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Browsing by Author "Roussel, Philippe"

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    6Å EOT Si0.45Ge0.55 pMOSFET with optimized reliability (VDD=1V): Meeting the NBTI lifetime target at ultra-thin EOT

    Franco, Jacopo  
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    Kaczer, Ben  
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    Eneman, Geert  
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    Mitard, Jerome  
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    Stesmans, Andre  
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    Afanasiev, Valeri  
    Proceedings paper
    2010, IEEE International Electron Devices Meeting - IEDM, 6/12/2010, p.70-73
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    A brief overview of gate oxide defect properties and their relation to MOSFET instabilities and device and circuit time-dependent variability

    Kaczer, Ben  
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    Franco, Jacopo  
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    Weckx, Pieter  
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    Roussel, Philippe  
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    Putcha, Vamsi  
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    Bury, Erik  
    Journal article
    2018, Microelectronics Reliability, 81, p.186-194
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    A compact model for the grounded-gate nMOS behaviour under CDM ESD stress

    Russ, Christian
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    Verhaege, Koen
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    Bock, Karlheinz
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    Roussel, Philippe  
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    Groeseneken, Guido  
    Proceedings paper
    1996, Proceedings of 18th Annual Electrical Overstress/Electrostatic Discharge Symposium, 10/09/1996, p.302-315
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    A compact model for the grounded-gate nMOS transistor behaviour under CDM ESD stress

    Russ, Christian
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    Verhaege, Koen
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    Bock, Karlheinz
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    Roussel, Philippe  
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    Groeseneken, Guido  
    Journal article
    1998, Journal of Electrostatics, (42) 4, p.351-381
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    A compact NBTI model for accurate analog integrated circuit reliability simulation

    Maricau, Elie
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    Zhang, Leqi
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    Franco, Jacopo  
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    Roussel, Philippe  
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    Groeseneken, Guido  
    Proceedings paper
    2011, European Solid State Device Research Conference - ESSDERC, 12/09/2011, p.147-150
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    A comprehensive LER-aware TDDB lifetime model for advanced Cu interconnects

    Stucchi, Michele  
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    Roussel, Philippe  
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    Tokei, Zsolt  
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    Demuynck, Steven  
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    Groeseneken, Guido  
    Journal article
    2011, IEEE Transactions on Device and Materials Reliability, (11) 2, p.278-289
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    A consistent model for oxide trap profiling with the trap spectroscopy by charge injection and sensing (TSCIS) technique

    Cho, Moon Ju
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    Degraeve, Robin  
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    Roussel, Philippe  
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    Govoreanu, Bogdan  
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    Kaczer, Ben  
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    Zahid, Mohammed
    Journal article
    2010, Solid-State Electronics, (54) 11, p.1384-1391
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    A consistent model for the hard breakdown distribution including digital soft breakdown: the noble art of area scaling

    Roussel, Philippe  
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    Degraeve, Robin  
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    Sahhaf, Sahar  
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    Groeseneken, Guido  
    Journal article
    2007, Microelectronic Engineering, (84) 9_10, p.1925-1925
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    A new analytic model for the description of the intrinsic oxide breakdown statistics of ultra-thin oxides

    Degraeve, Robin  
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    Roussel, Philippe  
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    Groeseneken, Guido  
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    Maes, Herman
    Journal article
    1996, Microelectronics and Reliability, 36, p.1639-1642
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    A new model for the field dependence of intrinsic and extrinsic time-dependent dielectric breakdown

    Degraeve, Robin  
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    Ogier, Jean-Luc
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    Bellens, Rudi
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    Roussel, Philippe  
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    Groeseneken, Guido  
    Journal article
    1998, IEEE Trans. Electron Devices, (45) 2, p.472-481
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    A new physically-based model for temperature acceleration of time-to-breakdown

    Pangon, Nadège
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    Degraeve, Robin  
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    Roussel, Philippe  
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    Groeseneken, Guido  
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    Maes, Herman
    Oral presentation
    1998, 29th IEEE Semiconductor Interface Specialists Conference - SISC; 3-5 Dec. 1998; San Diego, CA, USA.
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    A new polarity dependence of the reduced trap generation during high-field degradation of nitrided oxides

    Degraeve, Robin  
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    De Blauwe, Jan
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    Ogier, Jean-Luc
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    Roussel, Philippe  
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    Groeseneken, Guido  
    Proceedings paper
    1996, International Electron Devices Meeting. Technical Digest - IEDM, 8/12/1996, p.327-330
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    A new quantitative model to predict SILC-related disturb characteristics in Flash E2PROM devices

    De Blauwe, Jan
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    Van Houdt, Jan  
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    Wellekens, Dirk  
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    Degraeve, Robin  
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    Roussel, Philippe  
    Proceedings paper
    1996, International Electron Devices Meeting - IEDM, 8/12/1996, p.343-346
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    A new statistical model for fitting bimodal oxide breakdown distributions at different field conditions

    Degraeve, Robin  
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    Roussel, Philippe  
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    Ogier, Jean-Luc
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    Groeseneken, Guido  
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    Maes, Herman
    Journal article
    1996, Microelectronics and Reliability, 36, p.1651-1654
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    A new TDDB reliability prediction methodology accounting for multiple SBD and wear out

    Sahhaf, Sahar  
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    Degraeve, Robin  
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    Roussel, Philippe  
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    Kaczer, Ben  
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    Kauerauf, Thomas
    Journal article
    2009, IEEE Transactions on Electron Devices, (56) 7, p.1424-1432
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    A physics-aware compact modeling framework for transistor aging in the entire bias space

    Wu, Zhicheng  
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    Franco, Jacopo  
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    Roussel, Philippe  
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    Tyaginov, Stanislav  
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    Truijen, Brecht  
    Proceedings paper
    2019, IEEE International Electron Devices Meeting - IEDM, 7/12/2019, p.494-497
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    A pragmatic network-aware paradigm for system-level electromigration predictions at scale

    Zahedmanesh, Houman  
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    Roussel, Philippe  
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    Ciofi, Ivan  
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    Croes, Kristof  
    Proceedings paper
    2023, 61st IEEE International Reliability Physics Symposium (IRPS), MAR 26-30, 2023
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    A statistical approach to microdose induced degradation in FinFET devices

    Griffoni, Alessio
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    Gerardin, S.
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    Roussel, Philippe  
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    Degraeve, Robin  
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    Meneghesso, G.
    Journal article
    2009, IEEE Transactions on Nuclear Science, (56) 6_1, p.3285-3292
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    Abrupt breakdown in dielectric/metal gate stacks: a potential reliability limitation?

    Kauerauf, Thomas
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    Degraeve, Robin  
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    Zahid, Mohammed
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    Cho, Moon Ju
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    Kaczer, Ben  
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    Roussel, Philippe  
    Journal article
    2005, IEEE Electron Device Letters, (26) 10, p.773-775
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    Accelerated Capture and Emission (ACE) measurement pattern for efficient BTI characterization and modeling

    Wu, Zhicheng  
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    Franco, Jacopo  
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    Claes, Dieter  
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    Rzepa, Gerhard
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    Roussel, Philippe  
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    Collaert, Nadine  
    Proceedings paper
    2019, 2019 IRPS IEEE International Reliability Physics Symposium - IRPS, 31/03/2019, p.1-7
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