Browsing by Author "Baklanov, Mikhaïl"

1-D model of OSG low-k films modification by EUV/VUV emission

1-D model of RF CCP discharge in Ar/CF4/CF3I gas mixtures

A discussion of the practical importance of positron annihilation lifetime spectroscopy percolation threshold in evaluation of porous low-k dielectrics

A new procedure to seal the pores of mesoporous low-k films with precondensed organosilica oligomers

A novel approach to characterization of a low-k dielectric polymer surface

A novel low temperature etch approach to reduce ULK plasma damage

A theoretical and experimental study of atomic-layer-deposited films onto porous dielectric substrates

Active species in porous media: random walk and capture in traps

Active species in porous media: random walk and capture in traps

Adsorption isobars of fluorocarbon compounds for cryogenic plasma etching of low-k dielectrics (in Russian)

Adsorption isobars of fluorocarbon compounds selected for cryogenic etching of low-k materials

Advanced CMOS manufacturing, a drive for plasma science and technology

Advanced interconnects: materials, processing, and reliability

Advanced organic polymers for the aggressive scaling of low-k materials

Advanced organic polymers for the aggressive scaling of low-k materials

Advanced PECVD SiCOH low-k films with low dielectric constant and/or high Young's modulus

Advanced PECVD SiCOH low-k films with low dielectric constant and/or high Young�s modulus

Advanced solutions for copper and low k technology

Advanced ultralow-k organosilicate glasses: NEXAFS study

Advances and challenges in ultra low-k patterning