Browsing by author "Lanckmans, Filip"
Now showing items 1-20 of 27
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A comparative study of copper drift diffusion in plasma deposited a-SiC : H and Silicon Nitride
Lanckmans, Filip; Gray, William; Brijs, Bert; Maex, Karen (2001) -
A comparative study of copper drift diffusion in plasma deposited A-Sic:H and silicon nitride
Lanckmans, Filip; Gray, William; Brijs, Bert; Maex, Karen (2000) -
A modified capacitance / voltage technique to characterize copper drift diffusion in organic low-K dielectrics
Lanckmans, Filip; Geenen, Luc; Vandervorst, Wilfried; Maex, Karen (2000) -
A modified capacitance/voltage technique to characterize copper drift diffusion in organic low-K dielectrics
Lanckmans, Filip; Geenen, Luc; Vandervorst, Wilfried; Maex, Karen (1999) -
A quantitative adhesion study between contacting materials in Cu damascene structures
Lanckmans, Filip; Brongersma, Sywert; Varga, Istvan; Poortmans, Jef; Bender, Hugo; Conard, Thierry; Maex, Karen (2002) -
A quantitative study of the adhesion between copper, barrier and organic low-k polymers
Lanckmans, Filip; Brongersma, Sywert; Varga, Istvan; Beyne, Eric; Maex, Karen (2000) -
A quantitative study of the adhesion between copper, barrier and organic low-k polymers
Lanckmans, Filip; Brongersma, Sywert; Varga, Istvan; Bender, Hugo; Beyne, Eric; Maex, Karen (2001) -
Adhesion study between materials for integration of copper and inorganic low-k dielectrics
Lanckmans, Filip; Brongersma, Sywert; Poortmans, Jef; Conard, Thierry; Bender, Hugo; Beyne, Eric; Maex, Karen (2001) -
Advanced solutions for copper and low k technology
Beyer, Gerald; Baklanov, Mikhaïl; Brongersma, Sywert; De Roest, David; Donaton, R.; Grillaert, Joost; Lanckmans, Filip; Maenhoudt, Mireille; Maex, Karen; Richard, Emmanuel; Struyf, Herbert; Stucchi, Michele; Tokei, Zsolt; Van Hove, Marleen; Vervoort, Iwan (2000) -
Barriers for Cu/low k damascene structures
Maex, Karen; Tokei, Zsolt; Satta, Alessandra; Lanckmans, Filip; Wu, Wen; Iacopi, Francesca (2001) -
Characterisation of plasma etch related residues formed on top of ECD Cu
Baklanov, Mikhaïl; Conard, Thierry; Lanckmans, Filip; Vanhaelemeersch, Serge; Holmes, D.; Maex, Karen (1999) -
Characterisation of plasma etch releted residues formed on top of ECD Cu films
Baklanov, Mikhaïl; Conard, Thierry; Lanckmans, Filip; Vanhaelemeersch, Serge; Holmes, D.; Maex, Karen (2000) -
Characterization and barrier properties for Cu metallization of tungsten nitride deposited by PECVD using WF6 +N2 +H2
Li, Hua; Heyvaert, Ilse; Sing, Jin; Lanckmans, Filip; Brijs, Bert; Bender, Hugo; Maex, Karen; Froyen, L. (1999) -
Characterization and barrier properties for Cu metallization of tungsten nitride deposited by PECVD using WF6+N2+H2
Li, H.; Heyvaert, Ilse; Jin, S.; Lanckmans, Filip; Bender, Hugo; Maex, Karen; Froyen, L. (1998) -
Characterization of WF6/N2/H2 plasma enhanced chemical vapor deposited WxN films as barriers for Cu metallization
Li, Hua; Jin, S.; Bender, Hugo; Lanckmans, Filip; Heyvaert, Ilse; Maex, Karen; Froyen, L. (2000) -
Diffusion and adhesion issues of low permittivity dielectrics with copper for high performance interconnects
Lanckmans, Filip (2002-03) -
Diffusion barrier integrity and electrical performance of Cu/porous dielectric damascene lines
Iacopi, Francesca; Tokei, Zsolt; Stucchi, Michele; Lanckmans, Filip; Maex, Karen (2003) -
EFTEM analysis of the interaction of CO with a fluorinated organic dielectric
Hens, S.; Van Landuyt, J.; Bender, Hugo; Lanckmans, Filip; Maex, Karen (2000) -
Material characteristics and damascene patterning of a fluoropolymer low-k film
Struyf, Herbert; Donaton, R. A.; Lepage, Muriel; Lanckmans, Filip; Vereecke, Guy; Maex, Karen; Vanhaelemeersch, Serge; Scheid, D. (2000) -
Post dry-etch cleaning issues of an organic low-K dielectric
Lanckmans, Filip; Baklanov, Mikhaïl; Alaerts, Carine; Vanhaelemeersch, Serge; Maex, Karen (1998)