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Browsing by Author "Shah, Kavita"

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    300 mm-wafer characterization of ruthenium area-selective deposition in nanoscale line-space and hole patterns

    Clerix, Jan-Willem  
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    Delabie, Annelies  
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    Hung, Joey  
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    Warad, L.
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    Shah, Kavita
    Meeting abstract
    2020, 20th International Conference on Atomic Layer Deposition, 2/04/2020, p.AS-TuP-14
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    Impact of LER on BEOL dielectric reliability: a quantitative model and experimental validation

    Tokei, Zsolt  
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    Roussel, Philippe  
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    Stucchi, Michele  
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    Versluijs, Janko  
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    Ciofi, Ivan  
    Proceedings paper
    2009, IEEE International Interconnect Technology Conference - IITC, 1/06/2009, p.228-230
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    Implementation of Ru based barriers in 50 nm half pitch single damascene Cu/SiCOH (k=2.5) structures

    Carbonell, Laure
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    Volders, Henny  
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    Heylen, Nancy  
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    Kellens, Kristof  
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    Tokei, Zsolt  
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    Hendrickx, Dirk  
    Meeting abstract
    2008, Advanced Metallization Conference - AMC, 23/09/2008
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    Implementation of Ru based barriers in 50 nm half pitch single damascene Cu/SiCOH (k=2.5) structures

    Carbonell, Laure
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    Volders, Henny  
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    Heylen, Nancy  
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    Kellens, Kristof  
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    Tokei, Zsolt  
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    Hendrickx, Dirk  
    Proceedings paper
    2009, Advanced Metallization Conference 2008 (AMC2008), 23/09/2008, p.91-97
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    Integration of 20nm half pitch single damascene copper trenches by spacer-defined double patterning (SDDP) on metal hard mask (MHM)

    Siew, Yong Kong  
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    Versluijs, Janko  
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    Kunnen, Eddy
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    Ciofi, Ivan  
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    Alaerts, Wilfried  
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    Dekkers, Harold  
    Proceedings paper
    2010, IEEE International Interconnect Technology Conference - IITC, 7/06/2010
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    Manufacturable processes for =32-nm-node CMOS enhancement by synchronous optimization of strain-engineered channel and external parasitic resistances

    Noori, Atif
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    Balseanu, Mihaela
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    Boelen, Pieter
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    Cockburn, Andrew  
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    Demuynck, Steven  
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    Felch, Susan
    Journal article
    2008, IEEE Transactions on Electron Devices, (55) 5, p.1259-1264
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    Metallization of sub- 30 nm Interconnects: Comparison of different liner/seed combinations

    Carbonell, Laure
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    Volders, Henny  
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    Heylen, Nancy  
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    Kellens, Kristof  
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    Caluwaerts, Rudy  
    Proceedings paper
    2009, Proceedings of the IEEE International Interconnect Technology Conference, 1/06/2009, p.200-202
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    Metallization options for sub- 30 nm interconnects: comparison of Cu and W metallizations

    Carbonell, Laure
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    Caluwaerts, Rudy  
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    Volders, Henny  
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    Heylen, Nancy  
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    Kellens, Kristof  
    Oral presentation
    2010, Advanced Metallization Conference - AMC
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    Plasma enhanced atomic layer deposition of ruthenium ultra-thin films for advanced metallization

    Swerts, Johan  
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    Armini, Silvia  
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    Carbonell, Laure
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    Delabie, Annelies  
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    Franquet, Alexis  
    Meeting abstract
    2010, AVS 57th International Symposium & Exhibition, 17/10/2010
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    Plasma halogenated amorphous carbon as growth inhibiting layer for area-selective deposition of titanium oxide

    Krishtab, Mikhail  
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    Hung, Joey  
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    Koret, Roy
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    Turovets, Igor
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    Shah, Kavita
    ;
    Rangarajan, Srinivasan
    Proceedings paper
    2020, Metrology, Inspection, and Process Control for Microlithography XXXIV, 23/02/2020, p.113250Y
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    Scalability of plasma enhanced atomic layer deposited ruthenium films for interconnect applications

    Swerts, Johan  
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    Armini, Silvia  
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    Carbonell, Laure
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    Delabie, Annelies  
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    Franquet, Alexis  
    Journal article
    2012, Journal of Vacuum Science and Technology A, (30) 1, p.01A103
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    Scatterometry and X-ray metrology for in-line control of spin-transfer torque magnetic random access memory (STT-MRAM) devices

    Crotti, Davide  
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    Swerts, Johan  
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    Yasin, Farrukh  
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    Jossart, Nico  
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    Souriau, Laurent  
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    Kundu, Shreya  
    Oral presentation
    2018, SPIE Advanced Lithography Conference
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    Spacer defined double patterning for 20nm half pitch interconnect damascene structures

    Siew, Yong Kong  
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    Cockburn, Andrew  
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    Beyer, Gerald  
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    Versluijs, Janko  
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    Kunnen, Eddy
    ;
    Dekkers, Harold  
    Oral presentation
    2010, Applied Materials Engineering Technology Conference

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