Browsing by Author "Soulie, Jean-Philippe"
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Publication A Novel Ni-Al Alloy Metal Induced Lateral Crystallization Process for Improved Channel Conduction in 3-D NAND Flash
Journal article2022, IEEE ELECTRON DEVICE LETTERS, (43) 12, p.2085-2088Publication Al3Sc thin films as alternative interconnect metallization
Oral presentation2022-03-28, MAM 2022Publication Al3Sc thin films for advanced interconnect applications
Journal article2024, MICROELECTRONIC ENGINEERING, (286) 1 March, p.Art. 112141Publication Aluminide intermetallics for advanced interconnect metallization: thin film studies
Proceedings paper2021, IEEE International Interconnect Technology Conference (IITC), JUL 06-09, 2021Publication Buried Power Rail Metal exploration towards the 1 nm Node
Proceedings paper2021, IEEE International Electron Devices Meeting (IEDM), DEC 11-16, 2021Publication Determination of optical constants of thin films in the EUV
Journal article2022, APPLIED OPTICS, (61) 8, p.2060-2078Publication Directional Etching of Barrierless NiAl Lines on 300-mm Wafers for Interconnects Applications
Journal article2024, IEEE ELECTRON DEVICE LETTERS, (45) 10, p.2033-2035Publication Electronic stopping cross section for He in Ru, derived from RBS spectra
Journal article2024, NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS, (553) August, p.Art. 165406Publication Epitaxial growth of magnetron sputtered NiAl on Ge mediated by native GeOx
Journal article2024, JOURNAL OF PHYSICS D-APPLIED PHYSICS, (57) 13, p.Art. 135309Publication Erase behavior of charge trap flash memory devices using high-k dielectric as blocking oxide liner
Meeting abstract2020, 51st IEEE Semiconductor Interface Specialists Conference - SISC, 16/12/2020, p.13.4Publication First demonstration of ruthenium and molybdenum word lines integrated into 40nm ptch 3D NAND memory devices
Proceedings paper2021, 2021 Symposium on VLSI Technology, 13/06/2021Publication Improved resistivity of NiAl thin films at low temperature for advanced interconnect metallization
Proceedings paper2022-06, 2022 IEEE International Interconnect Technology Conference (IITC), June 2022, p.73-75Publication Inflection points in interconnect research and trends for 2nm and beyond in order to solve the RC bottleneck
Proceedings paper2020, IEEE International Electron Devices Meeting (IEDM), DEC 12-18, 2020Publication Intermetallic Compounds as Alternatives to Copper for Advanced Interconnect Metallization
Proceedings paper2023, IEEE International Interconnect Technology Conference (IITC) / IEEE Materials for Advanced Metallization Conference (MAM), MAY 22-25, 2023Publication Investigation of Graphene Cap Formation on NiAl by Low Temperature Thermal CVD
Proceedings paper2024, 2024 International Interconnect Technology Conference, JUN 03-06, 2024Publication Mask absorber for next generation EUV lithography
Proceedings paper2020, Conference on Extreme Ultraviolet Lithography, SEP 21-25, 2020Publication Optical constants for EUV scatterometry
Proceedings paper2021, Modeling Aspects in Optical Metrology VII, 21/06/2021, p.117830MPublication Properties of NbxTi(1-x)N thin films deposited on 300 mm silicon wafers for upscaling superconducting digital circuits
Journal article2024, SUPERCONDUCTOR SCIENCE & TECHNOLOGY, (37) 7, p.Art. 075012Publication Reduced resistivity of NiAl by backthinning for advanced interconnect metallization
Proceedings paper2023, IEEE International Interconnect Technology Conference (IITC) / IEEE Materials for Advanced Metallization Conference (MAM), MAY 22-25, 2023Publication Resolving nanoscale composition fluctuations and defects in advanced interconnects: a crucial step to comprehend thin film resistivity.
Proceedings paper2024, 2024 International Interconnect Technology Conference, JUN 03-06, 2024