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Browsing by Author "Dutta, Shibesh"

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    3 omega correction method for eliminating resistance measurement error due to Joule heating

    Guralnik, Benny
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    Hansen, Ole
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    Henrichsen, Henrik H.
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    Beltran-Pitarch, Braulio
    Journal article
    2021, REVIEW OF SCIENTIFIC INSTRUMENTS, (92) 9, p.094711
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    Alternative metals for advanced interconnects

    Adelmann, Christoph  
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    Wen, Liang Gong
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    Peter, Antony  
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    Siew, Yong Kong  
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    Dutta, Shibesh
    Meeting abstract
    2014-10, International Conference Micro- and Nanoelectronics - ICMNE, 6/10/2014
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    Alternative metals for advanced interconnects

    Adelmann, Christoph  
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    Wen, Liang Gong
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    Dutta, Shibesh
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    Boemmels, Juergen  
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    Tokei, Zsolt  
    Oral presentation
    2015, SEMI Strategic Materials Conference
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    Alternative metals: from ab initio screening to calibrated narrow line models

    Adelmann, Christoph  
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    Sankaran, Kiroubanand  
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    Dutta, Shibesh
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    Gupta, Anshul  
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    Kundu, Shreya  
    Proceedings paper
    2018, IEEE International Interconnect Technology Conference - IITC, 4/06/2018, p.154-156
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    Atomic layer deposition of ruthenium for advanced interconnect applications

    Adelmann, Christoph  
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    Popovici, Mihaela Ioana  
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    Groven, Benjamin  
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    Wen, Liang Gong
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    Dutta, Shibesh
    Meeting abstract
    2016, Materials for Advanced Metalization Conference - MAM, 20/03/2016, p.PMT-08
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    Atomic layer deposition of ruthenium thin films from (ethylbenzyl) (1-ethyl-1,4-cyclohexadienyl) Ru: process characteristics, surface chemistry, and film properties

    Popovici, Mihaela Ioana  
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    Groven, Benjamin  
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    Marcoen, Kristof  
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    Phung, Quan
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    Dutta, Shibesh
    Journal article
    2017, Chemistry of Materials, (29) 11, p.4654-4666
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    Atomic layer deposition of ruthenium with TiN interface for sub-10nm advanced interconnects beyond copper

    Wen, Liang Gong
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    Roussel, Philippe  
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    Varela Pedreira, Olalla  
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    Briggs, Basoene  
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    Groven, Benjamin  
    Journal article
    2016-09, ACS Applied Materials & Interfaces, (9) 39, p.26119-26125
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    Characterization of ultra-thin nickel-silicide films synthesized using the solid state reaction of Ni with an underlying Si:P substrate (P: 0.7 to 4.0%)

    Peter, Antony  
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    Yu, Hao  
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    Dutta, Shibesh
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    Rosseel, Erik  
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    Van Elshocht, Sven  
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    Paulussen, Kris  
    Journal article
    2016, Microelectronic Engineering, 157, p.52-59
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    Direct metal nanowire patterning using ion beam etch

    Kundu, Shreya  
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    Dutta, Shibesh
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    Gupta, Anshul  
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    Jamieson, Geraldine  
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    Piumi, Daniele  
    Meeting abstract
    2017, AVS 64th International Symposium and Exhibition, 29/10/2017, p.PS-WeM13
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    Finite size effects in highly scaled ruthenium interconnects

    Dutta, Shibesh
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    Moors, Kristof
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    Vandemaele, Michiel  
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    Adelmann, Christoph  
    Journal article
    2018, IEEE Electron Device Letters, (39) 2, p.268-271
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    Finite Size Effects in Platinum-group Metal Nanostructures

    Dutta, Shibesh
    PHD thesis
    2018-10
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    Hall effect measurement for precise sheet resistance and thickness evaluation of Ruthenium thin films using non-equidistant four-point probes

    Oesterberg, Frederik Westergaard
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    Witthoeft, Maria-Louise
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    Dutta, Shibesh
    Journal article
    2018, AIP Advances, (8) 5, p.055206-1-055206-7
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    Highly scaled ruthenium interconnects

    Dutta, Shibesh
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    Kundu, Shreya  
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    Gupta, Anshul  
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    Jamieson, Geraldine  
    Journal article
    2017, IEEE Electron Device Letters, (38) 7, p.949-951
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    Low-temperature electronic transport properties of ruthenium thin films and nanowires

    Mai, Nikolai
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    Heinzel, Thomas
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    Cerchez, Mihai
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    Dutta, Shibesh
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    Gupta, Anshul  
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    Kundu, Shreya  
    Journal article
    2024, PHYSICAL REVIEW B, (110) 19, p.Art. 195431
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    N5 technology node dual-damascene interconnects enabled using multi patterning

    Briggs, Basoene  
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    Wilson, Chris  
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    Devriendt, Katia  
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    van der Veen, Marleen  
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    Decoster, Stefan  
    Proceedings paper
    2017, IEEE International Interconnect Technology Conference - IITC, 16/05/2017, p.1-3
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    Phase analysis and thermal stability of thin films synthesized via solid state reaction of Ni with Si1-xGex substrate

    Peter, Antony  
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    Witters, Thomas  
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    Dutta, Shibesh
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    Hikavyy, Andriy  
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    Vaesen, Inge  
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    Van Elshocht, Sven  
    Journal article
    2016, Microelectronic Engineering, 149, p.46-51
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    Resistivity scaling model for metals with conduction band anisotropy

    De Clercq, Miguel
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    Moors, Kristof
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    Sankaran, Kiroubanand  
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    Pourtois, Geoffrey  
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    Dutta, Shibesh
    Journal article
    2018, Physical Review Materials, (2) 3, p.033801-01-033801-11
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    Ruthenium interconnects with 58 nm2 cross-section area using a metal-spacer process

    Dutta, Shibesh
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    Kundu, Shreya  
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    Wen, Lianggong
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    Jamieson, Geraldine  
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    Croes, Kristof  
    Proceedings paper
    2017, IEEE International Interconnect Technology Conference - IITC, 16/05/2017, p.1-3
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    Ruthenium metallization for advanced interconnects

    Wen, Liang Gong
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    Adelmann, Christoph  
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    Varela Pedreira, Olalla  
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    Dutta, Shibesh
    Proceedings paper
    2016, IEEE International Interconnect Technology Conference / Advanced Metallization Conference - IITC/AMC, 23/05/2016, p.34-36
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    Sub-100 nm2 cobalt interconnects

    Dutta, Shibesh
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    Beyne, Sofie  
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    Gupta, Anshul  
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    Kundu, Shreya  
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    Bender, Hugo  
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    Van Elshocht, Sven  
    Journal article
    2018, IEEE Electron Device Letters, (39) 5, p.731-734
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