Browsing by Author "Santoro, Gaetano"
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Publication 3D-carrier profiling and parasitic resistance analysis in vertically stacked gate-all-around Si nanowire CMOS transistors
Proceedings paper2019, IEEE International Electron Devices Meeting - IEDM 2019, 7/12/2019, p.238-241Publication Characterizing immersion lithography micro bridge defects using advanced features of teh SEMVision G3 STAR FIB
Proceedings paper2009, 6th International Symposium on Immersion Lithography Extensions, 22/10/2009Publication CMP of a RU based layer in an advanced Cu low-k stack
Proceedings paper2007-10, International Conference on Planarization CMP Technology - ICPT, 25/10/2007, p.43-48Publication Direct yield prediction from SEM images
;Choona, Lilach ;Linshiz, Jasmine ;Pres, Shaul ;Levant, Boris ;Tal, NoamSantoro, GaetanoProceedings paper2023, Conference on Metrology, Inspection, and Process Control XXXVII, FEB 27-MAR 02, 2023, p.124960QPublication e-beam metrology of thin resist for high NA EUVL
; ; ; ; ; Journal article review2023, JAPANESE JOURNAL OF APPLIED PHYSICS, (62) SG, p.Art. SG0808Publication Enabling Non-Actinic EUV Mask Inspection using CNT Pellicle
;Keshet, Mor ;Gershon, Dor ;Malul, Uriel ;Blinder, Yaniv ;Orr, YonatanTam, AviramProceedings paper2021, Conference on Extreme Ultraviolet (EUV) Lithography XII, FEB 22-26, 2021, p.1160910Publication EUV mask defectivity study by existing DUV tools and new EBEAM technology
Oral presentation2010, SPIE Photomask TechnologyPublication Metrology of Thin Resist for High NA EUVL
Proceedings paper2022, Conference on Metrology, Inspection, and Process Control XXXVI Part of SPIE Advanced Lithography and Patterning Conference, FEB 24-MAY 27, 2022, p.12053OOPublication Micro-bridge defects: characterization and root cause analysis
Proceedings paper2010, Metrology, Inspection and Process Control for Microlithography XXIV, 21/02/2010, p.763820Publication Post-direct-CMP dielectric surface copper contamination: quantitative analysis and impact on dielectric breakdown behaviour
Proceedings paper2009, Advanced Metallization Conference 2008 (AMC2008), 23/09/2008, p.415-429Publication Post-direct-CMP dielectric surface copper contamination: quantitative analysis and impact on dielectric breakdown behaviour
Meeting abstract2008, Advanced Metallization Conference - AMC, 23/09/2008Publication Recess metrology challenges for 3D device architectures in advanced technology nodes
Proceedings paper2022, Conference on Metrology, Inspection, and Process Control XXXVI Part of SPIE Advanced Lithography and Patterning Conference, FEB 24-MAY 27, 2022, p.120530LPublication Scaled, novel effective workfunction metal gate stacks for advanced Low-VT, gate-all-around vertically stacked nanosheet FETs with reduced vertical distance between sheets
Proceedings paper2019, 2019 International Conference on Solid State Devices and Materials (SSDM 2019), 2/09/2019, p.559-560Publication Vertically stacked gate-all-around Si nanowire CMOS transistors with reduced nanowires separation, new work function metal gate solutions, and DC/AC performance optimization
Proceedings paper2018, IEEE International Electron Devices Meeting - IEDM, 2/12/2018, p.508-511Publication Vertically stacked gate-all-around Si nanowire transistors: key process optimizations and ring oscillator demonstration
Proceedings paper2017, IEEE International Electron Devices Meeting - IEDM, 2/12/2017, p.828-831