Browsing by Author "Shah, Kavita"
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Publication 300 mm-wafer characterization of ruthenium area-selective deposition in nanoscale line-space and hole patterns
Meeting abstract2020, 20th International Conference on Atomic Layer Deposition, 2/04/2020, p.AS-TuP-14Publication Impact of LER on BEOL dielectric reliability: a quantitative model and experimental validation
Proceedings paper2009, IEEE International Interconnect Technology Conference - IITC, 1/06/2009, p.228-230Publication Implementation of Ru based barriers in 50 nm half pitch single damascene Cu/SiCOH (k=2.5) structures
;Carbonell, Laure; ; ; ; Meeting abstract2008, Advanced Metallization Conference - AMC, 23/09/2008Publication Implementation of Ru based barriers in 50 nm half pitch single damascene Cu/SiCOH (k=2.5) structures
;Carbonell, Laure; ; ; ; Proceedings paper2009, Advanced Metallization Conference 2008 (AMC2008), 23/09/2008, p.91-97Publication Integration of 20nm half pitch single damascene copper trenches by spacer-defined double patterning (SDDP) on metal hard mask (MHM)
; ; ;Kunnen, Eddy; ; Proceedings paper2010, IEEE International Interconnect Technology Conference - IITC, 7/06/2010Publication Manufacturable processes for =32-nm-node CMOS enhancement by synchronous optimization of strain-engineered channel and external parasitic resistances
Journal article2008, IEEE Transactions on Electron Devices, (55) 5, p.1259-1264Publication Metallization of sub- 30 nm Interconnects: Comparison of different liner/seed combinations
Proceedings paper2009, Proceedings of the IEEE International Interconnect Technology Conference, 1/06/2009, p.200-202Publication Metallization options for sub- 30 nm interconnects: comparison of Cu and W metallizations
Oral presentation2010, Advanced Metallization Conference - AMCPublication Plasma enhanced atomic layer deposition of ruthenium ultra-thin films for advanced metallization
Meeting abstract2010, AVS 57th International Symposium & Exhibition, 17/10/2010Publication Plasma halogenated amorphous carbon as growth inhibiting layer for area-selective deposition of titanium oxide
Proceedings paper2020, Metrology, Inspection, and Process Control for Microlithography XXXIV, 23/02/2020, p.113250YPublication Scalability of plasma enhanced atomic layer deposited ruthenium films for interconnect applications
Journal article2012, Journal of Vacuum Science and Technology A, (30) 1, p.01A103Publication Scatterometry and X-ray metrology for in-line control of spin-transfer torque magnetic random access memory (STT-MRAM) devices
Oral presentation2018, SPIE Advanced Lithography ConferencePublication Spacer defined double patterning for 20nm half pitch interconnect damascene structures
; ; ; ; ;Kunnen, EddyOral presentation2010, Applied Materials Engineering Technology Conference