Browsing by author "Hendrickx, Dirk"
Now showing items 1-20 of 23
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CMOS 32nm technology node: business as usual for interconnect damascene patterning?
Beyer, Gerald; Ciofi, Ivan; Van Olmen, Jan; Carbonell, Laure; Versluijs, Janko; Wiaux, Vincent; Op de Beeck, Maaike; Maenhoudt, Mireille; Struyf, Herbert; Hendrickx, Dirk; de Marneffe, Jean-Francois; Vereecke, Guy; Claes, Martine; Bearda, Twan; Volders, Henny; Heylen, Nancy; Travaly, Youssef; Stucchi, Michele; Tokei, Zsolt; Cartuyvels, Rudi (2008-12) -
Development of a new post-etch photoresist stripper for copper BEOL process
Du, Bing; Kneer, Emil; Townsend, P.H.; Le, Quoc Toan; Hendrickx, Dirk; Vereecke, Guy (2007) -
How much rear side polishing is required? A study on the impact of rear side polishing in PERC solar cells
Cornagliotti, Emanuele; Uruena De Castro, Angel; Horzel, Jörg; John, Joachim; Tous, Loic; Hendrickx, Dirk; Prajapati, Victor; Singh, Sukhvinder; Hoyer, Ronald; Delahaye, Franck; Weise, K.; Queisser, D.; Nussbaumer, H.; Poortmans, Jef (2012) -
Implementation of Ru based barriers in 50 nm half pitch single damascene Cu/SiCOH (k=2.5) structures
Carbonell, Laure; Volders, Henny; Heylen, Nancy; Kellens, Kristof; Tokei, Zsolt; Hendrickx, Dirk; Struyf, Herbert; Vandervorst, Alain; Claes, Martine; Lux, Marcel; Versluijs, Janko; Alaerts, Wilfried; Van Besien, Els; Deweerdt, Bruno; Vaes, Jan; Caluwaerts, Rudy; Cockburn, Andrew; Gravey, Virginie; Shah, Kavita; Al-Bayati, A.; Fu, X.; Lubben, D.; Sundarrajan, A.; Beyer, Gerald (2008) -
Implementation of Ru based barriers in 50 nm half pitch single damascene Cu/SiCOH (k=2.5) structures
Carbonell, Laure; Volders, Henny; Heylen, Nancy; Kellens, Kristof; Tokei, Zsolt; Hendrickx, Dirk; Struyf, Herbert; Claes, Martine; Versluijs, Janko; Van Besien, Els; Caluwaerts, Rudy; Cockburn, Andrew; Gravey, Virginie; Shah, Kavita; Al-Bayati, Amir; Fu, X.; Lubben, D.; Sundarrajan, A.; Beyer, Gerald (2009) -
Integration of 50 nm half pitch single damascene copper trenches in BDII by means of double patterning 193 nm immersion lithography on metal hardmask
Van Olmen, Jan; Al-Bayati, A; Beyer, Gerald; Boelen, Pieter; Carbonell, Laure; Zhao, Chao; Ciofi, Ivan; Claes, Martine; Cockburn, Andrew; Druais, Gael; Hendrickx, Dirk; Heylen, Nancy; Kesters, Els; Lytle, S.; Noori, A.; Op de Beeck, Maaike; Struyf, Herbert; Tokei, Zsolt; Versluijs, Janko (2007) -
Integration of inline single-side wet emitteretch in PERC cell manufacturing
Cornagliotti, Emanuele; Ngamo, Michel; Tous, Loic; Russell, Richard; Horzel, Jörg; Hendrickx, Dirk; Douhard, Bastien; Prajapati, Victor; Janssens, Tom; Poortmans, Jef (2012) -
Low damage etch approach of a new porous SiOC(H) Low-k dielectric
Van Aelst, Joke; Struyf, Herbert; Dupont, Tania; Hendrickx, Dirk; Travaly, Youssef; Boullart, Werner; Vanhaelemeersch, Serge (2005) -
Low-damage damascene patterning of SiOC(H) low-k dielectrics
Struyf, Herbert; Hendrickx, Dirk; Van Olmen, Jan; Iacopi, Francesca; Richard, Olivier; Travaly, Youssef; Van Hove, Marleen; Boullart, Werner; Vanhaelemeersch, Serge (2005-06) -
Manufacturability issues with double patterning for 50-nm half-pitch single damascene applications, using RELACS shrink and corresponding OPC
Op de Beeck, Maaike; Versluijs, Janko; Wiaux, Vincent; Vandeweyer, Tom; Ciofi, Ivan; Struyf, Herbert; Hendrickx, Dirk; Van Olmen, Jan (2007) -
Metal hard-mask based double patterning for 22nm and beyond
Struyf, Herbert; de Marneffe, Jean-Francois; Goossens, Danny; Hendrickx, Dirk; Huffman, Craig; Kunnen, Eddy; Lazzarino, Frederic; Milenin, Alexey; Shamiryan, Denis; Urbanowicz, Adam; Vandervorst, Alain; Boullart, Werner (2010) -
On the origin of grass formation in MHM-based single-damascene low-k etch
de Marneffe, Jean-Francois; Goossens, Danny; Conard, Thierry; Hendrickx, Dirk; Struyf, Herbert; Boullart, Werner (2009) -
Profile control for low-k patterning using TaN and TiN metallic hardmasks
Struyf, Herbert; Hendrickx, Dirk; Paraschiv, Vasile; Campos Garcia, Diana; Mannaert, Geert; Boullart, Werner; Vanhaelemeersch, Serge (2007) -
Residue formation in MHM-based low-k etch
Goossens, Danny; de Marneffe, Jean-Francois; Conard, Thierry; Hendrickx, Dirk; Struyf, Herbert; Boullart, Werner (2008) -
Resist rework on metal hardmask in a Low-plasma damage patterning approach
Struyf, Herbert; Hendrickx, Dirk; Mannaert, Geert; Boullart, Werner; Vanhaelemeersch, Serge (2005-12) -
Resist strip and Cu diffusion barrier etch in Cu BEOL integration schemes in a Mattson Highlands chamber
Mannaert, Geert; Van Cauwenberghe, M.; Schmidt, Michael; Van Aelst, Joke; Hendrickx, Dirk; Stucchi, Michele; Conard, Thierry; Vanhaelemeersch, Serge; Boullart, Werner (2002) -
Resist strip and Cu diffusion barrier etch in Cu BEOL integration schemes in a Mattson HighlandsTM chamber
Mannaert, Geert; Van Cauwenberghe, Marc; Schmidt, M.O.; Van Aelst, Joke; Hendrickx, Dirk; Stucchi, Michele; Conard, Thierry; Vanhaelemeersch, Serge; Boullart, Werner (2003) -
Simultaneous fabrication of n & p contacts for bi-facial cells by a novel co-plating process
Russell, Richard; Tous, Loic; Cornagliotti, Emanuele; Hendrickx, Dirk; Duerinckx, Filip; Szlufcik, Jozef (2017) -
The impact of ash on TDDB of metal-hard-mask-etched Cu/low-k interconnects
Pantouvaki, Marianna; Struyf, Herbert; Hendrickx, Dirk; Heylen, Nancy; Richard, Olivier; Beyer, Gerald (2008) -
The impact of ash on TDDB of metal-hard-mask-etched Cu/low-k interconnects
Pantouvaki, Marianna; Struyf, Herbert; Hendrickx, Dirk; Heylen, Nancy; Richard, Olivier; Beyer, Gerald (2009)