Browsing by Author "Huffman, Craig"
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Publication Advanced organic polymers for the aggressive scaling of low-k materials
; ; Publication Advanced organic polymers for the aggressive scaling of low-k materials
Proceedings paper2010, International Conference on Solid State Devices and Materials - SSDM, 22/09/2010, p.844-845Publication Demonstration of scaled 0.099μm² FinFET 6T-SRAM cell using full-field EUV lithography for (Sub-)22nm node single-patterning technology
Proceedings paper2009-12, IEEE International Electron Devices Meeting - IEDM, 7/12/2009, p.301-304Publication Dielectric reliability of 50nm 1/2 pitch structures in Aurora® LK
Proceedings paper2008, 40th International Confernece on Solid STate Devices and Materials, 22/09/2008Publication Dielectric reliability of 50nm half pitch structures in Aurora® LK
Journal article2009, Japanese Journal of Applied Physics, (48) 4, p.04C018Publication EUV lithography implementation on contact and metal interconnect level of a 22nm node 0.099um2 6T-SRAM cell
Proceedings paper2009, International Symposium on Extreme Ultraviolet Lithography, 18/10/2009Publication Full-field EUV and immersion lithography integration in 0.186μm² FinFET 6T-SRAM cell
Proceedings paper2008, Technical Digest International Electron Devices Meeting - IEDM, 15/12/2008, p.861-864Publication High yield sub-0.1μm² 6T-SRAM Cells, featuring high-k/metal-gate Finfet devices, double gate patterning, a novel Fin etch strategy, full-field EUV lithography and optimized junction design & layout
Proceedings paper2010, IEEE Symposium on VLSI Technology, 15/06/2010, p.23-24Publication Impact of plasma exposure on organic low-k materials
Publication Integration and dielectric reliability of 30nm 1/2 pitch structures in Aurora LK HM
Proceedings paper2009, International Conference on Solid State Devices and Materials - SSDM, 7/10/2009, p.1094-1095Publication Integration and dielectric reliability of 30nm ½ pitch structures in Aurora® LK HM
Journal article2010, Japanese Journal of Applied Physics, (49) 4, p.04DB05Publication Integration of an organic ultra low-k (k=2.2) material
Oral presentation2009, Advanced Metallization Conference - AMCPublication Integration of an organic ultra low-k (k=2.2) material
Proceedings paper2010, Advanced Metallization Conference 2009 - AMC 2009, 13/10/2009, p.173-184Publication Integration of porogen-based low-k films: influence of capping layer thickness and long thermal anneals on low-k damage and reliability
; ; ; ; Publication Integration of porogen-based low-k films: influence of capping layer thickness and long thermal anneals on low-k damage and reliability
Oral presentation2009, ADMETA 2009Publication Metal hard-mask based double patterning for 22nm and beyond
Proceedings paper2010, Advanced Metallization Conference 2009 - AMC 2009, 13/10/2009, p.75-82Publication Plasma process optimization for dual pattern 30nm half pitch interconnect application
Meeting abstract2009, Materials for Advance Metallization Conference - MAM, 8/03/2009Publication Plasma sealing of advanced organic low-k material
Oral presentation2011, 4th International Workshop on Plasma Etch and Strip in Microelectronics - PESMPublication Preface to the Focus Issue on Atomic Layer Etch and Clean
Journal article2015, ECS Journal of Solid State Science and Technology, (4) 6, p.Y7Publication The small-gap technique: understanding an ion-shading method for plasma-surface interactions study
Meeting abstract2010, 3rd International Plasma Etch and Strip for Microelectronics Workshop - PESM, 5/03/2010