Browsing by Author "Phommahaxay, Alain"
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Publication 10 and 7 mu m Pitch Thermo-compression Solder Joint, Using A Novel Solder Pillar And Metal Spacer Process
Proceedings paper2020, 70th IEEE Electronic Components and Technology Conference (ECTC), JUN 03-30, 2020, p.617-622Publication 2D material integration in the semiconductor industry: Challenges and Solutions
Meeting abstract2019, Graphene week 2019, 23/09/2019Publication 2D materials: roadmap to CMOS integration
Proceedings paper2018, IEEE Electron Devices Meeting - IEDM, 1/12/2018, p.512-515Publication 300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications
Meeting abstract2010-11, IEEE International 3D System Integration Conference - 3DIC, 16/11/2010Publication A 60GHz silicon micromachined cavity resonator with integrated tuning MEMS array
Proceedings paper2009, MEMSWAVE Symposium, 6/07/2009, p.27-30Publication A MEMS 0-level packaging technology based on CuSn/Cu chip capping bonding
Proceedings paper2011, 22nd Micromechanics and Micro systems Europe Workshop - MME, 19/06/2011, p.B27Publication A novel fan-out concept for ultra-high chip-to-chip interconnect density with 20-μm pitch
Proceedings paper2018, 68th Electronic Components and Technology Conference - ECTC, 29/05/2018, p.370-378Publication A novel method for characterization of Ultra Low Viscosity NCF layers using TCB for 3D Assembly
Meeting abstract2020, IMAPS 53rd International Symposium on Microelectronics, 6/10/2020Publication A Study of SiCN Wafer-to-Wafer Bonding and Impact of Wafer Warpage
; ; ; ; Publication A unique temporary bond solution based on a thermoplastic material tacky at room temperature and highly thermally resistant application extension from 3D-SIC to FO-WLP
Oral presentation2017, Electronic Components and Technology Conference - ECTCPublication Acoustic modulation during laser debonding of collective hybrid bonded dies
Proceedings paper2021, IEEE 71st Electronic Components and Technology Conference (ECTC), JUN 01-JUL 04, 2021, p.2126-2133Publication Advanced dicing technologies for combination of wafer to wafer and collective die to wafer fusion bonding
Proceedings paper2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 28/05/2018, p.437Publication Advances in SiCN-SiCN bonding with high accuracy wafer-to-wafer (W2W) stacking technology
Proceedings paper2018, IEEE International Interconnect Technology Conference - IITC, 4/06/2018, p.985-992Publication Advances in temporary carrier technology for high density fan-out device build-up
Proceedings paper2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 28/05/2019, p.340-345Publication Advances in thin wafer debonding and ultra thin 28nm FinFET substrate transfer
Meeting abstract2017, IEEE 67th Electronic Components and Technology Conference - ECTC, 30/05/2017, p.740-745Publication Carrier Systems for Collective Die-to-Wafer Bonding
Proceedings paper2022, 72nd IEEE Electronic Components and Technology Conference (ECTC), MAY 31-JUN 01, 2022, p.2058-2063Publication Challenges and solutions on pre-assembly processes for thinned 3D wafers with micro-bumps on the backside
Proceedings paper2014, 16th IEEE Electronic Packaging Technology Conference - EPTC, 3/12/2014, p.75-79Publication Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding
Publication Characterization of inorganic dielectric layers for low thermal budget wafer to wafer bonding
Proceedings paper2017, 5th International Workshop on Low Temperature Bonding for 3D Integration - LTB-3D, 16/05/2017, p.24Publication Characterization of silicon carbon nitride for low temperature wafer-to-wafer direct bonding
Meeting abstract2020, PRiME 2020: Semiconductor Wafer Bonding: Science, Technology, and Applications 16, 4/10/2020, p.G01-1650