Browsing by author "Soussan, Philippe"
Now showing items 1-20 of 127
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24GHz LNA in 90nm RF-CMOS with high-Q above-IC inductors
Dupuis, Olivier; Sun, Xiao; Carchon, Geert; Soussan, Philippe; Ferndahl, Mattias; Decoutere, Stefaan; De Raedt, Walter (2005-09) -
2D micro-chamber for DC plasma working at low power
Rochus, Veronique; Samara, Vladimir; Vereecke, Bart; Soussan, Philippe; Onsia, Bart; Rottenberg, Xavier (2014) -
3D
Zhang, Wenqi; Limaye, Paresh; La Manna, Antonio; Beyne, Eric; Soussan, Philippe (2011) -
3D Embedding and interconnection of ultra thin (<20um) silicon dies
Iker, Francois; Sabuncuoglu Tezcan, Deniz; Cotrin Teixeira, Ricardo; Soussan, Philippe; De Moor, Piet; Beyne, Eric; Baert, Kris (2007) -
3D heterogeneous integration techniques for wireless devices
De Raedt, Walter; Brebels, Steven; Soussan, Philippe; Beyne, Eric (2010) -
3D integration technology developments at IMEC
De Moor, Piet; Ruythooren, Wouter; Soussan, Philippe; Baert, Kris; Van Hoof, Chris; Swinnen, Bart; Beyne, Eric (2007-11) -
3D stacked IC demonstration using a through silicon via first approach
Van Olmen, Jan; Mercha, Abdelkarim; Katti, Guruprasad; Huyghebaert, Cedric; Van Aelst, Joke; Seppala, Emma; Zhao, Chao; Armini, Silvia; Vaes, Jan; Cotrin Teixeira, Ricardo; Van Cauwenberghe, Marc; Verdonck, Patrick; Verhemeldonck, Koen; Jourdain, Anne; Ruythooren, Wouter; de Potter de ten Broeck, Muriel; Opdebeeck, Ann; Chiarella, Thomas; Parvais, Bertrand; Debusschere, Ingrid; Hoffmann, Thomas Y.; De Wachter, Bart; Dehaene, Wim; Stucchi, Michele; Rakowski, Michal; Soussan, Philippe; Cartuyvels, Rudi; Beyne, Eric; Biesemans, Serge; Swinnen, Bart (2008) -
3D stacked ICs using Cu TSVs and die to wafer hybrid collective bonding
Katti, Guruprasad; Mercha, Abdelkarim; Van Olmen, Jan; Huyghebaert, Cedric; Jourdain, Anne; Stucchi, Michele; Rakowski, Michal; Debusschere, Ingrid; Soussan, Philippe; Dehaene, Wim; De Meyer, Kristin; Travaly, Youssef; Beyne, Eric; Biesemans, Serge; Swinnen, Bart (2009) -
3D Wafer level packaging: processes and materials for through silicon-vias and thin die embedding
Soussan, Philippe; Sabuncuoglu Tezcan, Deniz; Iker, Francois; Ruythooren, Wouter; Swinnen, Bart; Majeed, Bivragh; Beyne, Eric (2009) -
3D wafer-level packaging die stacking using spin-on-dielectric polymer liner through-silicon vias
Civale, Yann; Sabuncuoglu Tezcan, Deniz; Philipsen, Harold; Duval, Fabrice; Jaenen, Patrick; Travaly, Youssef; Soussan, Philippe; Swinnen, Bart; Beyne, Eric (2011) -
A 300mm CMOS-compatible PECVD silicon nitride platform for integrated photonics with low loss and low process induced phase variation
Seema Saseendran, Sandeep; Kongnyuy, Tangla David; Figeys, Bruno; Marinins, Aleksandrs; Jansen, Roelof; Rottenberg, Xavier; Sabuncuoglu Tezcan, Deniz; Soussan, Philippe (2019) -
A CMOS-compatible, integrated approach to hyper- and multispectral imaging
Lambrechts, Andy; Gonzalez, Pilar; Geelen, Bert; Soussan, Philippe; Tack, Klaas; Jayapala, Murali (2014) -
A compact, high-speed and low-cost hyperspectral imager
Tack, Klaas; Lambrechts, Andy; Soussan, Philippe; Haspeslagh, Luc; Pessolano, Francesco (2012) -
A low cost 90nm RF-CMOS platform for record RF circuit performance
Jeamsaksiri, Wutthinan; Linten, Dimitri; Thijs, Steven; Carchon, Geert; Ramos, Javier; Mercha, Abdelkarim; Sun, Xiao; Soussan, Philippe; Dehan, Morin; Chiarella, Thomas; Venegas, Rafael; Subramanian, Vaidy; Scholten, A.; Wambacq, Piet; Velghe, Rudolf; Mannaert, Geert; Heylen, Nancy; Verbeeck, Rita; Boullart, Werner; Heyvaert, Ilse; Mahadeva Iyer, Natarajan; Groeseneken, Guido; Debusschere, Ingrid; Biesemans, Serge; Decoutere, Stefaan (2005-06) -
A new scaled through Si via with polymer fill for 3D wafer level packaging
Sabuncuoglu Tezcan, Deniz; Duval, Fabrice; Luhn, Ole; Soussan, Philippe; Swinnen, Bart (2008) -
A reliable and compact polymer-based package for capacitive RF-MEMS switches
Oya, Y.; Okubora, A.; van Spengen, Merlijn; Soussan, Philippe; Stoukatch, Serguei; Rottenberg, Xavier; Ratchev, Petar; Tilmans, Harrie; De Raedt, Walter; Beyne, Eric; De Moor, Piet; De Wolf, Ingrid; Baert, Kris (2004-12) -
A surface micromachined tunable film bulk acoustic resonator
Pan, Wanling; Soussan, Philippe; Nauwelaers, Bart; Tilmans, Harrie (2004) -
A surface micromachined tunable film bulk acoustic resonator
Pan, Wanling; Soussan, Philippe; Nauwelaers, Bart; Tilmans, Harrie (2004) -
Advantage of in-situ over ex-situ techniques as reliability tool: aging kinetics of IMEC's MCM-D discrete passives devices
Soussan, Philippe; Lekens, Geert; Dreesen, R.; De Ceuninck, Ward; Beyne, Eric (2003) -
All-Silicon Photodetectors for Photonic Integrated Circuit Calibration
Dwivedi, Sarvagya Paavan; Kjellman, Jon; Kongnyuy, Tangla David; Prost, Mathias; Syshchyk, Olga; Van Sieleghem, Edward; Lee, Jiwon; Marinins, Aleksandrs; Soussan, Philippe; Dahlem, Marcus; Rottenberg, Xavier; Jansen, Roelof (2021)