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Browsing by Author "Cross, Andrew"

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    Capture probability of assembly defects in 14 nm half-pitch line/space DSA patterns

    Pathangi Sriraman, Hari
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    Chan, BT  
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    Van Look, Lieve  
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    Vandenbroeck, Nadia  
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    Van Den Heuvel, Dieter  
    Meeting abstract
    2015, 41st International Conference on Micro- and Nanofabrication - MNE, 21/09/2015, p.Wed-A6-c1
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    Connected component analysis of review-SEM images for sub-10nm node process verification

    Halder, Sandip  
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    Leray, Philippe  
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    Sah, Kaushik  
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    Cross, Andrew  
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    Parisi, Paolo  
    Proceedings paper
    2017, Metrology, Inspection, and Process Control for Microlithography XXXI, 25/02/2017, p.101451Y
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    Deep learning-based defect detection using large FOV SEM for 28 nm pitch BEOL layer patterned with 0.33NA single exposure EUV

    Das, Sayantan  
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    Sah, Kaushik
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    Liang, Ardis
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    Roy, Hemanta
    ;
    Tran, Kha
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    Babu, Binesh
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    Hegde, Arjun
    Proceedings paper
    2021, International Conference on Extreme Ultraviolet Lithography, SEP 27-OCT 01, 2021, p.118540Y
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    Defect characterization of EUV Self-Aligned Litho-Etch Litho-Etch (SALELE) patterning scheme for advanced nodes

    Sah, Kaushik  
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    Cross, Andrew  
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    Das, Sayantan  
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    Blanco, Victor  
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    Kljucar, Luka  
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    Halder, Sandip  
    Proceedings paper
    2021, Metrology, Inspection, and Process Control for Microlithography XXXV, 22/02/2021, p.116112H
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    Defect source analysis of directed self-assembly process

    Rincon Delgadillo, Paulina  
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    Suri, Mayur
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    Durant, Stephane
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    Cross, Andrew  
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    Nagaswami, Venkat
    Journal article
    2013, Journal of Micro/Nanolithography MEMS and MOEMS, (12) 3, p.31112
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    Defect source analysis of directed self-assembly process (DSA of DSA)

    Rincon Delgadillo, Paulina  
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    Harukawa, Ryota
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    Suri, Mayur
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    Durant, Stephane
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    Cross, Andrew  
    Proceedings paper
    2013, Alternative Lithographic Technologies V, 24/02/2013, p.86800L
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    DSA materials contributions to the defectivity performance of the 14nm half-pitch LiNe flow @ imec

    Pathangi Sriraman, Hari
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    Vaid, Varun
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    Chan, BT  
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    Vandenbroeck, Nadia  
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    Li, Jin
    ;
    Hong, Sung Eun
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    Cao, Yi
    Proceedings paper
    2016, Alternative Lithographic Technologies VIII, 20/02/2016, p.97770G
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    EUV based multi-patterning schemes for advanced DRAM nodes

    Das, Sayantan  
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    Sah, Kaushik
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    Fallica, Roberto  
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    Chen, Zhijin
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    Halder, Sandip  
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    Cross, Andrew
    Proceedings paper
    2022, Conference on Advances in Patterning Materials and Processes XXXIX Part of SPIE Advanced Lithography and Patterning Conference, APR 24-MAY 27, 2022, p.Art. 1205503
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    EUV stochastic defect monitoring with advanced broadband optical wafer inspection and e-beam review systems

    Sah, Kaushik  
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    Cross, Andrew  
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    Plihal, Martin
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    Anantha, Vidyasagar
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    Babulnath, Raghav
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    Fung, Derek
    Proceedings paper
    2018, International Conference on Extreme Ultraviolet Lithography, 17/09/2018, p.1080909
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    Extreme thinning of Si wafers for via-last and multi wafer stacking applications

    Jourdain, Anne  
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    De Vos, Joeri  
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    Rassoul, Nouredine  
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    Zahedmanesh, Houman  
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    Miller, Andy  
    Proceedings paper
    2018, IEEE 68th Electronic Components and Technology Conference - ECTC, 29/05/2018, p.1-8
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    High sensitivity repeater detection with broadband plasma optical wafer inspection for mask defect qualification

    Cross, Andrew
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    Sah, Kaushik
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    Anantha, Vidyasagar
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    Gupta, Balarka
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    Ynzunza, Ramon
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    Troy, Neil
    Proceedings paper
    2020, Conference on Extreme Ultraviolet Lithography, SEP 21-25, 2020, p.11517OU
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    Hotspot discovery and variability analysis for advanced EUV processes

    Sah, Kaushik
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    Chen, Zhijin
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    Zhang, Yao
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    Zhang, Liming
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    Zhang, Cao
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    Higgins, Craig
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    Burov, Anatoly
    Proceedings paper
    2024, Conference on Metrology, Inspection, and Process Control XXXVIII, FEB 26-29, 2024, p.Art. 129553H
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    In-device high resolution and high throughput optical metrology for process development and monitoring

    Sah, Kaushik  
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    Li, Shifang
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    Das, Sayantan  
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    Halder, Sandip  
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    Cross, Andrew
    Proceedings paper
    2020, 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC), AUG 24-26, 2020
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    In-line metrology for characterization and control of extreme wafer thinning of bonded wafers

    Liebens, Maarten  
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    Jourdain, Anne  
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    De Vos, Joeri  
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    Vandeweyer, Tom  
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    Miller, Andy  
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    Beyne, Eric  
    Journal article
    2019, IEEE Transactions on Semiconductor Manufacturing, (32) 1, p.54-61
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    In-line metrology for characterization and control of extreme wafer thinning of bonded wafers

    Liebens, Maarten  
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    Jourdain, Anne  
    ;
    De Vos, Joeri  
    ;
    Vandeweyer, Tom  
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    Miller, Andy  
    ;
    Beyne, Eric  
    Proceedings paper
    2017, 28th Annual SEMI Advanced Semiconductor Manufacturing Conference - ASMC, 15/05/2017, p.331-336
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    Investigation of the performance of state-of-the-art defect inspection tools within EUV lithography

    Van Den Heuvel, Dieter  
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    Jonckheere, Rik  
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    Cheng, Shaunee
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    Marcuccilli, Gino
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    Cross, Andrew  
    Proceedings paper
    2012, Metrology, Inspection, and Process Control for Microlithography XXVI, 12/02/2012, p.83240L
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    Process window discovery methodology development for advanced lithography

    Van Den Heuvel, Dieter  
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    Foubert, Philippe  
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    Baudemprez, Bart  
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    Lee, Angelica
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    Cross, Andrew  
    Proceedings paper
    2016, 27th Annual SEMI Advanced Semiconductor Manufacturing Conference - ASMC, 16/05/2016, p.65-71
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    Process window discovery, expansion and control of design hotspots susceptible to overlay failures

    Sah, Kaushik  
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    Cross, Andrew  
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    Mani, Antonio  
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    Van Den Heuvel, Dieter  
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    Foubert, Philippe  
    Proceedings paper
    2017, 28th Annual SEMI Advanced Semiconductor Manufacturing Conference - ASMC, 15/05/2017
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    Single Mask Solution to Pattern BLP and SNLP using 0.33NA EUV for Next Generation DRAM Manufacturing

    Sah, Kaushik
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    Cross, Andrew
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    Das, Sayantan  
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    Fallica, Roberto  
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    Lee, Jeonghoon  
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    Kim, Ryan Ryoung han
    Proceedings paper
    2022, International Conference on Extreme Ultraviolet Lithography, SEP 26-29, 2022, p.Art. 122920W
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    stochastic defect monitoring with advanced broadband optical wafer inspection and e-Beam review systems

    Sah, Kaushik  
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    Cross, Andrew  
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    Plihal, Martin
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    Anantha, Vidyasugar
    ;
    Fung, Derek
    ;
    De Bisschop, Peter  
    Proceedings paper
    2018, International Conference on Extreme Ultraviolet Lithography 2018, 17/09/2018, p.1080909

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