Browsing by author "Decoster, Stefan"
Now showing items 1-20 of 38
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21 nm Pitch dual-damascene BEOL process integration with full barrierless Ru metallization
Vega Gonzalez, Victor; Wilson, Chris; Paolillo, Sara; Decoster, Stefan; Mao, Ming; Versluijs, Janko; Blanco, Victor; Kesters, Els; Le, Quoc Toan; Lorant, Christophe; Varela Pedreira, Olalla; Lesniewska, Alicja; Heylen, Nancy; El-Mekki, Zaid; van der Veen, Marleen; Webers, Tomas; Vats, Hemant; Rynders, Luc; Cupak, Miroslav; Lee, Jae Uk; Drissi, Youssef; Halipre, Luc; Charley, Anne-Laure; Verdonck, Patrick; Witters, Thomas; Van Gompel, Sander; Kimura, Yosuke; Jourdan, Nicolas; Ciofi, Ivan; Contino, Antonino; Boccardi, Guillaume; Lariviere, Stephane; De Wachter, Bart; Vancoille, Eric; Lazzarino, Frederic; Ercken, Monique; Kim, Ryan Ryoung han; Trivkovic, Darko; Croes, Kristof; Leray, Philippe; Pardons, Katrien; Barla, Kathy; Tokei, Zsolt (2019) -
Characterization of patterned porous dielectrics after plasma patterning and subsequent wet processing
Le, Quoc Toan; Kesters, Els; Decoster, Stefan; Chan, BT; Holsteyns, Frank; De Gendt, Stefan (2015) -
Characterization of patterned porous low-k dielectrics: surface sealing and residue removal by wet processing/cleaning
Le, Quoc Toan; Kesters, Els; Decoster, Stefan; Chan, BT; Nguyen, Mai Phuong; Conard, Thierry; Vanleenhove, Anja; Holsteyns, Frank; De Gendt, Stefan (2016) -
Cryogenic etching vs P4 approaches: paths towards ultra-low damage integration of mesoporous oxide dielectric materials
de Marneffe, Jean-Francois; Zhang, Liping; Heyne, Markus; Krishtab, Mikhail; Goodyear, Andy; Cooke, Mike; Heylen, Nancy; Ciofi, Ivan; Wen, Liang Gong; Wilson, Chris; Rutigliani, Vito; Decoster, Stefan; Savage, Travis; Matsunaga, Koichi; Nafus, Kathleen; Boemmels, Juergen; Tokei, Zsolt; Baklanov, Mikhaïl (2014) -
Damascene benchmark of Ru, Co and Cu in scaled dimensions
van der Veen, Marleen; Heylen, Nancy; Varela Pedreira, Olalla; Ciofi, Ivan; Decoster, Stefan; Vega Gonzalez, Victor; Jourdan, Nicolas; Struyf, Herbert; Croes, Kristof; Wilson, Chris; Tokei, Zsolt (2018) -
Development of a Cu and W compatible PERR clean in BEOL advanced interconnect patterning
Kesters, Els; Le, Quoc Toan; Decoster, Stefan; Vega Gonzalez, Victor; Holsteyns, Frank; De Gendt, Stefan (2015) -
Economics of semiconductor scaling – a cost analysis for advanced technology node
Mallik, Arindam; Ryckaert, Julien; Kim, Ryan Ryoung han; Debacker, Peter; Decoster, Stefan; Lazzarino, Frederic; Ritzenthaler, Romain; Horiguchi, Naoto; Verkest, Diederik; Mocuta, Anda (2019) -
Electrical comparison of iN7 EUV hybrid and EUV single patterning BEOL metal layers
Lariviere, Stephane; Wilson, Chris; Kutrzeba Kotowska, Bogumila; Versluijs, Janko; Decoster, Stefan; Mao, Ming; van der Veen, Marleen; Jourdan, Nicolas; El-Mekki, Zaid; Heylen, Nancy; Kesters, Els; Verdonck, Patrick; Beral, Christophe; Van Den Heuvel, Dieter; De Bisschop, Peter; Bekaert, Joost; Blanco, Victor; Ciofi, Ivan; Wan, Danny; Briggs, Basoene; Mallik, Arindam; Hendrickx, Eric; Kim, Ryan Ryoung han; McIntyre, Greg; Ronse, Kurt; Boemmels, Juergen; Tokei, Zsolt; Mocuta, Dan (2018) -
Exploration of a low-temperature PEALD technology to trim and smooth 193i photoresist
Lazzarino, Frederic; Paolillo, Sara; Antony, Peter; De Roest, David; Seong, TaeGeun; Wu, Yizhi; Decoster, Stefan; Rutigliani, Vito; Lorusso, Gian; Constantoudis, Vassilios; Van Elshocht, Sven; Piumi, Daniele; Barla, Kathy (2017) -
Exploration of BEOL line-space patterning options at 12nm half-pitch and below
Decoster, Stefan; Lazzarino, Frederic; Petersen Barbosa Lima, Lucas; Li, Waikin; Versluijs, Janko; Halder, Sandip; Mallik, Arindam; Murdoch, Gayle (2018) -
Exploration of EUV-based self-aligned multipatterning (SAMP) options targeting pitches below 20 nm
Decoster, Stefan; Lazzarino, Frederic; Vangoidsenhoven, Diziana; Blanco, Victor; Tamaddon, Amir-Hossein; Kesters, Els; Lorant, Christophe (2019) -
Extreme contact shrink for back end of line connectivity
Schleicher, Filip; Paolillo, Sara; Decoster, Stefan; Wu, Chen; Vega Gonzalez, Victor; Hasan, Mahmudul; Beral, Christophe; Lazzarino, Frederic (2022-05-10) -
First demonstration of Two Metal Level Semi-damascene Interconnects with Fully Self-aligned Vias at 18MP
Murdoch, Gayle; O'Toole, Martin; Marti, Giulio; Pokhrel, Ankit; Tsvetanova, Diana; Decoster, Stefan; Kundu, Souvik; Oniki, Yusuke; Thiam, Arame; Le, Quoc Toan; Varela Pedreira, Olalla; Lesniewska, Alicja; Martinez Alanis, Gerardo Tadeo; Park, Seongho; Tokei, Zsolt (2022-06-15) -
High-Density Patterning of InGaZnO by CH4: a Comparative Study of RIE and Pulsed Plasma ALE
Kundu, Shreya; Decoster, Stefan; Bezard, Philippe; Nalin Mehta, Ankit; Dekkers, Harold; Lazzarino, Frederic (2022-07-19) -
Hybrid Metallization with Cu in sub 30nm Interconnects
van der Veen, Marleen; Soethoudt, Job; Delabie, Annelies; Varela Pedreira, Olalla; Vega Gonzalez, Victor; Lariviere, Stephane; Teugels, Lieve; Jourdan, Nicolas; Decoster, Stefan; Struyf, Herbert; Wilson, Chris; Croes, Kristof; Tokei, Zsolt (2020) -
Improving uniformity of 3-level High Aspect Ratio Supervias
Montero Alvarez, Daniel; Marien, Philippe; Hermans, Yannick; Vega Gonzalez, Victor; Feurprier, Y.; Oikawa, N.; Buccheri, Nunzio; Wu, Chen; Martinez Alanis, Gerardo Tadeo; Batuk, Dmitry; Puliyalil, Harinarayanan; Decoster, Stefan; Kumar, K.; Lazzarino, Frederic; Murdoch, Gayle; Park, Seongho; Tokei, Zsolt (2023) -
Inflection points in interconnect research and trends for 2nm and beyond in order to solve the RC bottleneck
Tokei, Zsolt; Vega Gonzalez, Victor; Murdoch, Gayle; O'Toole, Martin; Croes, Kristof; Baert, Rogier; van der Veen, Marleen; Adelmann, Christoph; Soulie, Jean-Philippe; Boemmels, Juergen; Wilson, Chris; Park, Seongho; Sankaran, Kiroubanand; Pourtois, Geoffrey; Swerts, Johan; Paolillo, Sara; Decoster, Stefan; Mao, Ming; Lazzarino, Frederic; Versluijs, Janko; Blanco, Victor; Ercken, Monique; Kesters, Els; Le, Quoc Toan; Holsteyns, Frank; Heylen, Nancy; Teugels, Lieve; Devriendt, Katia; Struyf, Herbert; Morin, Pierre; Jourdan, Nicolas; Van Elshocht, Sven; Ciofi, Ivan; Gupta, Anshul; Zahedmanesh, Houman; Vanstreels, Kris; Na, Myung Hee (2020) -
Integrating 8nm Self-Aligned Tip-to-Tip to Enable 4-track Standard Cell Architecture as Scaling Booster
Marien, Philippe; Vega Gonzalez, Victor; Choudhury, Subhobroto; Radisic, Dunja; Decoster, Stefan; Kundu, Shreya; Hermans, Yannick; Kenens, Bart; De Coster, Hanne; Altamirano Sanchez, Efrain; Peter, Antony; Sepulveda Marquez, Alfonso; Jourdan, Nicolas; Batuk, Dmitry; Ryckaert, Julien; Murdoch, Gayle; Park, Seongho; Tokei, Zsolt (2023) -
Integration of wet cleaning in 45 nm pitch BEOL processing
Kesters, Els; Le, Quoc Toan; Lazzarino, Frederic; Decoster, Stefan; Wilson, Chris; Holsteyns, Frank; De Gendt, Stefan (2013) -
Linewidth and roughness measurement of SAOP by using FIB and planer-TEM as reference metrology
Takamasu, Kiyoshi; Takahashi, Satoru; Kawada, Hiroki; Ikota, Masami; Decoster, Stefan; Lazzarino, Frederic; Lorusso, Gian (2019)