials in Electronics, (18) 7, p.787-791Publication Impact of Ni-silicide grain orientation on the strain and stress fields induced in patterned silicon
Journal article2007, Applied Physics Letters, (90) 5, p.54101Publication In-situ plucker system for preparation of TEM samples by FIB: new applications, future prospects and challenges
;Benedetti, AlessandroOral presentation2003, European Focused Ion Beam Users Group - EFUGPublication Ion implantation in Ge and associated defect control
Proceedings paper2005-09, Crystalline Defects and Contamination: Their Impact and Control in Device Manufacturing IV, 14/09/2005, p.52-58Publication Modulation of the Ni FUSI workfunction by Yb doping: from midgap to n-type band-edge
;Yu, HongYu ;Chen, J.D. ;Li, M.F. ;Lee, S.J. ;Kwong, D.L. ;van Dal, Marc ;Kittl, JorgeProceedings paper2005, Technical Digest International Electron Device Meeting (IEDM), 5/12/2005, p.27/03/2001-27/03/2004Publication Nanometer scale characterisation of CoSi2 and NiSi induced strain in silicon by convergent beam electron diffraction
Journal article2004, Materials Science and Engineering B, 114-115, p.61-66Publication On the asymmetric splitting of CBED HOLZ lines under the gate of recessed SiGe source/drain transistors
;Benedetti, AlessandroProceedings paper2007, Microscopy of Semiconducting Materials XV, 2/04/2007, p.411-414Publication On the splitting of high order Laue zone lines in CBED analysis of stress in silicon
Journal article2007, Journal of the Electrochemical Society, (154) 3, p.H217-H224Publication P implantation on doping of Ge: diffusion, activation, re-crystallization
Proceedings paper2005, USJ - The 8th Int. Workshop on the Fabrication, Characterization and Modeling of Ultra Shallow Junctions in Semiconductors, 5/06/2005Publication (Selective) epitaxial growth of strained Si to fabricate low cost and high performance CMOS devices
Proceedings paper2004, High-Mobility Group-IV Materials and Devices, 12/04/2004, p.3-14Publication Silicides for advanced CMOS devices
Proceedings paper2005, Microscopy of Semiconducting Materials. Proceedings of the 14th Conference, 11/04/2005, p.379-388