Browsing by author "De Schepper, Peter"
Now showing items 1-20 of 32
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Ar and H2 plasma and neutral/ion beam treatment of EUV resist
De Schepper, Peter; Marinov, Daniil; El Otell, Ziad; Altamirano Sanchez, Efrain; de Marneffe, Jean-Francois; De Gendt, Stefan; Braithwaite, Nicholas St. J. (2015-03) -
Challenges for smoothing EUV photoresist line-width-roughness: plasma treatment from 40 to 22 nm half pitches
Altamirano Sanchez, Efrain; De Schepper, Peter; Hansen, Terje; Boullart, Werner (2013) -
Characterizing and modeling electrical response to light for metal based EUV photoresists
Vaglio Pret, Alessandro; Kocsis, Michael; De Simone, Danilo; Vandenberghe, Geert; Stowers, Jason; Giglia, Angelo; De Schepper, Peter; Mani, Antonio; Biafore, John J. (2016) -
Compact 2D OPC modeling of a metal oxide EUV resist for a 7nm node BEOL layer
De Simone, Danilo; Lyons, Adam; Rio, David; Lee, Sook; Delorme, Maxence; Fumar-Pici, Anita; Kocsis, Michael; De Schepper, Peter; Greer, Michael; Wallow, THomas; Stowers, Jason K; Gillijns, Werner; Bekaert, Joost (2017) -
Demonstration of an N7 integrated fab process for metal oxide EUV photoresist
De Simone, Danilo; Mao, Ming; Kocsis, Michael; De Schepper, Peter; Lazzarino, Frederic; Vandenberghe, Geert; Yamashita, Fumiko; Stowers, Jason; Meyers, Steven; Grenville, Andrew; Luong, Vinh; Parnell, Doni; Clark, Benjamin L. (2016) -
Generation of plama in liquid using RF and ultrasounds
Camerotto, Elisabeth; De Schepper, Peter; Callant, Ivan; Shamiryan, Denis; Boullart, Werner; De Gendt, Stefan (2011) -
Hydrogen plasma treatment: the evolution of roughness in frequency domain
De Schepper, Peter; Vaglio Pret, Alessandro; Altamirano Sanchez, Efrain; El Otell, Ziad; De Gendt, Stefan (2014) -
Impact of plasmas on nano-scale patterning
De Schepper, Peter (2012) -
Integrated fab process for metal oxide EUV photoresist
Grenville, Andrew; Anderson, Jeremy T.; Clark, Benjamin L.; De Schepper, Peter; Edson, Joseph; Greer, Michael; Kai, Jiang; Kocsis, Michael; Meyers, Stephen T.; Stowers, Jason K.; Telecky, Alan J.; De Simone, Danilo; Vandenberghe, Geert (2015) -
Layer on photoresist lines with an Ar/SiCl4/O2 inductively coupled plasma: a modeling investigation
Tinck, Stefan; Altamirano Sanchez, Efrain; De Schepper, Peter; Bogaerts, Annemie (2014) -
Line edge and width roughness mitigation at 22nm half pitch: plasma polymer interaction and roughness mitigation through etch
De Schepper, Peter; Hansen, Terje; Vaglio Pret, Alessandro; Altamirano Sanchez, Efrain; Boullart, Werner; De Gendt, Stefan (2013) -
Line edge and width roughness smoothing by plasma treatment
De Schepper, Peter; Hansen, Terje; Altamirano Sanchez, Efrain; Vaglio Pret, Alessandro; Boullart, Werner; De Gendt, Stefan (2013) -
Line edge and width roughness smoothing by plasma treatment
De Schepper, Peter; Hansen, Terje; Altamirano Sanchez, Efrain; Vaglio Pret, Alessandro; El Otell, Ziad; Boullart, Werner; De Gendt, Stefan (2014) -
Lloyd's Mirror Interference Lithography Below a 22-nm Pitch with an Accessible, Table-top, 13.5 nm High-Harmonic EUV Source
Dorney, Kevin; Castellanos, Sonia; Witting Larsen, Esben; Holzmeier, Fabian; Singh, Dhirendra Pratap; Vandenbroeck, Nadia; De Simone, Danilo; De Schepper, Peter; Vaglio Pret, Alessandro; Bargsten, Clayton; Cousin, Seth; Raymondson, Daisy; Rinard, Eric; Ward, Rod; Kapteyn, Henry; Nuytten, Thomas; van der Heide, Paul; Petersen, John (2021) -
Metal oxide EUV photoresist performance for N7 relevant patterns and processes
Stowers, Jason; Anderson, Jeremy; Cardineau, Brian; Clark, Benjamin; De Schepper, Peter; Edson, Joseph; Greer, Michael; Jiang, Kai; Kocsis, Michael; Meyers, Stephen; Telecky, Alan; Grenville, Andrew; De Simone, Danilo; Gillijns, Werner; Vandenberghe, Geert (2016) -
Modeling and experimental investigation of the plasma uniformity in CF4/O2 capacitively coupled plasmas, operating in single frequency and dual frequency regime
Zhang, Yu-Ru; Tinck, Stefan; De Schepper, Peter; Wang, You-Nian; Bogaerts, Annemie (2015) -
Molecular glass resists for all-dry high-resolution scanning probe lithography
Neuber, Christian; Cooke, Mike; Despont, Michel; Durig, Urs; Kastner, Markus; Knoll, Armin; de Marneffe, Jean-Francois; Rangelow, Ivo; Rawlings, Colin; De Schepper, Peter; Schmidt, Hans-Werner; Strohriegl, Peter (2013) -
Molecular glass resists for scanning probe lithography
Neuber, Christian; Ringk, Andreas; Kolb, Tristan; Wieberger, Floryan; Strohriegl, Peter; Schimdt, Hans-Werner; Fokkema, Vincent; Cooke, Mike; Rawlings, Colin; Durig, Urs; Knoll, Armin; de Marneffe, Jean-Francois; De Schepper, Peter; Kaestner, Marcus; Krivoshapkina, Yana; Budden, Matthias; Rangelow, Ivo (2014) -
Numerical investigation of HBr/He transformer coupled plasmas used for silicon etching
Gul, Banat; Tinck, Stefan; De Schepper, Peter; Rehman, Aman-ur (2015) -
Pattern roughness mitigation of 22 nm lines and spaces: The impact of H2 plasma treatment
De Schepper, Peter; Vaglio Pret, Alessandro; El Otell, Ziad; Hansen, Terje; Altamirano Sanchez, Efrain; De Gendt, Stefan (2015)