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Browsing by Author "Verhaegen, Staf"

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    A 0.314mm2 6T-SRAM cell built with tall triple-gate devices for 45nm node applications using 0.75NA 193nm lithography

    Nackaerts, Axel
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    Ercken, Monique  
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    Demuynck, Steven  
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    Lauwers, Anne  
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    Baerts, Christina  
    Proceedings paper
    2004-12, Technical Digest International Electron Devices Meeting - IEDM, 13/12/2004, p.269-272
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    A methodology for double patterning compliant split and design

    Wiaux, Vincent  
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    Verhaegen, Staf
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    Iwamoto, Fumio
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    Maenhoudt, Mireille
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    Matsuda, Takashi
    Proceedings paper
    2008, SPIE Lithography Asia, 4/11/2008, p.71401X
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    Analysis of the impact of reticle CD variations on the available process windows for a 100nm CMOS process

    Verhaegen, Staf
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    Vandenberghe, Geert  
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    Jonckheere, Rik  
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    Ronse, Kurt  
    Proceedings paper
    2002, 22nd Annual BACUS Symposium on Photomask Technology, 3/10/2002, p.197-208
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    ArF lithography with combination of moderate OAI and attenuated PSM

    Kim, Young-Chang
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    Vandenberghe, Geert  
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    Verhaegen, Staf
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    Ronse, Kurt  
    Oral presentation
    2001, 21st Annual BACUS Symposium on Photomask Technology; October 2001; Monterey, CA, USA.
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    Assessment of OPC effectiveness using two-dimensional metrics

    Wiaux, Vincent  
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    Philipsen, Vicky  
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    Jonckheere, Rik  
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    Vandenberghe, Geert  
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    Verhaegen, Staf
    Proceedings paper
    2002, Optical Microlithography XV, 5/03/2002, p.395-406
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    CD control for two-dimensional features in future technology nodes

    Verhaegen, Staf
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    Gordon, R.
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    Jonckheere, Rik  
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    McCallum, M.
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    Ronse, Kurt  
    Proceedings paper
    2001, Optical Microlithography XIV, 27/02/2001, p.368-378
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    Challenge for sub-100-nm DRAM gate printing using ArF lithography with combination of moderate OAI and attPSM

    Kim, Young-Chang
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    Vandenberghe, Geert  
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    Verhaegen, Staf
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    Ronse, Kurt  
    Proceedings paper
    2002, 21st Annual BACUS Symposium on Photomask Technology, 3/10/2001, p.954-967
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    Challenges building a 22nm node 6T-SRAM cell using immersion lithography

    Ercken, Monique  
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    Altamirano Sanchez, Efrain  
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    Baerts, Christina  
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    Brus, Stephan  
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    De Backer, Johan  
    Proceedings paper
    2009, 6th International Symposium on Immersion Lithography Extensions, 22/10/2009
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    Challenges in patterning 45nm node multiple-gate devices and SRAM cells

    Ercken, Monique  
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    Delvaux, Christie  
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    Baerts, Christina  
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    Locorotondo, Sabrina  
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    Degroote, Bart
    Proceedings paper
    2004, Proceedings 41st Interface Symposium, 26/09/2004
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    Challenges in using optical lithography for the building of a 22 nm node 6T=-SRAM cell

    Ercken, Monique  
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    Altamirano Sanchez, Efrain  
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    Baerts, Christina  
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    Brus, Stephan  
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    De Backer, Johan  
    Journal article
    2010, Microelectronic Engineering, (87) 5_8, p.993-996
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    Checking design conformance and optimizing manufacturability using automated double-patterning decomposition

    Cork, Christopher M.
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    Ward, Brian
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    Barnes, Levi D.
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    Painter, Ben
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    Lucas, Kevin
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    Luk-Pat, Gerry
    Proceedings paper
    2008, Design for Manufacturability through Design-Process Integration II, 24/02/2008, p.69251Q
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    Demonstration of scaled 0.099μm² FinFET 6T-SRAM cell using full-field EUV lithography for (Sub-)22nm node single-patterning technology

    Veloso, Anabela  
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    Demuynck, Steven  
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    Ercken, Monique  
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    Goethals, Mieke
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    Locorotondo, Sabrina  
    Proceedings paper
    2009-12, IEEE International Electron Devices Meeting - IEDM, 7/12/2009, p.301-304
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    Density limits in logic metal1 using double patterning

    Wiaux, Vincent  
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    Verhaegen, Staf
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    Fenger, Germain
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    Wong, Patrick  
    Proceedings paper
    2009, 6th International Symposium on Immersion Lithography Extensions, 22/10/2009
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    Double patterning design split implementation and validation for the 32nm node

    Drapeau, Martin
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    Wiaux, Vincent  
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    Hendrickx, Eric  
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    Verhaegen, Staf
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    Machida, Takahiro
    Proceedings paper
    2007, Design for Manufacturability through Design-Process Integration, 28/02/2007, p.652109
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    Double patterning EDA solutions for the 32nm HP and beyond

    Bailey, George
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    Tritchkov, Alexander
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    Park, Jea-Woo
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    Hong, Le
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    Wiaux, Vincent  
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    Hendrickx, Eric  
    Proceedings paper
    2007, Design for Manufacturability through Design-Process Integration, 28/02/2007, p.65211k
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    Double-patterning interactions with wafer processing, optical proximity correction, and physical design flows

    Lucas, Kevin
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    Cork, Christopher M.
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    Miloslavsky, Alexander
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    Luk-Pat, Gerard
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    Barnes, Levi D.
    Journal article
    2009, Journal of Micro/Nanolithography, MEMS, and MOEMS, (8) 3, p.33002
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    EUV lithography implementation on contact and metal interconnect level of a 22nm node 0.099um2 6T-SRAM cell

    Goethals, Mieke
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    Demuynck, Steven  
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    Van Roey, Frieda  
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    Baudemprez, Bart  
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    Hermans, Jan  
    Proceedings paper
    2009, International Symposium on Extreme Ultraviolet Lithography, 18/10/2009
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    Experimental verification of source-mask optimization and freeform illumination for 22 nm node SRAM cells

    Bekaert, Joost  
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    Laenens, Bart
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    Verhaegen, Staf
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    Van Look, Lieve  
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    Trivkovic, Darko  
    Journal article
    2011-03, Journal of Micro/Nanolithography MEMS and MOEMS, (10) 1, p.13008
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    Exploration of etch step interactions in the dual patterning process for process modeling

    Melvin, Lawrence
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    Ward, Brian
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    Song, H.
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    Rhie, S.U.
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    Lucas, K.D.
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    Wiaux, Vincent  
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    Verhaegen, Staf
    Journal article
    2008, Journal of Vacuum Science and Technology B, (26) 6, p.2434-2434
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    Extreme scaling of optical lithography: overview of process integration issues

    Ronse, Kurt  
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    Wiaux, Vincent  
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    Verhaegen, Staf
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    Van Look, Lieve  
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    Bekaert, Joost  
    ;
    Laidler, David  
    Oral presentation
    2009, Optical Microlithography XXII
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