Browsing by author "Verdonck, Patrick"
Now showing items 21-40 of 153
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Cu passivation for integration of gap-filling ultralow-k dielectrics
Zhang, Liping; de Marneffe, Jean-Francois; Lesniewska, Alicja; Verdonck, Patrick; Heylen, Nancy; Murdoch, Gayle; Croes, Kristof; Boemmels, Juergen; Tokei, Zsolt; De Gendt, Stefan; Baklanov, Mikhail (2016) -
Cu(Mn) seed layers in single damascene trenches with dimensions down to 30 nm
Volders, Henny; Richard, Olivier; Carbonell, Laure; Palmans, Roger; Verdonck, Patrick; Heylen, Nancy; Kellens, Kristof; Armini, Silvia; Bender, Hugo; Zhao, Larry; Tokei, Zsolt (2008) -
Cu(Mn) seed layers in single damascene trenches with dimensions down to 30 nm
Volders, Henny; Richard, Olivier; Carbonell, Laure; Palmans, Roger; Verdonck, Patrick; Heylen, Nancy; Kellens, Kristof; Armini, Silvia; Bender, Hugo; Zhao, Larry; Tokei, Zsolt (2009) -
Deposition and characterization of porogen based PECVD deposited and UV-cured extreme low-k materials
Verdonck, Patrick; De Roest, David; Kaneko, Shinya; Tsuji, Naoto; Matsushita, Kiyohiro; Travaly, Youssef; Sprey, Hessel; Schaekers, Marc; Beyer, Gerald (2007) -
Depth profiling of elastic inhomogeneities in transoarent nanomaterials by picosecond ultrasonic interferometry
Mechri, C; Ruello, P; Breteau, J.M.; Baklanov, Mikhaïl; Verdonck, Patrick; Gusev, V (2009) -
Depth-profiling of the elastic and optical properties of submicrometer thick optically transparent films by picosecond ultrasonics inteferometry
Ruello, P.; Lomonosov, A.; Ayouch, A.; Mechri, C.; Baklanov, Mikhaïl; Verdonck, Patrick; Zhao, Larry; Gusev, V. (2011) -
Design and realization of a photolithography alignment and UV exposure equipment for pedagogical and laboratory experiment purposes
Mansano, Ronaldo; Ordonez, Nilson; Morimoto, Nilton; Verdonck, Patrick; Carbonne, Bertrand; Danto, Yves; Bonnaud, Olivier (2008) -
Detailed characterization of the effects of plasma treatments on an advanced 2.0 low-k material
Verdonck, Patrick; Maheshwari, Abhishek; Swerts, Johan; Tielens, Hilde; Franquet, Alexis; Loyo Prado, Jana; Armini, Silvia; Baklanov, Mikhaïl; Van Elshocht, Sven; Uedono, Akira; Roque Huanca, Danilo; Gomes dos Santos Filho, Sebastiao; Kellerman, Guinther (2013) -
Determination of the model for the chemical structure of porous PECVD low-k films
Verdonck, Patrick; Le, Quoc Toan; Devonport, Joshua; Huanca, Danilo; Gomes dos Santos Filho, Sebastiao; Conard, Thierry; Meersschaut, Johan; Baklanov, Mikhaïl; Van Elshocht, Sven (2015) -
Determination of thermal expansion coefficients of low- dielectrics by cube corner indentation tests at elevated temperatures
Vanstreels, Kris; Zahedmanesh, Houman; Verdonck, Patrick; Baklanov, Mikhaïl (2016) -
Determination of thermal expansion coefficients of low-k dielectrics by cube corner indentation tests at elevated temperatures
Vanstreels, Kris; Zahedmanesh, Houman; Verdonck, Patrick; Hangen, Ude; Baklanov, Mikhaïl (2016) -
Development and evaluation of a-SiC:H films using a dimethylsilacyclopentane precursor as a low -k Cu capping layer in advanced interconnects
Van Besien, Els; Wang, Cong; Verdonck, Patrick; Singh, Arjun; Barbarin, Yohan; Schaekers, Marc; Baklanov, Mikhaïl; Van Elshocht, Sven (2013) -
Development and evaluation of a-SiCO:H films as Cu and moisture diffusion barriers with a low dielectric constant, for advanced interconnects
Van Besien, Els; Singh, Arjun; Barbarin, Yohan; Verdonck, Patrick; Baklanov, Mikhaïl (2013) -
Development of a novel wafer probe for in-situ measurements
El Otell, Ziad; Marinov, Daniil; Bowden, Mark; Samara, Vladimir; de Marneffe, Jean-Francois; Verdonck, Patrick; Braithwaite, Nicholas (2013) -
Development of a novel wafer probe for in-situ measurements
El Otell, Ziad; Marinov, Daniil; Samra, Vladimir; Bowden, Mark; de Marneffe, Jean-Francois; Verdonck, Patrick; Braithwaite, Nicholas (2014) -
Development of a novel wafer-probe for in situ measurements of thin film properties
El Otell, Ziad; Marinov, Daniil; Samara, Vladimir; Bowden, Mark; de Marneffe, Jean-Francois; Verdonck, Patrick; Braithwaite, Nicholas St. J. (2015) -
Development of multi-stack dielectric wafer bonding
Peng, Lan; Kim, Soon-Wook; Inoue, Fumihiro; Wang, Teng; Phommahaxay, Alain; Verdonck, Patrick; Jourdain, Anne; Sleeckx, Erik; Struyf, Herbert; Miller, Andy; Beyer, Gerald; Beyne, Eric; Soules, Mike; Lutter, Stefan (2016) -
Dielectric reliability of 50nm half pitch structures in Aurora® LK
Demuynck, Steven; Kim, Honggun; Huffman, Craig; Darnon, Maxime; Struyf, Herbert; Versluijs, Janko; Claes, Martine; Vereecke, Guy; Verdonck, Patrick; Volders, Henny; Heylen, Nancy; Kellens, Kristof; De Roest, David; Sprey, Hessel; Beyer, Gerald (2009) -
Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill
Lesniewska, Alicja; Roussel, Philippe; Tierno, Davide; Vega Gonzalez, Victor; van der Veen, Marleen; Verdonck, Patrick; Jourdan, Nicolas; Wilson, Chris; Tokei, Zsolt; Croes, Kristof (2020) -
Diffraction gratings fabricated in DLC thin flms
Cirino, Giuseppe; Mansano, Ronaldo; Verdonck, Patrick; Jasinevicius, R.G.; Goncalves Neto, Luiz (2010)