Browsing by Author "Tahara, Shigeru"
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Publication 28nm pitch of line/space pattern transfer into silicon substrates with chemo-epitaxy directed self-assembly (DSA) process flow
Oral presentation2013, 39th International Conference on Micro and Nano Engineering - MNEPublication Contact hole CD uniformity repair through directed self-assembly of cylindrical phase block copolymers
Oral presentation2012, MRS Fall M eeting Symposium S: Directed Self-Assembly for NanopatterningPublication Cryo-etching for integration in micro-electronic : Silicon deep etch for contact and low-k integration in Back end of line (BEOL)
Publication Direct etched Cu characterization for advanced interconnects
Proceedings paper2015, IEEE International Interconnect Technology Conference - IITC / Materials for Advanced Metallization Conference - MAM, 18/05/2015, p.173-176Publication Etching of Co-Pd with significantly reduced sidewall re-deposition
Meeting abstract2013, 35th International Symposium on Dry Process, 29/08/2013, p.D-4Publication High Aspect Ratio Supervia Dual Damascene etch for iN5 and beyond
Meeting abstract2021, AVS 67th International Symposium and Exhibition, 24/10/2021Publication High selective plasma etching for PMMA of block-copolymer in directed-self assembly
; Tahara, ShigeruMeeting abstract2012, 34th International Symposium on Dry Process - DPS, 15/11/2012Publication Low damage ULK etching by means of high boiling point organic condensation
Publication Low damage ultra-low-k patterning using a high boiling point organic (HBPO) combined with NF3
Journal article2018, Plasma Research Express (IOP), 1, p.15006Publication Low-k material cryoetch using high boiling point organic compounds to reduce plasma induced damage
Meeting abstract2018, Dry Process Symposium, 13/11/2018Publication Magnetic tunnel junctions etch and encapsulation process optimization for high-density STT-MRAM applications
Meeting abstract2016, AVS 63rd International Symposium and Exhibition, 6/11/2016, p.PS-ThP33Publication Progress in directed self-assembly hole shrink applications
Proceedings paper2013, Advances in Resist Materials and Processing Technology XXX, 25/02/2013, p.86820LPublication Short- and damage-free process for patterning magnetic tunnel junctions for high-density application
Meeting abstract2015, AVS 62nd International Symposium & Exhibition, 18/10/2015, p.PS1-TuA12Publication STT MRAM patterning challenges
Proceedings paper2013, Advanced Etch Technology for Nanopatterning II, 24/02/2013, p.86850FPublication Ultra-low k dielectric and plasma damage control for advanced technology nodes (10-nm and below)
Meeting abstract2013, AVS 60th International Symposium and Exhibition, 28/10/2013, p.240