Browsing by author "Tutunjyan, Nina"
Now showing items 1-20 of 26
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3D integration technology using W2W direct bonding and TSV
Pham, Nga; Sabuncuoglu Tezcan, Deniz; Jamieson, Geraldine; Tutunjyan, Nina; Peng, Lan; Volkaerts, Danny (2015) -
A highly reliable 1.4μm pitch via-last TSV module for wafer-to-wafer hybrid bonded 3D-SOC systems
Van Huylenbroeck, Stefaan; De Vos, Joeri; El-Mekki, Zaid; Jamieson, Geraldine; Tutunjyan, Nina; Muga, Karthik; Stucchi, Michele; Miller, Andy; Beyer, Gerald; Beyne, Eric (2019) -
A highly reliable 1×5μm via-last TSV module
Van Huylenbroeck, Stefaan; Li, Yunlong; De Vos, Joeri; Jamieson, Geraldine; Tutunjyan, Nina; Miller, Andy; Beyer, Gerald; Beyne, Eric (2018) -
Application of plasma etch processes to gallium arsenide technology
Tutunjyan, Nina; Sakharova, Tania; Kalandadze, Givi; Pavliashvili, Tamaz; Khuchua, Nina (2009) -
Characterization of optical end-point detection for via reveal processing
Rassoul, Nouredine; Jourdain, Anne; Tutunjyan, Nina; De Vos, Joeri; Sardo, Stefano; Piumi, Daniele; Miller, Andy; Beyne, Eric; Walsby, Edward; Ashraf, Huma; Thomas, Dave (2018) -
Dry etch challenges for implantable silicon-based semi-flexible neural probe fabrication
Tutunjyan, Nina; Andrei, Alexandru; Verbinnen, Greet; Slabbekoorn, John; Eberle, Wolfgang; Baier, Ulrich; Boullart, Werner (2011) -
Dry etch solutions for 3D integration technology
Tutunjyan, Nina; Van Cauwenberghe, Marc; Verdonck, Patrick; Majeed, Bivragh; Buisson, Thibault; Civale, Yann; Boullart, Werner (2010) -
Effect of precoat on the sidewall profile of through silicon via's
Babaei Gavan, Khashayar; Lazzarino, Frederic; Brouri, Mohand; Tutunjyan, Nina; de Marneffe, Jean-Francois; Kunnen, Eddy; Xu, Kaidong (2013) -
Etch process modules development and integration in 3D SOC applications
Tutunjyan, Nina; Sardo, Stefano; De Vos, Joeri; Van Huylenbroeck, Stefaan; Jourdain, Anne; Peng, Lan; Inoue, Fumihiro; Rassoul, Nouredine; Beyer, Gerald; Beyne, Eric; Miller, Andy; Piumi, Daniele; Walsby, Edward; Ansell, Oliver; Ashraf, Huma; Thomas, Dave (2017) -
Etch process modules development and integration in 3D-SOC applications
Tutunjyan, Nina; Sardo, Stefano; De Vos, Joeri; Van Huylenbroeck, Stefaan; Jourdain, Anne; Peng, Lan; Inoue, Fumihiro; Rassoul, Nouredine; Beyer, Gerald; Beyne, Eric; Miller, Andy; Piumi, Daniele (2018) -
Fabrication and successful in-vivo implantation of a flexible neural implant with a hybrid polyimide-silicon design
Andrei, Alexandru; Tutunjyan, Nina; Verbinnen, Greet; Van Put, Steven; Krylychkina, Olga; Eberle, Wolfgang; Musa, Silke (2012-09) -
"Hole-in-one TSV", a new via last concept for high density 3DSOC interconnects
De Vos, Joeri; Van Huylenbroeck, Stefaan; Jourdain, Anne; Heylen, Nancy; Peng, Lan; Jamieson, Geraldine; Tutunjyan, Nina; Sardo, Stefano; Miller, Andy; Beyne, Eric (2018) -
Process challenges in 0-level packaging using 100μm thin chip capping with TSV
Pham, Nga; Cherman, Vladimir; Tutunjyan, Nina; Teugels, Lieve; Sabuncuoglu Tezcan, Deniz; Tilmans, Harrie (2012) -
Process integration solution for damage-free bevel for deep Si etch applications
Majeed, Bivragh; Tutunjyan, Nina; Fiorini, Paolo; Sabuncuoglu Tezcan, Deniz (2012) -
RIE dynamics for extreme wafer thinning applications
Rassoul, Nouredine; Jourdain, Anne; Tutunjyan, Nina; De Vos, Joeri; Sardo, Stefano; Inoue, Fumihiro; Piumi, Daniele; Miller, Andy; Beyne, Eric; Walsby, Edward; Jash Patel, Patel; Oliver, Ansell; Huma, Ashraf; Janet, Hopkins; Dave, Thomas (2017) -
Room temperature and zero pressure high quality oxide direct bonding for 3D self-aligned assembly
Dubey, Vikas; Van Huylenbroeck, Stefaan; Tutunjyan, Nina; Slabbekoorn, John; De Wolf, Ingrid; Rebibis, Kenneth June; Miller, Andy; Celis, Jean-Pierre; Croes, Kristof; Beyne, Eric (2014) -
Si fabrication technologies for biomedical applications: DNA separation
Majeed, Bivragh; Zhang, Lei; Tutunjyan, Nina; Sabuncuoglu Tezcan, Deniz; Fiorini, Paolo (2013) -
Si recess etch for 3D stacked IC applications.
Van Cauwenberghe, Marc; Tutunjyan, Nina; Jamieson, Geraldine; Verdonck, Patrick; Huyghebaert, Cedric; Jourdain, Anne; Conard, Thierry; Boullart, Werner; Travaly, Youssef; Swinnen, Bart (2010) -
Silicon based Lab-On-a-Chip system for single-nucleotide-polymorphism: fabrication and characterization
Majeed, Bivragh; Jones, Ben; Sabuncuoglu Tezcan, Deniz; Tutunjyan, Nina; Haspeslagh, Luc; Peeters, Sara; Fiorini, Paolo; Op de Beeck, Maaike; Van Hoof, Chris; Hiraoka, Maki; Tanaka, Hiroyuki; Yamashita, Ichiro (2011) -
Silicon based system for single-nucleotide-polymorphism detection: chip fabrication and thermal characterization of polymerase chain reaction microchamber
Majeed, Bivragh; Jones, Ben; Sabuncuoglu Tezcan, Deniz; Tutunjyan, Nina; Haspeslagh, Luc; Peeters, Sara; Fiorini, Paolo; Op de Beeck, Maaike; Van Hoof, Chris; Hiraoka, Maki; Tanaka, Hiroyuki; Yamashita, Ichiro (2012)