Browsing by Author "Zhou, Daisy"
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Publication Advanced channel materials for the semiconductor industry
Proceedings paper2015, IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference - S3S, 4/10/2015, p.1-5Publication An investigation on border traps in III-V MOSFETs with an In0.53Ga0.47As channel
Journal article2015, IEEE Transactions on Electron Devices, (62) 11, p.3633-3639Publication Beyond-Si materials and devices for more Moore and more than Moore applications
Proceedings paper2016, International Conference on IC Design and Technology - ICICDT, 27/06/2016, p.1-5Publication Bias Temperature Instability (BTI) in high-mobility channel devices with high-k dielectric stacks: SiGe, Ge, and InGaAs
Journal article2016, MRS Advances, (1) 49, p.3329-3340Publication Bias Temperature Instability (BTI) in high-mobility channel devices: SiGe, Ge, and InGaAs
Proceedings paper2016, Workshop on Dielectrics in Microelectronics - WoDiM, 27/06/2016Publication BTI reliability of high-mobility channel devices: SiGe, Ge and InGaAs
Proceedings paper2014, IEEE Integrated International Reliability Workshop - IIRW, 12/10/2014Publication Buried Power Rail Integration for CMOS Scaling beyond the 3 nm Node
Proceedings paper2022, Conference on Advanced Etch Technology and Process Integration for Nanopatterning XI Part of SPIE Advanced Lithography and Patterning Conference, APR 24-MAY 27, 2020-2022, p.120560BPublication Buried power rail integration with FinFETs for ultimate CMOS scaling
Journal article2020, IEEE Transactions on Electron Devices, (67) 12, p.5349-5354Publication Buried Power Rail Integration with Si FinFETs for CMOS Scaling beyond the 5 nm Node
Proceedings paper2020, IEEE Symposium on VLSI Technology and Circuits, JUN 15-19, 2020Publication Characterization of oxide defects in InGaAs MOS gate stacks for high-mobility n-channel MOSFETs
Proceedings paper2017, IEEE International Electron Devices Meeting - IEDM, 2/12/2017, p.175-178Publication Demonstration of an InGaAs gate stack with sufficient PBTI reliability by thermal budget optimization, nitridation, high-k material choice, and interface dipole
Proceedings paper2016, IEEE Symposium on VLSI Technology, 13/06/2016, p.42-43Publication Enabling CD SEM metrology for 5nm technology node and beyond
Proceedings paper2017, Metrology, Inspection, and Process Control for Microlithography XXXI, 26/02/2017, p.1014512Publication ESD characterization of planar InGaAs devices
Proceedings paper2015, IEEE International Reliability Physics Symposium - IRPS, 19/04/2015, p.3f.1Publication FinFETs with Thermally Stable RMG Gate Stack for Future DRAM Peripheral Circuits
Proceedings paper2022, International Electron Devices Meeting (IEDM), DEC 03-07, 2022Publication Gate patterning development for monolithic CFET integration
Oral presentation2023-02-28, SPIE Advanced Lithography + Patterning 2023Publication Gate-all-around InGaAs nanowire FETs with peak transconductance of 2200 μS/μm at 50nm Lg using a replacement fin RMG flow
Proceedings paper2015, IEEE International Electron Devices Meeting - IEDM, 7/12/2015, p.799-802Publication In0.53Ga0.47As quantum-well MOSFET with source-drain regrowth for low power logic applications
Proceedings paper2014, IEEE International Symposium on VLSI Technology, 9/06/2014, p.208-209Publication Reliability challenges of high mobility channel technologies: SiGe, Ge and InGaAs
Meeting abstract2014, IEEE Semiconductor Interface Specialists Conference - SISC, 10/12/2013Publication Scalability of InGaAs nanowires demonstrating wire width down to 7nm and Lg down to 30nm fabricated on a 300mm Si platform
Proceedings paper2016, Symposium on VLSI Technology, 12/06/2016, p.166-167Publication Scaled, novel effective workfunction metal gate stacks for advanced Low-VT, gate-all-around vertically stacked nanosheet FETs with reduced vertical distance between sheets
Proceedings paper2019, 2019 International Conference on Solid State Devices and Materials (SSDM 2019), 2/09/2019, p.559-560