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Browsing by Author "Shi, Xiaoping"

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    15nm half-pitch patterning: EUV + SELF-aligned double patterning

    Versluijs, Janko  
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    Souriau, Laurent  
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    Hellin, David  
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    Orain, Isabelle
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    Kimura, Yoshie
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    Kunnen, Eddy
    Oral presentation
    2012, International Symposium on Extreme Ultraviolet Lithography - EUVL
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    15nm HP patterning with EUV and SADP: key contributors for improvement of LWR, LER, and CDU

    Xu, Kaidong
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    Souriau, Laurent  
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    Hellin, David  
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    Versluijs, Janko  
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    Wong, Patrick  
    Proceedings paper
    2013, Advanced Etch Technology for Nanopatterning II, 23/02/2013, p.86850C
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    Achieving 9ps unloaded ring oscillator delay in FuSI/HfSiON with 0.8 nm EOT

    Rothschild, Aude
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    Shi, Xiaoping
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    Everaert, Jean-Luc
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    Kerner, Christoph  
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    Chiarella, Thomas  
    Proceedings paper
    2007, Symposium on VLSI Technology. Digest of Technical Papers, 14/06/2007, p.198-199
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    Atomic layer deposition of Gd-doped HfO2 thin films

    Adelmann, Christoph  
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    Tielens, Hilde  
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    Dewulf, Daan
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    Hardy, An  
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    Pierreux, Dieter  
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    Swerts, Johan  
    Journal article
    2010, Journal of the Electrochemical Society, (157) 4, p.G105-G110
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    Atomic layer deposition of GdHfOx thin films

    Adelmann, Christoph  
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    Pierreux, Dieter  
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    Swerts, Johan  
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    Rosseel, Erik  
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    Shi, Xiaoping
    Proceedings paper
    2009, Atomic Layer Deposition Applications 5, 4/10/2009, p.243-251
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    CMP-less integration of fully Ni-silicided metal gates in FinFETs by simultaneous silicidation of the source, drain, and the gate using a novel dual hard mask approach

    Kottantharayil, Anil
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    Verheyen, Peter  
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    Collaert, Nadine  
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    Dixit, Abhisek
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    Kaczer, Ben  
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    Snow, Jim
    Proceedings paper
    2005, Symposium on VLSI Technology. Digest of Technical Papers, 14/06/2005, p.198-199
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    Compatibility of polysilicon with HfO2-based gate dielectrics for CMOS applications

    Kaushik, V.
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    De Gendt, Stefan  
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    Caymax, Matty  
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    Young, E.
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    Röhr, Erika
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    Van Elshocht, Sven  
    Proceedings paper
    2003, ULSI Process Integration III, 28/04/2003, p.391-396
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    Demonstration of an InGaAs gate stack with sufficient PBTI reliability by thermal budget optimization, nitridation, high-k material choice, and interface dipole

    Franco, Jacopo  
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    Vais, Abhitosh  
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    Sioncke, Sonja
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    Putcha, Vamsi  
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    Kaczer, Ben  
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    Shie, Bo-Shiuan
    Proceedings paper
    2016, IEEE Symposium on VLSI Technology, 13/06/2016, p.42-43
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    Demonstration of Ni fully GermanoSilicide as a pFET gate electrode candidate on HfSiON

    Yu, HongYu
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    Singanamalla, Raghunath
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    Opsomer, Karl  
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    Augendre, Emmanuel
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    Simoen, Eddy  
    Proceedings paper
    2005, Technical Digest International Electron Devices Meeting (IEDM), 5/12/2005, p.27/05/2001-27/05/2004
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    Deposition of Poly-SiGe with RTCVD

    Shi, Xiaoping
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    Schaekers, Marc  
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    Brus, Stephan  
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    Zhao, Chao
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    Brijs, Bert
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    Yu, HongYu
    Proceedings paper
    2005-10, The 8th Technical and Scientific Meeting of CREMSI:FEOL from 130 to 65 nm : scaling challenges, 20/10/2005
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    Deposition of undoped and in-situ doped amorphous and polycrystalline silicon with LPCVD

    Schaekers, Marc  
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    Shi, Xiaoping
    Proceedings paper
    2005, 15th European Conference on Chemical Vapor Deposition - EUROCVD-15, 4/09/2005, p.652-658
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    Development of ALD HfZrOx with TDEAH, TDEAZ and H2O

    Shi, Xiaoping
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    Tielens, Hilde  
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    Takeoka, Shinji
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    Nakabayashi, Takashi
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    Nyns, Laura  
    Proceedings paper
    2010, China Semiconductor Technology International Conference - CSTIC, 18/03/2010, p.699-704
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    Development of ALD HfZrOx with TDEAH/TDEAZ and H2O

    Shi, Xiaoping
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    Tielens, Hilde  
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    Takeoka, Shinji
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    Nakabayashi, Takashi
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    Nyns, Laura  
    Journal article
    2011, Journal of the Electrochemical Society, (158) 1, p.H69-H74
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    Electrical characterization of the metal-vanadium dioxide interface and implications for memory applications

    Martens, Koen  
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    Radu, Iuliana  
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    Mertens, Sofie  
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    Shi, Xiaoping
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    Schaekers, Marc  
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    Tielens, Hilde  
    Oral presentation
    2011, 1st International Workshop on Resistive RAM
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    Electrical characterization of the metal-vanadium dioxide interface and vanadium dioxide work function

    Martens, Koen  
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    Radu, Iuliana  
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    Mertens, Sofie  
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    Shi, Xiaoping
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    Schaekers, Marc  
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    Tielens, Hilde  
    Proceedings paper
    2011, IEEE Semiconductor Interface Specialist Conference - SISC, 1/12/2011
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    Electrical properties of vanadium dioxide – dielectric – metal structures and the metal-insulator transition

    Martens, Koen  
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    Radu, Iuliana  
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    Mertens, Sofie  
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    Shi, Xiaoping
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    Schaekers, Marc  
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    De Gendt, Stefan  
    Meeting abstract
    2012, APS March Meeting, 27/02/2012, p.J16.012
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    Electrical properties of vanadium dioxide devices for micro-electronic applications making use of metal-insulator phase transitions

    Martens, Koen  
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    Radu, Iuliana  
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    Mertens, Sofie  
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    Adelmann, Christoph  
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    Shi, Xiaoping
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    Tielens, Hilde  
    Meeting abstract
    2011, American Physical Society, APS March Meeting, 21/03/2011, p.#D22.013
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    Evaluation of DiMethylAminoGermaniumTriChloride as a novel carbon-dopant and germanium precursor for germanium and silicon germanium chemical vapor deposition

    Leys, Frederik
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    Liu, Cong
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    Shi, Xiaoping
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    Lamare, B.
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    Takeuchi, Shotaro
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    Schaekers, Marc  
    Proceedings paper
    2008, SiGe, Ge, and Related Compounds 3: Materials, Processing, and Devices, 13/10/2008, p.159-162
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    Evaluation of DiMethylAminoGermaniumTriChloride as a novel carbon-dopant and germanium precursor for germanium and silicon germanium chemical vapor deposition

    Leys, Frederik
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    Liu, Cong
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    Shi, Xiaoping
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    Lamare, B.
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    Takeuchi, Shotaro
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    Schaekers, Marc  
    Meeting abstract
    2008, 214th ECS Meeting, 12/10/2008, p.2386
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    Highly scalable effective work function engineering approach for multi-VT modulation of planar and FinFET-based RMG high-k last devies for (sub-)22nm nodes

    Veloso, Anabela  
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    Boccardi, Guillaume  
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    Ragnarsson, Lars-Ake  
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    Higuchi, Yuichi
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    Lee, Jae Won
    Proceedings paper
    2013, Symposium on VLSI Technology, 11/06/2013, p.T194-T195
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