Browsing by author "Van Olmen, Jan"

3D stacked IC demonstration using a through silicon via first approach

Van Olmen, Jan; Mercha, Abdelkarim; Katti, Guruprasad; Huyghebaert, Cedric; Van Aelst, Joke; Seppala, Emma; Zhao, Chao; Armini, Silvia; Vaes, Jan; Cotrin Teixeira, Ricardo; Van Cauwenberghe, Marc; Verdonck, Patrick; Verhemeldonck, Koen; Jourdain, Anne; Ruythooren, Wouter; de Potter de ten Broeck, Muriel; Opdebeeck, Ann; Chiarella, Thomas; Parvais, Bertrand; Debusschere, Ingrid; Hoffmann, Thomas Y.; De Wachter, Bart; Dehaene, Wim; Stucchi, Michele; Rakowski, Michal; Soussan, Philippe; Cartuyvels, Rudi; Beyne, Eric; Biesemans, Serge; Swinnen, Bart (2008)

3D stacked IC demonstrator using hybrid collective die-to-wafer bonding with copper through silicon vias (TSV)

Van Olmen, Jan; Coenen, Jens; Dehaene, Wim; De Meyer, Kristin; Huyghebaert, Cedric; Jourdain, Anne; Katti, Guruprasad; Mercha, Abdelkarim; Rakowski, Michal; Stucchi, Michele; Travaly, Youssef; Beyne, Eric; Swinnen, Bart (2009)

3D stacked ICs using Cu TSVs and die to wafer hybrid collective bonding

Katti, Guruprasad; Mercha, Abdelkarim; Van Olmen, Jan; Huyghebaert, Cedric; Jourdain, Anne; Stucchi, Michele; Rakowski, Michal; Debusschere, Ingrid; Soussan, Philippe; Dehaene, Wim; De Meyer, Kristin; Travaly, Youssef; Beyne, Eric; Biesemans, Serge; Swinnen, Bart (2009)

A 0.314mm2 6T-SRAM cell built with tall triple-gate devices for 45nm node applications using 0.75NA 193nm lithography

Nackaerts, Axel; Ercken, Monique; Demuynck, Steven; Lauwers, Anne; Baerts, Christina; Bender, Hugo; Boullart, Werner; Collaert, Nadine; Degroote, Bart; Delvaux, Christie; de Marneffe, Jean-Francois; Dixit, Abhisek; De Meyer, Kristin; Hendrickx, Eric; Heylen, Nancy; Jaenen, Patrick; Laidler, David; Locorotondo, Sabrina; Maenhoudt, Mireille; Moelants, Myriam; Pollentier, Ivan; Ronse, Kurt; Rooyackers, Rita; Van Aelst, Joke; Vandenberghe, Geert; Vandervorst, Wilfried; Vandeweyer, Tom; Vanhaelemeersch, Serge; Van Hove, Marleen; Van Olmen, Jan; Verhaegen, Staf; Versluijs, Janko; Vrancken, Christa; Wiaux, Vincent; Jurczak, Gosia; Biesemans, Serge (2004-12)

A 7-band CCD-in-CMOS multispectral TDI imager

San Segundo Bello, David; De Bock, Maarten; Boulenc, Pierre; Vandebriel, Roeland; Wu, Linkun; Van Olmen, Jan; Malandruccolo, Vezio; Craninckx, Jan; Haspeslagh, Luc; Guerrieri, Stefano; Rosmeulen, Maarten; Borremans, Jonathan (2017)

A platform for European CMOS image sensors for space applications

Minoglou, Kiki; San Segundo Bello, David; Sabuncuoglu Tezcan, Deniz; Haspeslagh, Luc; Van Olmen, Jan; Merry, Billy; Cavaco, Celso; Mazzamuto, Fulvio; Toqué-Trésonne, I.; Moirin, Rene; Brouwer, Martijn; Toccafondi, Marco; Preti, Giampaolo; Rosmeulen, Maarten; De Moor, Piet (2014)

Advanced technologies for in-line and post-processed TSV integration

Beyne, Eric; Swinnen, Bart; Van Olmen, Jan; Sabuncuoglu Tezcan, Deniz (2009)

CMOS 32nm technology node: business as usual for interconnect damascene patterning?

Beyer, Gerald; Ciofi, Ivan; Van Olmen, Jan; Carbonell, Laure; Versluijs, Janko; Wiaux, Vincent; Op de Beeck, Maaike; Maenhoudt, Mireille; Struyf, Herbert; Hendrickx, Dirk; de Marneffe, Jean-Francois; Vereecke, Guy; Claes, Martine; Bearda, Twan; Volders, Henny; Heylen, Nancy; Travaly, Youssef; Stucchi, Michele; Tokei, Zsolt; Cartuyvels, Rudi (2008-12)

CMP processing to enable 3D stacked IC integration

Vaes, Jan; Heylen, Nancy; Van Olmen, Jan; Huyghebaert, Cedric; Leunissen, Peter (2009)

Comprehensive analysis of the impact of single and arrays of through silicon vias induced stress on high-k / metal gate CMOS performances

Mercha, Abdelkarim; Van der Plas, Geert; Moroz, V.; De Wolf, Ingrid; Asimakopoulos, Panagiotis; Minas, Nikolaos; Domae, Shinichi; Perry, Dan; Choi, M.; Redolfi, Augusto; Okoro, Chukwudi; Yang, Yu; Van Olmen, Jan; Thangaraju, Sarasvathi; Sabuncuoglu Tezcan, Deniz; Soussan, Philippe; Cho, Jong Hoon; Yakovlev, A.; Marchal, Pol; Travaly, Youssef; Beyne, Eric; Biesemans, Serge; Swinnen, Bart (2010)

Cu resistivity scaling limits for 20 nm copper damascene lines

Van Olmen, Jan; List, Scott; Tokei, Zsolt; Carbonell, Laure; Brongersma, Sywert; Volders, Henny; Kunnen, Eddy; Heylen, Nancy; Ciofi, Ivan; Khandelwal, A.; Gelatos, J.; Mandrekar, T.; Boelen, Pieter (2007)

Cu to Cu interconnect using 3D-TSV and wafer to wafer thermo-compression bonding

Huyghebaert, Cedric; Van Olmen, Jan; Civale, Yann; Phommahaxay, Alain; Jourdain, Anne; Sood, Sumant; Farrens, Shari; Soussan, Philippe (2010)

Design issues and cosiderations for low-cost 3D TSV IC technology

Van der Plas, Geert; Limaye, Paresh; Mercha, Abdelkarim; Oprins, Herman; Torregiani, Cristina; Thijs, Steven; Linten, Dimitri; Stucchi, Michele; Guruprasad, Katti; Velenis, Dimitrios; Shinichi, Domae; Cherman, Vladimir; Vandevelde, Bart; Simons, Veerle; De Wolf, Ingrid; Labie, Riet; Perry, Dan; Bronckers, Stephane; Minas, Nikolaos; Cupak, Miroslav; Ruythooren, Wouter; Van Olmen, Jan; Phommahaxay, Alain; de Potter de ten Broeck, Muriel; Opdebeeck, Ann; Rakowski, Michal; De Wachter, Bart; Dehan, Morin; Nelis, Marc; Agarwal, Rahul; Dehaene, Wim; Travaly, Youssef; Marchal, Pol; Beyne, Eric (2010)

Double patternig scheme for sub-0.25 k1 single damascene structures at NA=0.75, l=193nm

Maenhoudt, Mireille; Versluijs, Janko; Struyf, Herbert; Van Olmen, Jan; Van Hove, Marleen (2005)

Efficient cleaning of low-k materials using single-wafer cleaning solution: a compatibility study and electrical characterization

Le, Quoc Toan; Van Olmen, Jan; Vanderheyden, Rudi; Kesters, Els; Kenis, Karine; Conard, Thierry; Boullart, Werner; Baklanov, Mikhaïl; Vanhaelemeersch, Serge (2005)