Browsing by Author "Cross, Andrew"
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Publication Capture probability of assembly defects in 14 nm half-pitch line/space DSA patterns
Meeting abstract2015, 41st International Conference on Micro- and Nanofabrication - MNE, 21/09/2015, p.Wed-A6-c1Publication Connected component analysis of review-SEM images for sub-10nm node process verification
Proceedings paper2017, Metrology, Inspection, and Process Control for Microlithography XXXI, 25/02/2017, p.101451YPublication Deep learning-based defect detection using large FOV SEM for 28 nm pitch BEOL layer patterned with 0.33NA single exposure EUV
Proceedings paper2021, International Conference on Extreme Ultraviolet Lithography, SEP 27-OCT 01, 2021, p.118540YPublication Defect characterization of EUV Self-Aligned Litho-Etch Litho-Etch (SALELE) patterning scheme for advanced nodes
Proceedings paper2021, Metrology, Inspection, and Process Control for Microlithography XXXV, 22/02/2021, p.116112HPublication Defect source analysis of directed self-assembly process
Journal article2013, Journal of Micro/Nanolithography MEMS and MOEMS, (12) 3, p.31112Publication Defect source analysis of directed self-assembly process (DSA of DSA)
Proceedings paper2013, Alternative Lithographic Technologies V, 24/02/2013, p.86800LPublication DSA materials contributions to the defectivity performance of the 14nm half-pitch LiNe flow @ imec
;Pathangi Sriraman, Hari ;Vaid, Varun; ; ;Li, Jin ;Hong, Sung EunCao, YiProceedings paper2016, Alternative Lithographic Technologies VIII, 20/02/2016, p.97770GPublication EUV based multi-patterning schemes for advanced DRAM nodes
Proceedings paper2022, Conference on Advances in Patterning Materials and Processes XXXIX Part of SPIE Advanced Lithography and Patterning Conference, APR 24-MAY 27, 2022, p.Art. 1205503Publication EUV stochastic defect monitoring with advanced broadband optical wafer inspection and e-beam review systems
Proceedings paper2018, International Conference on Extreme Ultraviolet Lithography, 17/09/2018, p.1080909Publication Extreme thinning of Si wafers for via-last and multi wafer stacking applications
Proceedings paper2018, IEEE 68th Electronic Components and Technology Conference - ECTC, 29/05/2018, p.1-8Publication High sensitivity repeater detection with broadband plasma optical wafer inspection for mask defect qualification
;Cross, Andrew ;Sah, Kaushik ;Anantha, Vidyasagar ;Gupta, Balarka ;Ynzunza, RamonTroy, NeilProceedings paper2020, Conference on Extreme Ultraviolet Lithography, SEP 21-25, 2020, p.11517OUPublication Hotspot discovery and variability analysis for advanced EUV processes
;Sah, Kaushik ;Chen, Zhijin ;Zhang, Yao ;Zhang, Liming ;Zhang, Cao ;Higgins, CraigBurov, AnatolyProceedings paper2024, Conference on Metrology, Inspection, and Process Control XXXVIII, FEB 26-29, 2024, p.Art. 129553HPublication In-device high resolution and high throughput optical metrology for process development and monitoring
Proceedings paper2020, 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC), AUG 24-26, 2020Publication In-line metrology for characterization and control of extreme wafer thinning of bonded wafers
Journal article2019, IEEE Transactions on Semiconductor Manufacturing, (32) 1, p.54-61Publication In-line metrology for characterization and control of extreme wafer thinning of bonded wafers
Proceedings paper2017, 28th Annual SEMI Advanced Semiconductor Manufacturing Conference - ASMC, 15/05/2017, p.331-336Publication Investigation of the performance of state-of-the-art defect inspection tools within EUV lithography
Proceedings paper2012, Metrology, Inspection, and Process Control for Microlithography XXVI, 12/02/2012, p.83240LPublication Process window discovery methodology development for advanced lithography
Proceedings paper2016, 27th Annual SEMI Advanced Semiconductor Manufacturing Conference - ASMC, 16/05/2016, p.65-71Publication Process window discovery, expansion and control of design hotspots susceptible to overlay failures
Proceedings paper2017, 28th Annual SEMI Advanced Semiconductor Manufacturing Conference - ASMC, 15/05/2017Publication Single Mask Solution to Pattern BLP and SNLP using 0.33NA EUV for Next Generation DRAM Manufacturing
;Sah, Kaushik ;Cross, Andrew; ; ; Kim, Ryan Ryoung hanProceedings paper2022, International Conference on Extreme Ultraviolet Lithography, SEP 26-29, 2022, p.Art. 122920WPublication stochastic defect monitoring with advanced broadband optical wafer inspection and e-Beam review systems
Proceedings paper2018, International Conference on Extreme Ultraviolet Lithography 2018, 17/09/2018, p.1080909