Browsing by Author "Hellin, David"
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Publication 15nm half-pitch patterning: EUV + SELF-aligned double patterning
Oral presentation2012, International Symposium on Extreme Ultraviolet Lithography - EUVLPublication 15nm HP patterning with EUV and SADP: key contributors for improvement of LWR, LER, and CDU
Proceedings paper2013, Advanced Etch Technology for Nanopatterning II, 23/02/2013, p.86850CPublication 15nm HP patterning with EUV lithography and SADP
Meeting abstract2012, 34th International Symposium on Dry Process - DPS, 15/11/2012Publication A Ge matrix removal method for metallic contamination analysis on Ge wafers using TXRF
Oral presentation2004, European Conference on X-Ray SpectrometryPublication A novel concept for contact etch residue removal
Proceedings paper2007, Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing 10, 7/10/2007, p.403-407Publication Advanced wafer surface cleaning technology
Oral presentation2004, SEMICON Korea 2004 STS, S5: Contamination-free Manufacturing SeminarPublication Challenges and approaches in advanced Fin patterning
Proceedings paper2019, PESM-2019 Plasma Etch and Strip in Microelectronics, 20/05/2019Publication Chlorine detection and quantification in ALCVD HfO2 high-k dielectric films using total reflection X-ray fluorescence spectrometry
Meeting abstract2003, 204th Meeting of the Electrochemical Society: 2nd Int. Symp. on High Dielectric Constant Materials, 13/10/2003Publication Determination of metallic contaminants on Ge wafers using direct- and droplet sandwich etch- total reflection X-ray fluorescence spectrometry
; ;Bearda, Twan ;Zhao, Chao ;Raskin, G.; ; Journal article2003-12, Spectrochim. Acta B, (58) 12, p.2093-2104Publication Fin bending in dimensional scaling
Oral presentation2020, 2020 SPIE Advanced Lithography: Advances in Patterning Materials and Processes XXXIIPublication Gate double patterning strategies for 10nm node FinFET devices
Meeting abstract2014, Advanced Etch Technology for Nanopatterning III, 23/02/2014, p.905407Publication Germanium deep-submicron p-FET and n-FET devices, fabricated on germanium-on-insulator substrates
Book chapter2007Publication Grazing incidence X-ray fluorescence spectrometry for compositional analysis of nanometer-thin high-k dielectric HfO2 layers
Journal article2005-07, Analytical Sciences, (21) 7, p.845-850Publication H2S exposure of a (100)Ge surfaces: evidences for a (2x1) electrically passivated surface
Journal article2007, Applied Physics Letters, (90) 22, p.222105Publication Hafnium oxide films by atomic layer deposition for high-k gate dielectric applications: analysis of the density of nanometer-thin films
Journal article2005, Applied Physics Letters, (86) 7, p.73116Publication Impact of direct CMP on surface and bulk properties of high porosity low-k materials
Proceedings paper2007, Advanced Metallization Conference 2006, 17/10/2006, p.549-563Publication Implementation of a system for metal contamination control based on classification criteria
Proceedings paper2008, Ultra Clean Processing of Semiconductor Surfaces VIII - UCPSS, 18/09/2006, p.259-262Publication Integration of high-K gate dielectrics - wet etch, cleaning and surface conditioning
Proceedings paper2004, Cleaning Technology in Semiconducting Device Manufacturing VIII. Proceedings of the International Symposium, 13/10/2003, p.67-77Publication Interplay between dry etch and wet clean in patterning La2O3/HfO2-containing high-k/metal gate stacks
Proceedings paper2009, Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing 11, 4/10/2009, p.29-36Publication Interplay of plasma etch, strip and wet clean in patterning La2O3/HfO2-containing high-k metal gate stacks
Journal article2011, Microelectronic Engineering, (88) 1, p.21-27
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