Browsing by Author "Vandepitte, Dirk"
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Publication An integrated creep, crack growth and thermo-mechanical fatigue model for WLCSP assemblies soldered with SAC 405
Proceedings paper2009, 59th Electronic Components and Technology Conference - ECTC, 25/05/2009, p.704-712Publication Analysis of microbump induced stress effects in 3D stacked IC technologies
; ; Proceedings paper2012, IEEE International 3D System Integration Conference - 3DIC, 31/01/2012, p.9-AprPublication Analysis of the induced stresses in silicon during thermocompression Cu-Cu bonding of Cu-through-vias in 3D-SIC architecture
Proceedings paper2007-05, Proceedings 57th Electronic Components and Technology Conference - ECTC, 29/05/2007, p.249-255Publication Assessment of the feasibility of 'multiple chips-to-wafer' thermo-compression bonding using FEM
Proceedings paper2008, EuroSimE: Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 20/04/2008Publication Crack growth rate measurement and analysis for WLCSP Sn-Ag-Cu solder joints
Proceedings paper2005-09, SMTA International Annual Conference, 25/09/2005, p.371-377Publication Creep behavior of mixed SAC 405/ SnPb soldered assemblies in shear loading
Proceedings paper2007, 9th Electronics Packaging Technology Conference - EPTC, 10/12/2007, p.703-712Publication Dealing with IC package material and design uncertainties using FUZZY finite elements
Proceedings paper2013, IEEE Int. Conf on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsyst. - EuroSimE, 14/04/2013Publication Elimination of the axial deformation problem of Cu-TSV in 3D integration
; ; ; ; Proceedings paper2010, Stress-Induced Phenomena in Metallization: 11th International Workshop, 12/04/2010, p.214-220Publication Extraction of the appropriate material property for realistic modeling of through-silicon-vias using μ-raman spectroscopy
Proceedings paper2008, 11th International Interconnect Technology Conference - IITC, 1/06/2008, p.16-18Publication FET arrays as CPI sensors for 3D stacking and packaging characterization
Proceedings paper2012, IEEE International Reliability Physics Symposium - IRPS, 15/04/2012, p.2.00E-03Publication Finite element modeling of aolder joint fatigue in four-point bending test
Proceedings paper2012, 13th Int. Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics - EuroSimE, 16/04/2012Publication Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu
Journal article2011, Journal of Materials Science, (46) 11, p.3868-3882Publication Influence of annealing conditions on the mechanical and microstructural behavior of electroplated Cu-TSV
Journal article2010, Journal of Micromechanics and Microengineering, (20) 4, p.45032Publication Influence of intermetallic properties of lead-free flip chip solder joints
Journal article2008, IEEE Transactions on Advanced Packaging, (31) 1, p.51-57Publication Insertion bonding: A novel Cu-Cu bonding approach for 3D integration
Proceedings paper2010, IEEE 60th Electronics Components and Technology Conference - ECTC, 1/06/2010, p.1370-1375Publication Investigation of the influence of UBM on lead free flip chip solder fatigue life by explicit finite element modeling of intermetallic layers
Proceedings paper2005, Proceedings 15th European Microelectronics and Packaging Conference - EPMC, 12/06/2005, p.253-258Publication Low-temperature enbrittlement of lead-free solders in joint level impact testing
Proceedings paper2007-12, 9th Electronics Packaging Conference - EPTC, 10/12/2007, p.140-151Publication Mixed numerical-experimental analysis of embedding strain sensors in structural adhesive joints
Publication Novel Cu-Cu bonding technique: the insertion bonding approach
Journal article2011, IEEE Transactions on Components, Packaging and Manufacturing Technology, (1) 12, p.1885-1894