Browsing Articles by imec author "9a3f5b55388fd5940a3af83230927fc25a1adf4d"
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Adsorption isobars of fluorocarbon compounds for cryogenic plasma etching of low-k dielectrics (in Russian)
Rezvanov, A.; Gutshin, O.; Gornev, E.; Krasnikov, G.; Mogil'nikov, K.; Zhang, Liping; de Marneffe, Jean-Francois; Dussarat, C.; Baklanov, Mikhaïl (2015) -
Cryogenic etching processes applied to porous low-k materials using C4F8/SF6 plasmas
Leroy, F.; Zhang, Liping; Tillocher, T.; Yatsuda, K.; Maekawa, K; Nishimura, E; Lefaucheux, P; de Marneffe, Jean-Francois; Baklanov, Mikhaïl; Dussart, R (2015) -
Cryogenic etching reduces plasma-induced damage of ultralow-k dielectrics
Baklanov, Mikhaïl; de Marneffe, Jean-Francois; Zhang, Liping; Ciofi, Ivan; Tokei, Zsolt (2014) -
Cu passivation for integration of gap-filling ultralow-k dielectrics
Zhang, Liping; de Marneffe, Jean-Francois; Lesniewska, Alicja; Verdonck, Patrick; Heylen, Nancy; Murdoch, Gayle; Croes, Kristof; Boemmels, Juergen; Tokei, Zsolt; De Gendt, Stefan; Baklanov, Mikhail (2016) -
Damage free cryogenic etching of a porous organosilica ultralow-k film
Zhang, Liping; Leffaucheux, P.; Tillocher, T.; Dussart, R.; Mankelevich, Y.; de Marneffe, Jean-Francois; De Gendt, Stefan; Baklanov, Mikhaïl (2013) -
Damage free integration of ultralow-k dielectrics by template replacement approach
Zhang, Liping; de Marneffe, Jean-Francois; Heylen, Nancy; Murdoch, Gayle; Tokei, Zsolt; Boemmels, Juergen; De Gendt, Stefan; Baklanov, Mikhaïl (2015) -
Damage-free plasma etching of porous organo-silicate low-k using micro-capillary condensation above -50° C
Chanson, Romain; Zhang, Liping; Naumove, Sergei; Mankelevich, Yu.; Tillocher, Thomas; Lefaucheux, Phillipe; Dussart, Remi; De Gendt, Stefan; de Marneffe, Jean-Francois (2018) -
Improved plasma resistance for porous low-k dielectrics by pore stuffing approach
Zhang, Liping; de Marneffe, Jean-Francois; Heyne, Markus; Naumov, Sergej; Sun, Yiting; Zotovich, Alexey; El Otell, Ziad; Vaida, Selim; De Gendt, Stefan; Baklanov, Mikhaïl (2015) -
Integration of porous low-k dielectrics using post porosity pore protection
Zhang, Liping; de Marneffe, Jean-Francois; Verdonck, Patrick; Heylen, Nancy; Wen, Liang Gong; Wilson, Chris; Tokei, Zsolt; Boemmels, Juergen; De Gendt, Stefan; Baklanov, Mikhail (2016) -
Low damage cryogenic etching of porous organosilicate low-k materials using SF6/O2/SiF4
Zhang, Liping; Ljazouli, Rami; Lefaucheux, Philippe; Tillocher, Thomas; Dussart, Remi; Mankelevich, Yuri; de Marneffe, Jean-Francois; De Gendt, Stefan; Baklanov, Mikhaïl (2013) -
Mechanisms for plasma cryogenic etching of porous materials
Zhang, Quan-Zi; Tinck, Stefan; de Marneffe, Jean-Francois; Zhang, Liping; Bogaerts, Annemie (2017) -
Metal-organic framework ZIF-8 films as low- $j dielectrics in microelectronics
Eslava, S.; Zhang, Liping; Esconjauregui, S.; Yang, J.; Vanstreels, Kris; Baklanov, Mikhaïl; Saiz, E (2013) -
Mitigation of plasma-induced damage in porous low-k dielectrics by cryogenic precursor condensation
Zhang, Liping; de Marneffe, Jean-Francois; Leroy, Florian; Lefaucheux, Philippe; Tillocher, Thomas; Dussart, Remi; Maekawa, Kaoru; yatsuda, koichi; Dussarrat, Christian; Goodyear, Andy; Cooke, Mike; De Gendt, Stefan; Baklanov, Mikhaïl (2016) -
New bending mode in SAQP Si fins and its mitigation
Sepulveda Marquez, Alfonso; Hellin, David; Zhang, Liping; Kenis, Karine; Batuk, Dmitry; Baudot, Sylvain; Briggs, Basoene; Mountsier, Tom; Barla, Kathy; Morin, Pierre; Altamirano Sanchez, Efrain (2022) -
Pore surface grafting of porous low-k dielectrics by selective polymers
Rezvanov, Askar; Zhang, Liping; Watanabe, Mitsuhiro; Hacker, Nigel; Kolomeisky, Anatoly; Armini, Silvia; de Marneffe, Jean-Francois (2017) -
Quantitative characterization of pore stuffing and unstuffing for postporosity plasma protection of low-k materials
Heyne, Markus; Zhang, Liping; Liu, Junjun; Ahmad, Iftikhar; Toma, Dorel; de Marneffe, Jean-Francois; De Gendt, Stefan; Baklanov, Mikhaïl (2014) -
Stuffing-enabled surface confinement of silanes used as sealing agents on CF4 plasma-exposed 2.0 p-OSG films
Sun, Yiting; Levrau, Elisabeth; Zhang, Liping; Geypen, Jef; Meersschaut, Johan; Franquet, Alexis; Le, Quoc Toan; de Marneffe, Jean-Francois; Bender, Hugo; Struyf, Herbert; Detavernier, Christophe; Baklanov, Mikhaïl; De Feyter, Steven; Armini, Silvia (2015) -
Surface-confined activation of ultra low-k dielectrics in CO2 plasma
Sun, Yiting; Krishtab, Mikhail; Mankelevich, Yuri; Zhang, Liping; De Feyter, Steven; Baklanov, Mikhaïl; Armini, Silvia (2016) -
Vacuum ultra-violet damage and damage mitigation for plasma processing of highly porous organosilicate glass dielectrics
de Marneffe, Jean-Francois; Zhang, Liping; Heyne, Markus; Lukaszewicz, Mikolasj; Porter, Stephen Barry; Vajda, Felim; Rutigliani, Vito; Krishtab, Mikhail; Goodyear, Andy; Cooke, Mike; Verdonck, Patrick; Baklanov, Mikhaïl (2015)