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Browsing by Author "Grasser, T."

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    A Comprehensive Cryogenic CMOS Variability and Reliability Assessment using Transistor Arrays

    Grill, Alexander  
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    Michl, J.
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    Diaz Fortuny, Javier  
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    Beckers, Arnout  
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    Bury, Erik  
    Proceedings paper
    2023, 7th IEEE Electron Devices Technology and Manufacturing Conference (EDTM), MAR 07-10, 2023
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    A drift-diffusion-based analytic description of the energy distribution function for hot-carrier degradation in decananometer NMOSFETs

    Sharma, P.
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    Tyaginov, S.
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    Rauch, S.E.
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    Franco, Jacopo  
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    Kaczer, Ben  
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    Makarov, A.
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    Vexler, M.I.
    Proceedings paper
    2016, 46th European Solid-State Device Research Conference - ESSDERC, 12/09/2016, p.428-431
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    A reliable method for the extraction of the lateral position of defects in ultra-scaled MOSFETs

    Illarionov, Yu. Yu.
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    Bina, M.
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    Tyaginov, S. E.
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    Rott, K.
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    Reisinger, H.
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    Kaczer, Ben  
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    Grasser, T.
    Proceedings paper
    2014, International Reliability Physics Symposium - IRPS, 1/06/2014, p.XT.13
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    A rigorous study of measurement techniques for negative bias temperature instability

    Grasser, T.
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    Wagner, P. J.
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    Hehenberger, P.
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    Goes, W.
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    Kaczer, Ben  
    Journal article
    2008-09, IEEE Transactions on Device and Materials Reliability, (8) 3, p.526-536
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    Atomic Hydrogen Exposure to Enable High-Quality Low-Temperature SiO2 with Excellent pMOS NBTI Reliability Compatible with 3D Sequential Tier Stacking

    Franco, Jacopo  
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    de Marneffe, Jean-Francois  
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    Vandooren, Anne  
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    Kimura, Yosuke  
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    Nyns, Laura  
    Proceedings paper
    2020, IEEE International Electron Devices Meeting (IEDM), DEC 12-18, 2020
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    Benchmarking time-dependent variability of junctionless nanowire FETs

    Kaczer, Ben  
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    Rzepa, G.
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    Franco, Jacopo  
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    Weckx, Pieter  
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    Vaisman Chasin, Adrian  
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    Putcha, Vamsi  
    Proceedings paper
    2017, International Reliability Physics Symposium - IRPS, 2/04/2017, p.2D-6.1-2D-6.7
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    Characterization and modeling of charge trapping: From single defects to devices

    Grasser, T.
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    Rzepa, G.
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    Waltl, M.
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    Goes, W.
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    Rott, K.
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    Rott, G.
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    Reisinger, H.
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    Franco, Jacopo  
    Proceedings paper
    2014, IEEE International Conference on IC Design & Technology - ICICDT, 28/05/2014, p.1-4
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    Characterization and physical modeling of the temporal evolution of near-interfacial states resulting from NBTI/PBTI stress in nMOS/pMOS transistors

    Grasser, T.
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    Stampfer, B.
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    Waltl, M.
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    Rzepa, G.
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    Rupp, K.
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    Schanovsky, F.
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    Pobegen, G.
    Proceedings paper
    2018, 2018 IEEE International Reliability Physics Symposium - IRPS, 13/03/2018, p.2A.2-1-2A.2-10
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    Circuit simulation of workload-dependent RTN and BTI based on trap kinetics

    Camargo, V. V. A.
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    Kaczer, Ben  
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    Grasser, T.
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    Wirth, G.
    Journal article
    2014, Microelectronics Reliability, (54) 11, p.2364-2370
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    COMPHY - A compact-physics framework for unified modeling of BTI

    Rzepa, Gerhard
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    Franco, Jacopo  
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    O'Sullivan, Barry  
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    Subirats, Alexandre
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    Simicic, Marko  
    Journal article
    2018, Microelectronics Reliability, 85, p.49-65
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    Critical modeling issues in negative bias temperature instability

    Grasser, T.
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    Kaczer, Ben  
    Meeting abstract
    2009, 215th Electrochemical Society Spring Meeting, 24/05/2009, p.793
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    CV Stretch-Out Correction after Bias Temperature Stress: Work-function Dependence of Donor-/Acceptor-like Traps, Fixed Charges, and Fast States

    Grasser, T.
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    O'Sullivan, Barry  
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    Kaczer, Ben  
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    Franco, Jacopo  
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    Stampfer, B.
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    Waltl, M.
    Proceedings paper
    2021, IEEE International Reliability Physics Symposium (IRPS), MAR 21-24, 2021
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    Defect creation stimulated by thermally activated hole trapping as the driving force behind negative bias temperature instability in SiO2, SiON, and high-k gate stacks

    Grasser, T.
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    Kaczer, Ben  
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    Aichinger, T.
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    Goes, W.
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    Nelhiebel, M.
    Proceedings paper
    2008, IEEE Integrated Reliability Workshop - IRW, 12/10/2008, p.91-95
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    Efficient physical defect model applied to PBTI in high-k stacks

    Rzepa, G.
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    Franco, Jacopo  
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    Subirats, Alexandre
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    Jech, M.
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    Vaisman Chasin, Adrian  
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    Grill, A.
    Proceedings paper
    2017, IEEE International Reliability Physics Symposium - IRPS, 2/04/2017, p.XT-11.1-XT-11.6
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    Evidence of Tunneling Driven Random Telegraph Noise in Cryo-CMOS

    Michl, J.
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    Grill, Alexander  
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    Stampfer, B.
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    Waldhoer, D.
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    Schleich, C.
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    Knobloch, T.
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    Ioannidis, E.
    Proceedings paper
    2021, IEEE International Electron Devices Meeting (IEDM), DEC 11-16, 2021
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    From mean values to distributions of BTI lifetime of deeply scaled FETs through atomistic understanding of the degradation

    Toledano Luque, Maria
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    Kaczer, Ben  
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    Franco, Jacopo  
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    Roussel, Philippe  
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    Grasser, T.
    Proceedings paper
    2011, Symposium on VLSI Technology, 13/06/2011, p.152-153
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    Hot-carrier degradation in FinFETs: modeling, peculiarities, and impact of device topology

    Makarov, A.
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    Tyaginov, S. E.
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    Kaczer, Ben  
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    Jech, M.
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    Vaisman Chasin, Adrian  
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    Grill, A.
    Proceedings paper
    2017, IEEE International Electron Devices Meeting - IEDM, 2/12/2017, p.310-313
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    Hydrogen-related volatile defects as the possible cause for the recoverable component of NBTI

    Grasser, T.
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    Rott, K.
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    Reisinger, H.
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    Waltl, M.
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    Wagner, P.
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    Schanovsky, F.
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    Goes, W.
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    Pobegen, G.
    Proceedings paper
    2013, International Electron Devices Meeting - IEDM, 9/12/2013, p.409-412
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    Impact of single charged gate oxide defects on the performance and scaling of nanoscaled FETs

    Franco, Jacopo  
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    Kaczer, Ben  
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    Toledano Luque, Maria
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    Roussel, Philippe  
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    Mitard, Jerome  
    Proceedings paper
    2012, International Reliability Physics Symposium - IRPS, 15/04/2012, p.5A-4
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    Implications of gate-sided hydrogen release for post-stress degradation build-up after BTI stress

    Grasser, T.
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    Waltl, M.
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    Puschkarsky, K.
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    Stampfer, B.
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    Rzepa, G.
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    Pobegen, G.
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    Reisinger, H.
    Proceedings paper
    2017, IEEE International Reliability Physics Symposium - IRPS, 2/04/2017, p.6A-2.1-6A-2.6
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