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Browsing by Author "Oniki, Yusuke"

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    At the Extreme of 3D-NAND Scaling: 25 nm Z-Pitch with 10 nm Word Line Cells

    Rachidi, Sana  
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    Arreghini, Antonio  
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    Verreck, Devin  
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    Donadio, Gabriele Luca  
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    Banerjee, Kaustuv  
    Proceedings paper
    2022, 14th IEEE International Memory Workshop (IMW), MAR 15-18, 2022, p.97-100
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    Challenges and solutions of replacement metal gate patterning to enable gate-all-around device scaling

    Oniki, Yusuke  
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    Ragnarsson, Lars-Ake  
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    Hideaki, Iino
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    Cott, Daire  
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    Chan, BT  
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    Sebaai, Farid  
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    Hopf, Toby  
    Proceedings paper
    2021, International Symposium on Ultra Clean Processing of Semiconductor Surfaces - UCPSS, 22/09/2020, p.119-126
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    Cleaning challenges associated with scaling boosters and performance enhancement for advanced logic devices

    Oniki, Yusuke  
    Proceedings paper
    2019, Surface Preparation and Cleaning Conference (SPCC), 2/04/2019
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    Comparison of Electrical Performance of Co-Integrated Forksheets and Nanosheets Transistors for the 2nm Technological Node and Beyond

    Ritzenthaler, Romain  
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    Mertens, Hans  
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    Eneman, Geert  
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    Simoen, Eddy  
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    Bury, Erik  
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    Eyben, Pierre  
    Proceedings paper
    2021, IEEE International Electron Devices Meeting (IEDM), DEC 11-16, 2021
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    Controlled isotropic etches for Gate-All-Around (GAA) device architectures

    Muraki, Yusuke  
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    Oniki, Yusuke  
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    Kenis, Karine  
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    Altamirano Sanchez, Efrain  
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    Holsteyns, Frank  
    Oral presentation
    2020, Surface Preparation and Cleaning Conference - SPCC
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    Development of Metal Free Wet Etching Chemical for Ruthenium Interconnect

    Kesters, Els  
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    Ohashi, Takuya  
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    Wada, Y
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    Sugawara, M
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    Kumagai, T
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    Le, Quoc Toan  
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    Rip, Jens  
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    Oniki, Yusuke  
    Meeting abstract
    2019, The Surface Preparation and Cleaning Conference (SPCC) 2019, 1/04/2019
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    Dipole-First Gate Stack as a Scalable and Thermal Budget Flexible Multi-Vt Solution for Nanosheet/CFET Devices

    Arimura, Hiroaki  
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    Ragnarsson, Lars-Ake  
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    Oniki, Yusuke  
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    Franco, Jacopo  
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    Vandooren, Anne  
    Proceedings paper
    2021, IEEE International Electron Devices Meeting (IEDM), DEC 11-16, 2021
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    Disruptive Technology Elements, and Rapid and Accurate Block-Level Performance Evaluation for 3nm and Beyond

    Na, Myung Hee  
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    Jang, Doyoung  
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    Baert, Rogier  
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    Sarkar, Satadru  
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    Patli, Sudhir  
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    Zografos, Odysseas  
    Proceedings paper
    2021, 5th IEEE Electron Devices Technology and Manufacturing Conference (EDTM), APR 08-11, 2021
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    Dry removal of a surface functionalization chemistry used for pattern collapse prevention

    Vereecke, Guy  
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    Komori, Kana
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    Nakano, Yuta
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    Sebaai, Farid  
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    Xu, XiuMei  
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    Oniki, Yusuke  
    Meeting abstract
    2018, Surface Preparation & Cleaning Conference - SPCC, 10/04/2018
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    Enabling CMOS scaling towards 3nm and beyond

    Mocuta, Anda
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    Weckx, Pieter  
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    Demuynck, Steven  
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    Radisic, Alex  
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    Oniki, Yusuke  
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    Ryckaert, Julien  
    Proceedings paper
    2018, IEEE Symposium on VLSI Technology, 19/06/2018, p.147-148
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    Enabling complimentary FET (CFET) fabrication: selective, isotropic etch of Group IV semiconductors

    Kal, Subhadeep
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    Oniki, Yusuke  
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    Falugh, Matthew
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    Pereira, Cheryl
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    Wang, Qi
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    Holsteyns, Frank  
    Meeting abstract
    2019, Advanced Etch Technology for Nanopatterning VIII, 24/02/2019, p.109630L
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    Enhanced light coupling into nanostructured arrays as an enabler for advanced Raman-based metrology

    Nuytten, Thomas  
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    Bogdanowicz, Janusz  
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    Gawlik, Andrzej  
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    Oniki, Yusuke  
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    Kenis, Karine  
    Meeting abstract
    2021, META 2021: 11th International Conference on Metamaterials, Photonic Crystals and Plasmonics, 20/07/2021
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    FinFETs with Thermally Stable RMG Gate Stack for Future DRAM Peripheral Circuits

    Capogreco, Elena  
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    Arimura, Hiroaki  
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    Ritzenthaler, Romain  
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    Brus, Stephan  
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    Oniki, Yusuke  
    Proceedings paper
    2022, International Electron Devices Meeting (IEDM), DEC 03-07, 2022
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    First demonstration of ruthenium and molybdenum word lines integrated into 40nm ptch 3D NAND memory devices

    Ajaykumar, Arjun  
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    Breuil, Laurent  
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    Katcko, Kostantine  
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    Schleicher, Filip  
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    Sebaai, Farid  
    Proceedings paper
    2021, 2021 Symposium on VLSI Technology, 13/06/2021
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    First demonstration of Two Metal Level Semi-damascene Interconnects with Fully Self-aligned Vias at 18MP

    Murdoch, Gayle  
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    O'Toole, Martin  
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    Marti, Giulio  
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    Pokhrel, Ankit  
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    Tsvetanova, Diana  
    Proceedings paper
    2022-06-15, VLSI Technology and Circuits, 12-17 June 2022
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    Forksheet FETs for Advanced CMOS Scaling: Forksheet-Nanosheet Co-Integration and Dual Work Function Metal Gates at 17nm N-P Space

    Mertens, Hans  
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    Ritzenthaler, Romain  
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    Oniki, Yusuke  
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    Briggs, Basoene  
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    Chan, BT  
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    Hikavyy, Andriy  
    Proceedings paper
    2021, 2021 Symposium on VLSI Technology, 13/06/2021
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    Forksheet FETs with Bottom Dielectric Isolation, Self-Aligned Gate Cut, and Isolation between Adjacent Source-Drain Structures

    Mertens, Hans  
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    Ritzenthaler, Romain  
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    Oniki, Yusuke  
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    Puttarame Gowda, Pallavi  
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    Mannaert, Geert  
    Proceedings paper
    2022, International Electron Devices Meeting (IEDM), DEC 03-07, 2022
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    Functional water solutions to enable advanced wet cleaning process for next generation semiconductor device manufacturing

    Iino, Hideaki
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    Tanaka, Yoichi  
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    Gan, Nobuko
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    Fukui, Takeo
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    Akanishi, Yuya  
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    Iwahata, Shota  
    Meeting abstract
    2021, Ultrapure Micro 2021 Annual Conference, 3-5 November 2021
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    Functional water solutions to enable wet cleaning process for leading edge semiconductor device manufacturing

    Kesters, Els  
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    Hideaki, Iino
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    Yuichi, Ogawa
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    Oniki, Yusuke  
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    Le, Quoc Toan  
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    Holsteyns, Frank  
    Meeting abstract
    2019, The Surface Preparation and Cleaning Conference (SPCC) 2019, 1/04/2019
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    Insights into Scaled Logic Devices Connected from Both Wafer Sides

    Veloso, Anabela  
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    Eneman, Geert  
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    Matagne, Philippe  
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    Vermeersch, Bjorn  
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    Jourdain, Anne  
    Proceedings paper
    2022, International Electron Devices Meeting (IEDM), DEC 03-07, 2022
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