Browsing by Author "Guerrero, Alice"
- Results per page
- Sort Options
Publication Acoustic modulation during laser debonding of collective hybrid bonded dies
Proceedings paper2021, IEEE 71st Electronic Components and Technology Conference (ECTC), JUN 01-JUL 04, 2021, p.2126-2133Publication Advances in temporary carrier technology for high density fan-out device build-up
Proceedings paper2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 28/05/2019, p.340-345Publication Advances in thin wafer debonding and ultra thin 28nm FinFET substrate transfer
Meeting abstract2017, IEEE 67th Electronic Components and Technology Conference - ECTC, 30/05/2017, p.740-745Publication Carrier Systems for Collective Die-to-Wafer Bonding
Proceedings paper2022, 72nd IEEE Electronic Components and Technology Conference (ECTC), MAY 31-JUN 01, 2022, p.2058-2063Publication Extremely low force debonding of thinned CMOS substrate by laser release of a temporary bond material
; ; ; ; ; Proceedings paper2016, IEEE 66th Electronic Components and Technology Conference - ECTC, 31/05/2016, p.1685-1690Publication Improving The Wafer Thinning Flow Robustness For 2.5D & 3D Applications
Proceedings paper2024, 10th IEEE Electronics System-Integration Technology Conference (ESTC), SEP 11-13, 2024Publication Integration and manufacturing aspects of moving from HT-10.10 to ZoneBOND™ in temporary wafer bonding and debonding for 3D applications
Proceedings paper2013, IEEE 63rd Electronic Components and Technology Conference - ECTC, 28/05/2013, p.113-117Publication Introduction of a New Carrier System for Collective Die-to-Wafer Hybrid Bonding and Laser-Assisted Die Transfer
Proceedings paper2020, 70th IEEE Electronic Components and Technology Conference (ECTC), JUN 03-30, 2020, p.296-302Publication Multi-tier die stacking through collective die-to-wafer hybrid bonding.
Proceedings paper2024, IEEE 74th Electronic Components and Technology Conference (ECTC), MAY 28-31, 2024, p.637-642Publication Process challenges during CVD oxide deposition on the backside of 20-μm thin 300-mm wafers temporarily bonded to glass carriers.
Proceedings paper2023, IEEE 73rd Electronic Components and Technology Conference (ECTC), MAY 30-JUN 02, 2023, p.1584-1589Publication Process characterization of thin wafer debonding with thermoplastic materials
Proceedings paper2012, 4th Electronics System Integration technologies Conference - ESTC, 17/09/2012Publication Single-release-layer process for temporary bonding applications in 3D integration area
Proceedings paper2015, IEEE 65th Electronic Components & Technology Conference - ECTC, 26/05/2015, p.896-898Publication Temporary bonding for high-topography applications: spin-on material versus dry film
Proceedings paper2014, IEEE 64th Electronic Components and Technology Conference - ECTC, 27/05/2014, p.894-898Publication The growing applilcation field of laser debonding: from advanced packaging to future nanoelectronics
Proceedings paper2019, 2019 International Wafer Level Packaging Conference (IWLPC), 13/10/2019Publication Thick adhesive temporary bonding for high topography applications: spin-on versus dry bonding film processes
Proceedings paper2014, IEEE 64th Electronic Components and Technology Conference - ECTC, 27/05/2014, p.894-898Publication Ultrathin wafer handling in 3D stacked IC manufacturing combining a novel zoneBOND™ temporary bonding process with room temperature peel debonding
Proceedings paper2012, IEEE International 3D Systems Integration Conference - 3DIC, 31/01/2012