Browsing by Author "Okoro, Chukwudi"

Analysis of the induced stresses in silicon during thermocompression Cu-Cu bonding of Cu-through-vias in 3D-SIC architecture

Assessment of the feasibility of 'multiple chips-to-wafer' thermo-compression bonding using FEM

Comprehensive analysis of the impact of single and arrays of through silicon vias induced stress on high-k / metal gate CMOS performances

Cu pumping in TSVs: Effect of pre-CMP thermal budget

Elimination of the axial deformation problem of Cu-TSV in 3D integration

Embedding of chips in flex: a global optimization from thermal, mechanical and electrical RF perspective

Enabling 10μm pitch hybrid Cu-Cu IC stacking with Through Silicon Vias

Evaluation of photosensitive spin-on-dielectrics for 3-D wafer level packaging

Extraction of the appropriate material property for realistic modeling of through-silicon-vias using μ-raman spectroscopy

Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu

Impact of thinning and through silicon via proximity on high-k / metal gate first CMOS performance

Influence of annealing conditions on the mechanical and microstructural behavior of electroplated Cu-TSV

Insertion bonding: A novel Cu-Cu bonding approach for 3D integration

Mechanical and thermo-mechanical behavior of electroplated Copper Through Silicon Vias

Novel Cu-Cu bonding technique: the insertion bonding approach

Polymer filling of silicon trenches for 3D through silicon vias applications

Prediction of the influence of induced stresses in silicon on CMOS Performance in a Cu-through-via interconnect technology

Test structures for characterization of thermal-mechanical stress in 3D stacked IC for analog design

Thermal and mechanical aspects for flexible embedded components

Thermo-mechanical characterization of copper through-silicon-via intercnnect for 3D chip stacking