Browsing Articles by imec author "0910cd803a555ff37cbb3478b7a1e20fbc642fbb"
Now showing items 1-20 of 60
-
30-nm half-pitch metal patterning using MotifTM critical dimension shrink technique and double patterning
Versluijs, Janko; de Marneffe, Jean-Francois; Goossens, Danny; Vandeweyer, Tom; Wiaux, Vincent; Struyf, Herbert; Maenhoudt, Mireille; Brouri, Mohand; Vertommen, Johan; Kim, Ji Soo; Zhu, Helen; Sadjadi, Reza (2009) -
A DC-pulsed capacitively-coupled planar Langmuir probe for plasma process diagnostics and monitoring
Samara, Vladimir; Booth, Jean-Paul; de Marneffe, Jean-Francois; Milenin, Alexey; Brouri, Mohand; Boullart, Werner (2012) -
A route towards the fabrication of 2D heterostructures using atomic layer etching combined with selective conversion
Heyne, Markus; Marinov, Daniil; Braithwaite, Nicholas; Goodyear, Andy; de Marneffe, Jean-Francois; Cooke, Mike; Radu, Iuliana; Neyts, Erik C.; De Gendt, Stefan (2019) -
Adsorption isobars of fluorocarbon compounds for cryogenic plasma etching of low-k dielectrics (in Russian)
Rezvanov, A.; Gutshin, O.; Gornev, E.; Krasnikov, G.; Mogil'nikov, K.; Zhang, Liping; de Marneffe, Jean-Francois; Dussarat, C.; Baklanov, Mikhaïl (2015) -
Anisotropic properties of Bi-2201 thin films grown on vicinal substrates
Zhang, Y.Z.; Wang, Z.; Zheng, D.N.; Wen, H.H.; Zhao, Z.X.; de Marneffe, Jean-Francois; Deltour, R.; Jansen, A.G.M.; Wyder, P. (2005-05) -
Area selective grafting of siloxane molecules on low-k dielectric with resepct to copper surface
Rezvanov, Askar; Gornev, E.S.; de Marneffe, Jean-Francois; Armini, Silvia (2019) -
Characterization of Ru4-xTax (x = 1,2,3) alloy as material candidate for EUV low-n mask
Wu, Meiyi; de Marneffe, Jean-Francois; Opsomer, Karl; Detavernier, Christophe; Delabie, Annelies; Naujok, Philipp; Caner, Oezge; Goodyear, Andy; Cooke, Mike; Saadeh, Qais; Soltwisch, Victor; Scholze, Frank; Philipsen, Vicky (2021) -
CMOS 32nm technology node: business as usual for interconnect damascene patterning?
Beyer, Gerald; Ciofi, Ivan; Van Olmen, Jan; Carbonell, Laure; Versluijs, Janko; Wiaux, Vincent; Op de Beeck, Maaike; Maenhoudt, Mireille; Struyf, Herbert; Hendrickx, Dirk; de Marneffe, Jean-Francois; Vereecke, Guy; Claes, Martine; Bearda, Twan; Volders, Henny; Heylen, Nancy; Travaly, Youssef; Stucchi, Michele; Tokei, Zsolt; Cartuyvels, Rudi (2008-12) -
Comparison between Vacuum Ultra-Violet emission of CF4/Ar and CF3I/Ar plasmas in CCP chamber for low-k etching
Zotovich, Alexey; El Otell, Ziad; de Marneffe, Jean-Francois; Proshina, Olga; Lopaev, Dimitri; Rakhimova, Tatyana; Baklanov, Mikhaïl (2016) -
Conversion of a patterned organic resist into a high performance inoriganic hard mask for high resolution pattern transfer
de Marneffe, Jean-Francois; Chan, BT; Spieser, Martin; Vereecke, Guy; Naumov, Sergej; Vanhaeren, Danielle; Knoll, Armin; Wolf, Heiko (2018) -
Correlation between stress-induced leakage current and dielectric degradation in ultra-porous SiOCH low-k materials
Wu, Chen; Li, Yunlong; Lesniewska, Alicja; Varela Pedreira, Olalla; de Marneffe, Jean-Francois; Ciofi, Ivan; Verdonck, Patrick; Baklanov, Mikhaïl; Boemmels, Juergen; De Wolf, Ingrid; Tokei, Zsolt; Croes, Kristof (2015) -
Cryogenic etching processes applied to porous low-k materials using C4F8/SF6 plasmas
Leroy, F.; Zhang, Liping; Tillocher, T.; Yatsuda, K.; Maekawa, K; Nishimura, E; Lefaucheux, P; de Marneffe, Jean-Francois; Baklanov, Mikhaïl; Dussart, R (2015) -
Cryogenic etching reduces plasma-induced damage of ultralow-k dielectrics
Baklanov, Mikhaïl; de Marneffe, Jean-Francois; Zhang, Liping; Ciofi, Ivan; Tokei, Zsolt (2014) -
Cu passivation for integration of gap-filling ultralow-k dielectrics
Zhang, Liping; de Marneffe, Jean-Francois; Lesniewska, Alicja; Verdonck, Patrick; Heylen, Nancy; Murdoch, Gayle; Croes, Kristof; Boemmels, Juergen; Tokei, Zsolt; De Gendt, Stefan; Baklanov, Mikhail (2016) -
Damage free cryogenic etching of a porous organosilica ultralow-k film
Zhang, Liping; Leffaucheux, P.; Tillocher, T.; Dussart, R.; Mankelevich, Y.; de Marneffe, Jean-Francois; De Gendt, Stefan; Baklanov, Mikhaïl (2013) -
Damage free integration of ultralow-k dielectrics by template replacement approach
Zhang, Liping; de Marneffe, Jean-Francois; Heylen, Nancy; Murdoch, Gayle; Tokei, Zsolt; Boemmels, Juergen; De Gendt, Stefan; Baklanov, Mikhaïl (2015) -
Damage-free plasma etching of porous organo-silicate low-k using micro-capillary condensation above -50° C
Chanson, Romain; Zhang, Liping; Naumove, Sergei; Mankelevich, Yu.; Tillocher, Thomas; Lefaucheux, Phillipe; Dussart, Remi; De Gendt, Stefan; de Marneffe, Jean-Francois (2018) -
Defect-induced bandgap narrowing in low-k dielectrics
Guo, X; Zheng, H; King, S; Afanasiev, Valeri; Baklanov, Mikhaïl; de Marneffe, Jean-Francois; Nishi, Y.; Shohet, J. (2015) -
Development of a novel wafer-probe for in situ measurements of thin film properties
El Otell, Ziad; Marinov, Daniil; Samara, Vladimir; Bowden, Mark; de Marneffe, Jean-Francois; Verdonck, Patrick; Braithwaite, Nicholas St. J. (2015) -
Deviations from plastic barriers in BiSr2CaCu2O8 + delta thin films
Zhang, Y.Z.; Wang, Z.; Lu, X.F.; Wen, H.; de Marneffe, Jean-Francois; Deltour, R.; Jansen, A.G.M.; Wyder, P. (2005)