Browsing by Author "Grill, Alexander"
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Publication A Compact Physics Analytical Model for Hot-Carrier Degradation
Proceedings paper2020, IEEE International Reliability Physics Symposium (IRPS), APR 28-MAY 30, 2020Publication A Comprehensive Cryogenic CMOS Variability and Reliability Assessment using Transistor Arrays
Proceedings paper2023, 7th IEEE Electron Devices Technology and Manufacturing Conference (EDTM), MAR 07-10, 2023Publication Analysis of the features of hot-carrier degradation in FinFETs
Journal article2018-10, Semiconductors, (52) 10, p.1298-1302Publication Bi-modal variability of nFinFET characteristics during hot-carrier stress: a modeling approach
Journal article2019, IEEE Electron Device Letters, (40) 10, p.1579-1582Publication Border trap based modeling of SiC transistor transfer characteristics
Proceedings paper2018, International Integrated Reliability Workshop (IIRW), 7/11/2018, p.1-5Publication Characterization of DC performance and low-frequency noise of an array of nMOS Forksheets from 300 K to 4 K
Journal article2024, SOLID-STATE ELECTRONICS, (215) May, p.Art. 108881Publication CMOS Cryo-Electronics for Quantum Computing
Proceedings paper2020, IEEE International Electron Devices Meeting (IEDM), DEC 12-18, 2020Publication Cold CMOS for Sustainable Datacenters
Proceedings paper2024, 50th IEEE European Solid-State Electronics Research Conference (ESSERC), SEP 09-12, 2024, p.229-232Publication Compact Physics Hot-Carrier Degradation Model Valid over a Wide Bias Range
Journal article2023, MICROMACHINES, (14) 11, p.Art. 2018Publication Comphy v3.0-A compact-physics framework for modeling charge trapping related reliability phenomena in MOS devices
Journal article2023, MICROELECTRONICS RELIABILITY, (146) July, p.Art. 115004Publication Cryo-Computing for Infrastructure Applications: A Technology-to-Microarchitecture Co-optimization Study
Proceedings paper2022, International Electron Devices Meeting (IEDM), DEC 03-07, 2022Publication Cryogenic Temperature Effects on 16nm FinFet Performance and Mismatch
Proceedings paper2024, 50th IEEE European Solid-State Electronics Research Conference (ESSERC), SEP 09-12, 2024, p.341-344Publication Cyclic Thermal Effects on Devices of Two-Dimensional Layered Semiconducting Materials
Journal article2021, ADVANCED ELECTRONIC MATERIALS, (7) 9, p.2100348Publication Deep Understanding of Electron Beam Effects on 2D Layered Semiconducting Devices Under Bias Applications
Journal article2022, ADVANCED MATERIALS INTERFACES, (9) 9, p.Art. 2102488Publication Efficient Modeling of Charge Trapping a Cryogenic Temperatures-Part II: Experimental
Journal article2021, IEEE TRANSACTIONS ON ELECTRON DEVICES, (68) 12, p.6372-6378Publication Efficient Modeling of Charge Trapping at Cryogenic Temperatures-Part I: Theory
Journal article2021, IEEE TRANSACTIONS ON ELECTRON DEVICES, (68) 12, p.6365-6371Publication Evidence of Tunneling Driven Random Telegraph Noise in Cryo-CMOS
Proceedings paper2021, IEEE International Electron Devices Meeting (IEDM), DEC 11-16, 2021Publication Gate oxide reliability: upcoming trends, challenges, and opportunities
Proceedings paper2024, IEEE Silicon Nanoelectronics Workshop (SNW) / Symposium on VLSI Technology and Circuits, 2024-06-15, p.3-4Publication Gate-Induced-Drain-Leakage (GIDL) in CMOS Enhanced by Mechanical Stress
Journal article2022, IEEE TRANSACTIONS ON ELECTRON DEVICES, (69) 4, p.2214-2217Publication Hot-Electron-Induced Punch-Through (HEIP) Effect in p-MOSFET Enhanced by Mechanical Stress
Journal article2021, IEEE ELECTRON DEVICE LETTERS, (42) 10, p.1424-1427
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