Browsing by Author "Hiblot, Gaspard"
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Publication Antenna effect in 65nm NMOS devices with 9.5nm thick HfOx gate dielectric
Proceedings paper2021, IEEE International Integrated Reliability Workshop (IIRW) / 4th Reliability Experts Forum, OCT 04-29, 2021, p.57-60Publication Backside power delivery with a direct 14:1/19:1 high-ratio point-of-load power converter for servers and datacenters
Proceedings paper2021, 2021 Symposia on VLSI Technology, 13/06/2021Publication CFET SRAM With Double-Sided Interconnect Design and DTCO Benchmark
Journal article2023, IEEE TRANSACTIONS ON ELECTRON DEVICES, (70) 10, p.5099-5106Publication Characterization of Impact of Vertical Stress on FinFETs
Meeting abstract2019, 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), 16/09/2019Publication Comparative analysis of the degradation mechanisms in logic and I/O FinFET devices induced by plasma damage
Proceedings paper2019, 2019 IEEE International Reliability Physics Symposium (IRPS), 31/03/2019, p.1-5Publication Cumulated charging mechanisms at gate processing in high-kappa first planar NMOS devices
Proceedings paper2020, IEEE International Integrated Reliability Workshop (IIRW), OCT 04-NOV 01, 2020, p.54-57Publication Design and Optimization of SRAM Macro and Logic Using Backside Interconnects at 2nm node
Proceedings paper2021, IEEE International Electron Devices Meeting (IEDM), DEC 11-16, 2021Publication Electrical characterization of BEOL plasma-induced damage in bulk FinFET technology
Journal article2019, IEEE Transactions on Device and Materials Reliability, (19) 1, p.88-89Publication Enabling Logic with Backside Connectivity via n-TSVs and its Potential as a Scaling Booster
; ; ; ; ; Proceedings paper2021, 2021 Symposium on VLSI Technology, 13/06/2021Publication Factor analysis of plasma-induced damage in bulk FinFET technology
Journal article2018, IEEE Electron Device Letters, (39) 7, p.927-930Publication Full loop equivalent circuit model for plasma induced damage simulation
Journal article2018, IEEE Transactions on Plasma Science, (46) 10, p.3677-3682Publication Impact of 1 $lm TSV via-last integration on electrical performance of advanced FinFET devices
Proceedings paper2018, IEEE Electron Devices Technology and Manufacturing Conference - EDTM, 13/03/2018, p.122-124Publication Impact of local-interconnect to gate overlay on series resistance compensation for saturation velocity extraction
Journal article2018, IEEE Transactions on Semiconductor Manufacturing, (31) 2, p.215-220Publication Impact of packaging stress on thinned 6T SRAM die
Journal article2020, International Journal of Electronics Letters, (8) 1, p.38-45Publication Impact of Sub-mu m Wafer Thinning on Latch-up Risk in STCO Scaling Era
;Serbulova, Kateryna ;Chen, Shih-Hung ;Hellings, Geert ;Hiblot, GaspardVeloso, AnabelaProceedings paper2021, 43rd Annual EOS/ESD Symposium (EOS/ESD), SEP 26-OCT 01, 2021Publication Impacts of Through-Silicon Vias on Total-Ionizing-Dose Effects and Low-Frequency Noise in FinFETs
;Li, Kan ;Zhang, En Xia ;Gorchichko, Mariia ;Wang, Peng Fei ;Reaz, MahmudZhao, Simeng E.Journal article2021, IEEE TRANSACTIONS ON NUCLEAR SCIENCE, (68) 5, p.740-747Publication Impacts of through-silicon vias on total-ionizing-dose effects and low-frequency noise in FinFETs
Proceedings paper2020, Nuclear & Space Radiation Effects Conference - NSREC, 20/07/2020, p.PC-6Publication In-situ investigation of the impact of externally applied vertical stress on III-V bipolar transistor
Proceedings paper2018, IEEE International Electron Devices Meeting - IEDM, 1/12/2018, p.408-411