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Browsing by Author "Zhou, Daisy"

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    Advanced channel materials for the semiconductor industry

    Collaert, Nadine  
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    Alian, AliReza  
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    Arimura, Hiroaki  
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    Boccardi, Guillaume  
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    Eneman, Geert  
    Proceedings paper
    2015, IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference - S3S, 4/10/2015, p.1-5
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    An investigation on border traps in III-V MOSFETs with an In0.53Ga0.47As channel

    Ji, Zhigang
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    Zhang, Xiong
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    Franco, Jacopo  
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    Gao, Rui
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    Duan, Meng
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    Zhang, Jian Fu
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    Zhang, Wei Dong
    Journal article
    2015, IEEE Transactions on Electron Devices, (62) 11, p.3633-3639
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    Beyond-Si materials and devices for more Moore and more than Moore applications

    Collaert, Nadine  
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    Alian, AliReza  
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    Arimura, Hiroaki  
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    Boccardi, Guillaume  
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    Eneman, Geert  
    Proceedings paper
    2016, International Conference on IC Design and Technology - ICICDT, 27/06/2016, p.1-5
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    Bias Temperature Instability (BTI) in high-mobility channel devices with high-k dielectric stacks: SiGe, Ge, and InGaAs

    Franco, Jacopo  
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    Kaczer, Ben  
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    Vais, Abhitosh  
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    Alian, AliReza  
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    Arimura, Hiroaki  
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    Putcha, Vamsi  
    Journal article
    2016, MRS Advances, (1) 49, p.3329-3340
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    Bias Temperature Instability (BTI) in high-mobility channel devices: SiGe, Ge, and InGaAs

    Franco, Jacopo  
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    Kaczer, Ben  
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    Vais, Abhitosh  
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    Sioncke, Sonja
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    Arimura, Hiroaki  
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    Putcha, Vamsi  
    Proceedings paper
    2016, Workshop on Dielectrics in Microelectronics - WoDiM, 27/06/2016
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    BTI reliability of high-mobility channel devices: SiGe, Ge and InGaAs

    Franco, Jacopo  
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    Kaczer, Ben  
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    Roussel, Philippe  
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    Cho, Moon Ju
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    Grasser, Tibor
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    Mitard, Jerome  
    Proceedings paper
    2014, IEEE Integrated International Reliability Workshop - IIRW, 12/10/2014
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    Buried Power Rail Integration for CMOS Scaling beyond the 3 nm Node

    Gupta, Anshul  
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    Tao, Zheng  
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    Radisic, Dunja  
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    Mertens, Hans  
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    Varela Pedreira, Olalla  
    Proceedings paper
    2022, Conference on Advanced Etch Technology and Process Integration for Nanopatterning XI Part of SPIE Advanced Lithography and Patterning Conference, APR 24-MAY 27, 2020-2022, p.120560B
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    Buried power rail integration with FinFETs for ultimate CMOS scaling

    Gupta, Anshul  
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    Varela Pedreira, Olalla  
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    Arutchelvan, Goutham  
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    Zahedmanesh, Houman  
    Journal article
    2020, IEEE Transactions on Electron Devices, (67) 12, p.5349-5354
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    Buried Power Rail Integration with Si FinFETs for CMOS Scaling beyond the 5 nm Node

    Gupta, Anshul  
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    Mertens, Hans  
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    Tao, Zheng  
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    Demuynck, Steven  
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    Boemmels, Juergen  
    Proceedings paper
    2020, IEEE Symposium on VLSI Technology and Circuits, JUN 15-19, 2020
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    Characterization of oxide defects in InGaAs MOS gate stacks for high-mobility n-channel MOSFETs

    Franco, Jacopo  
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    Putcha, Vamsi  
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    Vais, Abhitosh  
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    Sioncke, Sonja
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    Waldron, Niamh  
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    Zhou, Daisy  
    Proceedings paper
    2017, IEEE International Electron Devices Meeting - IEDM, 2/12/2017, p.175-178
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    Demonstration of an InGaAs gate stack with sufficient PBTI reliability by thermal budget optimization, nitridation, high-k material choice, and interface dipole

    Franco, Jacopo  
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    Vais, Abhitosh  
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    Sioncke, Sonja
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    Putcha, Vamsi  
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    Kaczer, Ben  
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    Shie, Bo-Shiuan
    Proceedings paper
    2016, IEEE Symposium on VLSI Technology, 13/06/2016, p.42-43
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    Enabling CD SEM metrology for 5nm technology node and beyond

    Lorusso, Gian  
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    Ohashi, Takeyoshi
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    Yamaguchi, Astuko
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    Inoue, Osamu
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    Sutani, Takumichi
    Proceedings paper
    2017, Metrology, Inspection, and Process Control for Microlithography XXXI, 26/02/2017, p.1014512
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    ESD characterization of planar InGaAs devices

    Ji, Zhigang
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    Linten, Dimitri  
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    Boschke, Roman
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    Hellings, Geert  
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    Chen, Shih-Hung  
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    Alian, AliReza  
    Proceedings paper
    2015, IEEE International Reliability Physics Symposium - IRPS, 19/04/2015, p.3f.1
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    FinFETs with Thermally Stable RMG Gate Stack for Future DRAM Peripheral Circuits

    Capogreco, Elena  
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    Arimura, Hiroaki  
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    Ritzenthaler, Romain  
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    Brus, Stephan  
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    Oniki, Yusuke  
    Proceedings paper
    2022, International Electron Devices Meeting (IEDM), DEC 03-07, 2022
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    Gate patterning development for monolithic CFET integration

    Dupuy, Emmanuel  
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    Tao, Zheng  
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    Mertens, Hans  
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    Demuynck, Steven  
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    Hosseini, Maryam  
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    Zhou, Daisy  
    Oral presentation
    2023-02-28, SPIE Advanced Lithography + Patterning 2023
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    Gate-all-around InGaAs nanowire FETs with peak transconductance of 2200 μS/μm at 50nm Lg using a replacement fin RMG flow

    Waldron, Niamh  
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    Sioncke, Sonja
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    Franco, Jacopo  
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    Nyns, Laura  
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    Vais, Abhitosh  
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    Zhou, Daisy  
    Proceedings paper
    2015, IEEE International Electron Devices Meeting - IEDM, 7/12/2015, p.799-802
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    In0.53Ga0.47As quantum-well MOSFET with source-drain regrowth for low power logic applications

    Zhou, Daisy  
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    Alian, AliReza  
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    Mols, Yves  
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    Rooyackers, Rita
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    Lin, Dennis  
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    Ivanov, Tsvetan  
    Proceedings paper
    2014, IEEE International Symposium on VLSI Technology, 9/06/2014, p.208-209
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    Reliability challenges of high mobility channel technologies: SiGe, Ge and InGaAs

    Franco, Jacopo  
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    Kaczer, Ben  
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    Roussel, Philippe  
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    Cho, Moon Ju
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    Grasser, Tibor
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    Arimura, Hiroaki  
    Meeting abstract
    2014, IEEE Semiconductor Interface Specialists Conference - SISC, 10/12/2013
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    Scalability of InGaAs nanowires demonstrating wire width down to 7nm and Lg down to 30nm fabricated on a 300mm Si platform

    Zhou, Daisy  
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    Waldron, Niamh  
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    Boccardi, Guillaume  
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    Sebaai, Farid  
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    Merckling, Clement  
    Proceedings paper
    2016, Symposium on VLSI Technology, 12/06/2016, p.166-167
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    Scaled, novel effective workfunction metal gate stacks for advanced Low-VT, gate-all-around vertically stacked nanosheet FETs with reduced vertical distance between sheets

    Veloso, Anabela  
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    Simoen, Eddy  
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    Oliveira, Alberto
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    Vaisman Chasin, Adrian  
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    Chen, S.-C.
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    Lin, Y.
    Proceedings paper
    2019, 2019 International Conference on Solid State Devices and Materials (SSDM 2019), 2/09/2019, p.559-560
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