Browsing by author "Maex, Karen"
Now showing items 41-60 of 643
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Alpha-Ta formation and its impact on electromigration
Demuynck, Steven; Tokei, Zsolt; Bruynseraede, Christophe; Michelon, Julien; Maex, Karen (2003) -
Alpha-Ta formation and its impact on electromigration
Demuynck, Steven; Tokei, Zsolt; Bruynseraede, Christophe; Michelon, Julien; Maex, Karen (2004) -
Analyses of post metal etch cleaning in downstream H2O-based plasma followed by a wet chemistry
Li, H.; Baklanov, Mikhaïl; Boullart, Werner; Conard, Thierry; Brijs, Bert; Maex, Karen; Froyen, L. (1999) -
Analysis of silicide / diffusion contact resistance making use of transmission line stuctures
Akheyar, Amal; Lauwers, Anne; Lindsay, Richard; de Potter de ten Broeck, Muriel; Tempel, Georg; Maex, Karen (2002) -
Analysis of the size effect in electroplated fine copper wires and a realistic assessment to model copper resistivity
Zhang, Wenqi; Brongersma, Sywert; Li, Zhen; Li, dagang; Richard, Olivier; Maex, Karen (2007) -
Applicability of HF solutions for contact hole cleaning on top of TiSi2
Baklanov, Mikhaïl; Kondoh, Eiichi; Vanhaelemeersch, Serge; Maex, Karen (1998) -
Applicability of HF solutions for the cleaning of TiSi2 surface
Baklanov, Mikhaïl; Vanhaelemeersch, Serge; Maex, Karen (1997) -
Applications of in-line oxygen monitoring to a rapid thermal processing tool: diagnosing gas flow dynamics and silicidation processes
Kondoh, Eiichi; Baklanov, Mikhaïl; Maex, Karen (2000) -
Applications of Ni-based silicides to 45 nm CMOS and beyond
Kittl, Jorge; Lauwers, Anne; Chamirian, Oxana; Pawlak, Malgorzata; Van Dal, Mark; Akheyar, Amal; de Potter de ten Broeck, Muriel; Kottantharayil, Anil; Pourtois, Geoffrey; Lindsay, Richard; Maex, Karen (2004) -
Atomic layer deposited barriers for copper interconnects
Schuhmacher, Jorg; Martin Hoyas, Ana; Ernur, Didem; Tokei, Zsolt; Travaly, Youssef; Bruynseraede, Christophe; Satta, Alessandra; Whelan, Caroline; Shamiryan, Denis; Beyer, Gerald; Abell, Thomas; Sutcliffe, Victor; Schaekers, Marc; Maex, Karen (2004) -
Atomic layer deposition of barriers for interconnect
Besling, Wim; Satta, Alessandra; Schuhmacher, Jörg; Abell, Thomas; Sutcliffe, Victor; Martin Hoyas, Ana; Beyer, Gerald; Gravesteijn, Dirk; Maex, Karen (2002) -
Atomic-layer deposited barrier and seed layers for interconnects
Schuhmacher, Jorg; Martin Hoyas, Ana; Satta, Alessandra; Maex, Karen (2005) -
Barrier deposition on porous low-k films
Shamiryan, Denis; Yanovitskaya, Z.S.; Iacopi, Francesca; Maex, Karen (2003) -
Barrier integrity effect on leakage mechanism and dielectric reliability of copper/OSG interconnects
Li, Yunlong; Tokei, Zsolt; Mandrekar, T.; Mebarki, Bencherki; Groeseneken, Guido; Maex, Karen (2005) -
Barrier process development for damascene integration of porous SiLK resin films
Tokei, Zsolt; Waeterloos, Joost; Iacopi, Francesca; Caluwaerts, Rudy; Struyf, Herbert; Van Aelst, Joke; Maex, Karen (2002) -
Barrier reliability of ALD TaN on sub-100 nm copper low-k interconnects
Tokei, Zsolt; Gailledrat, Thomas; Li, Yunlong; Schuhmacher, Jorg; Mandrekar, T.; Guggilla, S.; Mebarki, B.; Maex, Karen (2005) -
Barrier reliability on sub-100nm copper low-k interconnects
Tokei, Zsolt; Gailledrat, T.; Li, Yunlong; Schuhmacher, Jorg; Mandrekar, T.; Guggilla, S.; Mebarki, Bencherki; Maex, Karen (2004) -
Barrier studies on porous silk semiconductor dielectric
Tokei, Zsolt; Iacopi, Francesca; Richard, Olivier; Waeterloos, Joost; Rozeveld, S.; Beach, E.; Mebarki, Bencherki; Mandrekar, T.; Guggilla, S.; Maex, Karen (2003) -
Barriers for Cu/low k damascene structures
Maex, Karen; Tokei, Zsolt; Satta, Alessandra; Lanckmans, Filip; Wu, Wen; Iacopi, Francesca (2001) -
Boosting the on-current of a n-channel nanowire tunnel field-effect transistor by source material optimization
Verhulst, Anne; Vandenberghe, William; Maex, Karen; Groeseneken, Guido (2008)