Browsing by Author "Meneghesso, Gaudenzio"
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Publication A comprehensive reliability investigation of the voltage-, temperature- and device geometry-dependence of the gate degradation on state-of-the-art GaN-on-Si HEMTs
Proceedings paper2010-12, IEEE International Electron Device Meeting - IEDM, 6/12/2010, p.472-472Publication Al2O3 surface passivation characterized on hydrophobic and hydrophilic c-Si by a combination of QSSPC, CV, XPS and FTIR
Proceedings paper2012, Proceedings of the 2nd International Conference on Crystalline Silicon Photovoltaics - Silicon PV, 3/04/2012, p.355-360Publication AlGaNGaN-based HEMTs failure physics and reliability: mechanisms affecting gate edge and Schottky junction
Journal article2013, IEEE Transactions on Electron Devices, (60) 10, p.3119-3131Publication An insight into the parasitic capacitances of SOI and bulk FinFET devices
Proceedings paper2009, 18th European Workshop on Heterostructure Technology - HETECH, 2/11/2009Publication Analysis of the drain-to-substrate leakage of power HEMTs grown on highly resistive silicon substrate
Proceedings paper2018, GaN Marathon 2.0, 18/04/2018, p.38-39Publication Analysis of threshold voltage instabilities in semi-vertical GaN-on-Si FETs
Journal article2020, Applied Physics Express, (13) 2, p.24004Publication Angular and strain dependence of heavy-ions induced degration in SOI FinFETs
;Griffoni, Alessio ;Gerardin, Simone ;Meneghesso, GaudenzioPaccagnella, AlessandroJournal article2010, IEEE Transactions on Nuclear Science, (57) 4, p.1924-1932Publication Challenges and Perspectives for Vertical GaN-on-Si Trench MOS Reliability: From Leakage Current Analysis to Gate Stack Optimization
Journal article review2021, MATERIALS, (14) 9, p.2316Publication Degradation mechanisms in AlGaN/GaN HEMTs submitted to off and on-state stress conditions
Proceedings paper2012, 6th Space Agency - MOD Workshop on Wideband Gap Semiconductors and Components, 8/10/2012Publication Degradation of AlGaN/GaN HEMTs below the "critical voltage": a time-dependent analysis
Proceedings paper2012, International Conference on Compound Semiconductor Manufacturing Technology - CSMantech, 23/04/2012Publication Degradation of AlGaN/GaN Schottky diodes on silicon: Role of defects at the AlGaNGaN interface
Journal article2013, Applied Physics Letters, (102) 16, p.163501Publication Degradation of GaN-HEMTs with p-GaN Gate: Dependence on temperature and on geometry
Proceedings paper2017, IEEE International Reliability Physics Symposium - IRPS, 2/04/2017, p.4B-5.1-4B-5.5Publication Demonstration of Bilayer Gate Insulator for Improved Reliability in GaN-on-Si Vertical Transistors
;Mukherjee, Kalparupa ;De Santi, Carlo ;Meneghesso, GaudenzioZanoni, EnricoProceedings paper2020, IEEE International Reliability Physics Symposium (IRPS), APR 28-MAY 30, 2020Publication Dose enhancement due to interconnects in deep-submicron MOSFETs exposed to X-rays
;Griffoni, Alessio ;Silvestri, Marco ;Gerardin, SimoneMeneghesso, GaudenzioProceedings paper2008, 8th European Workshop on Radiation Effects on Components and Systems - RADECS, 10/09/2008, p.432-437Publication Dose enhancement due to interconnects in deep-submicron MOSFETs exposed to X-rays
;Griffoni, Alessio ;Silvestri, Marco ;Gerardin, SimoneMeneghesso, GaudenzioJournal article2009, IEEE Transactions on Nuclear Science, (56) 4, part 2, p.2205-2212Publication Electrical characterization of ALD Al2O3 – HfO2 and PECVD Al2O3 passivation layers for p-type CZ-Silicon PERC solar cells
Proceedings paper2012, IEEE Photovoltaic Specialists Conference - PVSC, 3/06/2012, p.1077-1082Publication Electrical-based ESD characterization methodology for ultrathin body SOI MOSFETs
Journal article2010, IEEE Transactions on Device and Materials Reliability, (10) 1, p.130-141Publication Electroluminescence analysis of time-dependent reverse-bias degradation of HEMTs: a complete model
;Meneghini, Matteo ;Stocco, Antonio ;Bertini, Marco ;Ronchi, NicolòChini, AlessandroProceedings paper2011, IEEE International Electron Devices Meeting - IEDM, 5/12/2011, p.469-472Publication Evaluation of novel carrier substrates for high reliability and integrated GaN devices in a 200 mm complementary metal-oxide semiconductor compatible process
Journal article2018, MRS Communications, 84, p.1387-1394Publication Evidence of hot-electron degradation in GaN-based MIS-HEMTs submitted to high temperature constant source current stress
Journal article2016, IEEE Electron Device Letters, (37) 11, p.1415-1417
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