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Browsing by Author "Subirats, Alexandre"

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    A new method for quickly evaluating reversible and permanent components of the BTI degradation

    Garros, X.
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    Subirats, Alexandre
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    Reimbold, G.
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    Gaillard, F.
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    Diouf, C.
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    Federspiel, X.
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    Huard, V.
    Proceedings paper
    2018, 2018 IEEE International Reliability Physics Symposium - IRPS, 11/03/2018, p.P-RT.6
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    Challenges for I/O towards the 3-nm node: Si/SiGe superlatttice I/O finFET in a horizontal nanowire technology and the increased ausceptibility of bulk finFET technology to single event latchup

    Hellings, Geert  
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    Mertens, Hans  
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    Karp, James
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    Maillard, Pierre
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    Subirats, Alexandre
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    Simoen, Eddy  
    Proceedings paper
    2018, Taiwan ESD and Reliability Conference, 7/09/2018
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    Channel and gate stack charge trapping investigation in vertical 3D NAND devices with poly-silicon channel

    Subirats, Alexandre
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    Arreghini, Antonio  
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    Breuil, Laurent  
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    Degraeve, Robin  
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    Van den Bosch, Geert  
    Proceedings paper
    2017, International Workshop on Characterization and Modeling of Memory Devices - IWCM2, 28/09/2017
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    Channel and near channel defects characterization in vertical InxGa1-xAs high mobility channels for future 3D NAND memory

    Subirats, Alexandre
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    Capogreco, Elena  
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    Degraeve, Robin  
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    Arreghini, Antonio  
    Proceedings paper
    2016, IEEE Reliability Physics Symposium - IRPS, 17/04/2016, p.6C.4
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    Comparative experimental analysis of time-dependent variability using a transistor test array

    Simicic, Marko  
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    Subirats, Alexandre
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    Weckx, Pieter  
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    Kaczer, Ben  
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    Franco, Jacopo  
    Proceedings paper
    2016, IEEE International Reliability Physics Symposium - IRPS, 17/04/2016, p.XT-10
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    COMPHY - A compact-physics framework for unified modeling of BTI

    Rzepa, Gerhard
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    Franco, Jacopo  
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    O'Sullivan, Barry  
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    Subirats, Alexandre
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    Simicic, Marko  
    Journal article
    2018, Microelectronics Reliability, 85, p.49-65
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    Defect-centric perspective of combined BTI and RTN time-dependent variability

    Weckx, Pieter  
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    Kaczer, Ben  
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    Franco, Jacopo  
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    Roussel, Philippe  
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    Bury, Erik  
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    Subirats, Alexandre
    Proceedings paper
    2015, International Integrated Reliability Workshop - IIRW, 11/10/2015
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    Demonstration of sufficient BTI reliability for a 14-nm FinFET 1.8V I/O technology featuring a thick ALD SiO2 IL and Ge p-channel

    Hellings, Geert  
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    Subirats, Alexandre
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    Franco, Jacopo  
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    Schram, Tom  
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    Ragnarsson, Lars-Ake  
    Proceedings paper
    2017, IEEE International Reliability Physics symposium - IRPS, 1/04/2017, p.FA-5.1-FA-5.4
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    Efficient physical defect model applied to PBTI in high-k stacks

    Rzepa, G.
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    Franco, Jacopo  
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    Subirats, Alexandre
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    Jech, M.
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    Vaisman Chasin, Adrian  
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    Grill, A.
    Proceedings paper
    2017, IEEE International Reliability Physics Symposium - IRPS, 2/04/2017, p.XT-11.1-XT-11.6
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    Electrical characterization of BEOL plasma-induced damage in bulk FinFET technology

    Hiblot, Gaspard  
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    Subirats, Alexandre
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    Liu, Yefan  
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    Van der Plas, Geert  
    Journal article
    2019, IEEE Transactions on Device and Materials Reliability, (19) 1, p.88-89
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    Experimental and theoretical verification of channel conductivity degradation due to grain boundaries and defects in 3D NAND

    Subirats, Alexandre
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    Arreghini, Antonio  
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    Capogreco, Elena  
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    Delhougne, Romain  
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    Tan, Chi Lim
    Proceedings paper
    2017, IEEE International Electron Devices Meeting - IEDM, 2/12/2017, p.517-520
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    Feasibility of InxGa1-xAs high mobility channel for 3-D NAND memory

    Capogreco, Elena  
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    Subirats, Alexandre
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    Lisoni, Judit Gloria
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    Arreghini, Antonio  
    Journal article
    2017, IEEE Transactions on Electron Devices, (64) 1, p.130-136
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    First demonstration of SiGe channel in Macaroni geometry for future 3D NAND devices

    Arreghini, Antonio  
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    Delhougne, Romain  
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    Subirats, Alexandre
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    Hikavyy, Andriy  
    Proceedings paper
    2017, International Memory Workshop, 15/05/2017, p.1-4
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    Gate stack thermal stability and PBTI reliability challenges for 3D sequential integration: demonstration of a suitable gate stack for top and bottom tier nMOS

    Franco, Jacopo  
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    Witters, Liesbeth  
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    Vandooren, Anne  
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    Arimura, Hiroaki  
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    Sioncke, Sonja
    Proceedings paper
    2017, IEEE International Reliability Physics Symposium - IRPS, 2/04/2017, p.2B-3.1-2B3.5
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    Hot-carrier analysis on nMOS Si finFETs with solid source doped junctions

    Vaisman Chasin, Adrian  
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    Franco, Jacopo  
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    Ritzenthaler, Romain  
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    Hellings, Geert  
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    Cho, Moon Ju
    Proceedings paper
    2016, IEEE International Reliaability Physics - IRPS, 17/04/2016, p.4B.4
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    Impact of discrete trapping in high pressure deuterium annealed and doped poly-Si channel 3D NAND macaroni

    Subirats, Alexandre
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    Arreghini, Antonio  
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    Breuil, Laurent  
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    Degraeve, Robin  
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    Van den Bosch, Geert  
    Proceedings paper
    2017, IEEE International Reliability Physics Symposium - IRPS, 2/04/2017, p.5A-2.1-5A-2.6
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    Impact of SiON tunnel layer composition on 3D NAND cell performance

    Breuil, Laurent  
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    Nyns, Laura  
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    Banerjee, Kaustuv  
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    Vadakupudhu Palayam, Senthil  
    Proceedings paper
    2019, 2019 IEEE 11th International Memory Workshop (IMW), 12/05/2019, p.152-155
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    Impact of the electronic band structure on the reliability of triple Layer a-VMCO devices

    Belmonte, Attilio  
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    Govoreanu, Bogdan  
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    Subirats, Alexandre
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    Di Piazza, Luca  
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    Goux, Ludovic  
    Proceedings paper
    2017, IEEE International Reliability Physics Symposium - IRPS, 2/04/2017, p.PM-10.1-PM-10.5
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    In depth analysis of post-program VT instability after electrical stress in 3D SONOS memories

    Subirats, Alexandre
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    Arreghini, Antonio  
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    Van den Bosch, Geert  
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    Degraeve, Robin  
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    Linten, Dimitri  
    Proceedings paper
    2016-05, International Memory Workshop - IMW, 15/05/2016, p.84-87
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    Investigation of the endurance of FE-HfO2 devices by means of TDDB studies

    Florent, Karine
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    Subirats, Alexandre
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    Lavizzari, Simone
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    Degraeve, Robin  
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    Celano, Umberto  
    Proceedings paper
    2018, IEEE International Reliability Physics Symposium - IRPS, 11/03/2018, p.6D.3-1-6D.3-7
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