Browsing by Author "Subirats, Alexandre"
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Publication A new method for quickly evaluating reversible and permanent components of the BTI degradation
;Garros, X. ;Subirats, Alexandre ;Reimbold, G. ;Gaillard, F. ;Diouf, C. ;Federspiel, X.Huard, V.Proceedings paper2018, 2018 IEEE International Reliability Physics Symposium - IRPS, 11/03/2018, p.P-RT.6Publication Challenges for I/O towards the 3-nm node: Si/SiGe superlatttice I/O finFET in a horizontal nanowire technology and the increased ausceptibility of bulk finFET technology to single event latchup
Proceedings paper2018, Taiwan ESD and Reliability Conference, 7/09/2018Publication Channel and gate stack charge trapping investigation in vertical 3D NAND devices with poly-silicon channel
Proceedings paper2017, International Workshop on Characterization and Modeling of Memory Devices - IWCM2, 28/09/2017Publication Channel and near channel defects characterization in vertical InxGa1-xAs high mobility channels for future 3D NAND memory
Proceedings paper2016, IEEE Reliability Physics Symposium - IRPS, 17/04/2016, p.6C.4Publication Comparative experimental analysis of time-dependent variability using a transistor test array
Proceedings paper2016, IEEE International Reliability Physics Symposium - IRPS, 17/04/2016, p.XT-10Publication COMPHY - A compact-physics framework for unified modeling of BTI
Journal article2018, Microelectronics Reliability, 85, p.49-65Publication Defect-centric perspective of combined BTI and RTN time-dependent variability
Proceedings paper2015, International Integrated Reliability Workshop - IIRW, 11/10/2015Publication Demonstration of sufficient BTI reliability for a 14-nm FinFET 1.8V I/O technology featuring a thick ALD SiO2 IL and Ge p-channel
Proceedings paper2017, IEEE International Reliability Physics symposium - IRPS, 1/04/2017, p.FA-5.1-FA-5.4Publication Efficient physical defect model applied to PBTI in high-k stacks
Proceedings paper2017, IEEE International Reliability Physics Symposium - IRPS, 2/04/2017, p.XT-11.1-XT-11.6Publication Electrical characterization of BEOL plasma-induced damage in bulk FinFET technology
Journal article2019, IEEE Transactions on Device and Materials Reliability, (19) 1, p.88-89Publication Experimental and theoretical verification of channel conductivity degradation due to grain boundaries and defects in 3D NAND
Proceedings paper2017, IEEE International Electron Devices Meeting - IEDM, 2/12/2017, p.517-520Publication Feasibility of InxGa1-xAs high mobility channel for 3-D NAND memory
Journal article2017, IEEE Transactions on Electron Devices, (64) 1, p.130-136Publication First demonstration of SiGe channel in Macaroni geometry for future 3D NAND devices
Proceedings paper2017, International Memory Workshop, 15/05/2017, p.1-4Publication Gate stack thermal stability and PBTI reliability challenges for 3D sequential integration: demonstration of a suitable gate stack for top and bottom tier nMOS
Proceedings paper2017, IEEE International Reliability Physics Symposium - IRPS, 2/04/2017, p.2B-3.1-2B3.5Publication Hot-carrier analysis on nMOS Si finFETs with solid source doped junctions
Proceedings paper2016, IEEE International Reliaability Physics - IRPS, 17/04/2016, p.4B.4Publication Impact of discrete trapping in high pressure deuterium annealed and doped poly-Si channel 3D NAND macaroni
Proceedings paper2017, IEEE International Reliability Physics Symposium - IRPS, 2/04/2017, p.5A-2.1-5A-2.6Publication Impact of SiON tunnel layer composition on 3D NAND cell performance
Proceedings paper2019, 2019 IEEE 11th International Memory Workshop (IMW), 12/05/2019, p.152-155Publication Impact of the electronic band structure on the reliability of triple Layer a-VMCO devices
Proceedings paper2017, IEEE International Reliability Physics Symposium - IRPS, 2/04/2017, p.PM-10.1-PM-10.5Publication In depth analysis of post-program VT instability after electrical stress in 3D SONOS memories
Proceedings paper2016-05, International Memory Workshop - IMW, 15/05/2016, p.84-87Publication Investigation of the endurance of FE-HfO2 devices by means of TDDB studies
Proceedings paper2018, IEEE International Reliability Physics Symposium - IRPS, 11/03/2018, p.6D.3-1-6D.3-7