Browsing by author "Palmans, Roger"
Now showing items 1-20 of 36
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Cu(Mn) seed layers in single damascene trenches with dimensions down to 30 nm
Volders, Henny; Richard, Olivier; Carbonell, Laure; Palmans, Roger; Verdonck, Patrick; Heylen, Nancy; Kellens, Kristof; Armini, Silvia; Bender, Hugo; Zhao, Larry; Tokei, Zsolt (2008) -
Cu(Mn) seed layers in single damascene trenches with dimensions down to 30 nm
Volders, Henny; Richard, Olivier; Carbonell, Laure; Palmans, Roger; Verdonck, Patrick; Heylen, Nancy; Kellens, Kristof; Armini, Silvia; Bender, Hugo; Zhao, Larry; Tokei, Zsolt (2009) -
Development of an electroless copper deposition bath for via fill applications on TiN seed layers
Palmans, Roger; Maex, Karen (1994) -
Development of an electroless copper deposition bath for via fill applications on TiN seed layers
Palmans, Roger; Maex, Karen (1995) -
Direct copper electroplating
Lantasov, Yuri; Palmans, Roger; Maex, Karen (2000) -
Direct copper plating on highly resistive barrier layers
Palmans, Roger (2005) -
Dual silicide technology: WSix polycide gate and self-aligned CoSi2 source/drain
Franssila, Samuli; Palmans, Roger; Stone, M.; Maex, Karen (1994) -
Electrical and mechanical characterization of chemical vapor deposition of tungsten on sputter-deposited TiN layers
Zhang, S. L.; Palmans, Roger; Petersson, C. S.; Maex, Karen (1995) -
Electroless copper deposition on TiN
Min, Woo Sig; Palmans, Roger; Maex, Karen; Lee, D. N. (1997) -
Electroless deposition of Cu with solutions containing either Mg2+ or Pd2+ ions
Mouroux, Aliette; Zhang, S. L.; Palmans, Roger; Min, Woo Sig; Maex, Karen (1999) -
Etch process development for FLARE(tm) for dual damascene architecture using a N2/O2 plasma
Thompson, Heike; Vanhaelemeersch, Serge; Maex, Karen; Van Ammel, Annemie; Beyer, Gerald; Coenegrachts, Bart; Vervoort, Iwan; Waeterloos, Joost; Struyf, Herbert; Palmans, Roger; Forester, Lynn (1999) -
Filling of 80 nm structures using a novel copper oxide reduction and reflow approach
Carbonell, Laure; Palmans, Roger; Travaly, Youssef; Brongersma, Sywert; Maex, Karen (2004) -
Filling of 80nm trenches using a novel copper oxide reduction and reflow approach
Carbonell, Laure; Palmans, Roger; Travaly, Youssef; Tokei, Zsolt; Jonas, Alain M.; Brongersma, Sywert; Maex, Karen (2005) -
High aspect ratio via metallization for 3D integration using CVD TiN barrier and electrografted Cu seed
Druais, Gael; Dilliway, Gabriela; Fischer, P.; Guidotti, E.; Bureau, C.; Palmans, Roger; Radisic, Alex (2008) -
Impact of rapid thermal annealing of Ti/TiN bilayers on subsequent chemical vapor deposition of tungsten
Mouroux, Aliette; Palmans, Roger; Keinonen, J.; Zhang, S. L.; Maex, Karen; Petersson, S. (1996) -
Influence of hydrogen on chemical vapor deposition of tungsten on sputter-deposited TiN layers
Zhang, S. L.; Palmans, Roger; Keinonen, J.; Petersson, C. S.; Maex, Karen (1995) -
Influence of the electron mean free path on the resistivity of thin metal films
Zhang, Wenqi; Brongersma, Sywert; Richard, Olivier; Brijs, Bert; Palmans, Roger; Froyen, Ludo; Maex, Karen (2004) -
Integration of electroless and electrolytic Cu and IC back end of line technologies
Maex, Karen; Brongersma, Sywert; Lantasov, Yuri; Richard, Emmanuel; Palmans, Roger; Vervoort, Iwan (2000) -
Integration of electroless and electrolytic Cu in the IC back end line of technologies
Maex, Karen; Palmans, Roger; Lantasov, Yuri; Brongersma, Sywert; Richard, Emmanuel; Vervoort, Iwan (1999) -
Ion-pair chromatography of bis (sodium-sulfopropyl)disulfide brightener in acidic copper plating baths
Palmans, Roger; Claes, S.; Vanatta, L.E.; Coleman, D.E. (2005)