Browsing by author "Carbonell, Laure"
Now showing items 21-40 of 76
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Development of a SEM based methodology for the detection of sub-surface voids in nano-interconnects
Carbonell, Laure; Caluwaerts, Rudy; Heylen, Nancy; Volders, Henny; Kellens, Kristof; Tokei, Zsolt; Takada, S; Ban, N; Ishimoto, T; Suzuki, N.; Umehara, S. (2012) -
Development of a wet silicon removal process for replacement metal gate and sacrificial fin
Suhard, Samuel; Sebaai, Farid; Pacco, Antoine; Veloso, Anabela; Carbonell, Laure; Claes, Martine; Struyf, Herbert; Mertens, Paul; De Gendt, Stefan (2011) -
Development of a wet silicon removal process for replacement metal gate and sacrificial fin
Suhard, Samuel; Sebaai, Farid; Pacco, Antoine; Veloso, Anabela; Carbonell, Laure; Claes, Martine; Struyf, Herbert; Mertens, Paul; De Gendt, Stefan (2011) -
Dry oxidation mechanisms of copper in trenches
Carbonell, Laure; Ratchev, Petar; Caluwaerts, Rudy; Van Hove, Marleen; Verlinden, B.; Maex, Karen (2002) -
Effect of plasma treatments on a low-k dielectric polymer surface
Martin Hoyas, Ana; Schuhmacher, Jorg; Whelan, Caroline; Baklanov, Mikhaïl; Carbonell, Laure; Celis, Jean-Pierre; Maex, Karen (2005) -
Electrochemistry in microelectronics: interconnects
Carbonell, Laure; Whelan, Caroline (2004) -
Electromigration study of ultra narrow copper lines in low-k dielectric
Croes, Kristof; Moon, Kwang Jin; Carbonell, Laure; Struyf, Herbert; Heylen, Nancy; Tokei, Zsolt; Beyer, Gerald (2007) -
Evaluation of an advanced organic ultra-low-k material
Ferchichi, Abdelkarim; Travaly, Youssef; Carbonell, Laure; Vanstreels, Kris; Beyer, Gerald; Baklanov, Mikhaïl; Asakuma, S.; Nakajima, M. (2009) -
Evaluation of metallization options for advanced Cu interconnects application
Jourdan, Nicolas; Carbonell, Laure; Heylen, Nancy; Swerts, Johan; Armini, Silvia; Maestre Caro, Arantxa; Demuynck, Steven; Croes, Kristof; Beyer, Gerald; Tokei, Zsolt; Van Elshocht, Sven; Vancoille, Eric (2011) -
Filling of 80 nm structures using a novel copper oxide reduction and reflow approach
Carbonell, Laure; Palmans, Roger; Travaly, Youssef; Brongersma, Sywert; Maex, Karen (2004) -
Filling of 80nm trenches using a novel copper oxide reduction and reflow approach
Carbonell, Laure; Palmans, Roger; Travaly, Youssef; Tokei, Zsolt; Jonas, Alain M.; Brongersma, Sywert; Maex, Karen (2005) -
GaN-on-Si process defect detection and analysis for HB-LEDs and power devices
Halder, Sandip; Stiers, Karen; Kandaswamy, Prem Kumar; Rosmeulen, Maarten; Carbonell, Laure; Saripalli, Yoga; Osman, Haris; Rosseel, Erik; Mani, Antonio; Hu, Qiona; Vedula, Srinivas; Polli, Marco (2013) -
High Q inductor add-on module in thick Cu/SiLK/sup TM/ single damascene
Jenei, Snezana; Decoutere, Stefaan; Winderickx, Gillis; Struyf, Herbert; Tokei, Zsolt; Vervoort, Iwan; Vos, I.; Jaenen, Patrick; Carbonell, Laure; De Jaeger, Brice; Donaton, R. A.; Vanhaelemeersch, Serge; Maex, Karen; Nauwelaers, Bart (2001) -
High-Q RF inductors on standard silicon realized using wafer-level packaging techniques
Carchon, Geert; Jenei, Snezana; Carbonell, Laure; Van Hove, Marleen; Decoutere, Stefaan; De Raedt, Walter; Maex, Karen; Beyne, Eric (2003) -
Impact of direct CMP on surface and bulk properties of high porosity low-k materials
Heylen, Nancy; Sinapi, Fabrice; Travaly, Youssef; Vereecke, Guy; Baklanov, Mikhaïl; Carbonell, Laure; Van Hoeymissen, Jan; Hellin, David; Hernandez, Jose Luis (2007) -
Impact of LER on BEOL dielectric reliability: a quantitative model and experimental validation
Tokei, Zsolt; Roussel, Philippe; Stucchi, Michele; Versluijs, Janko; Ciofi, Ivan; Carbonell, Laure; Beyer, Gerald; Cockburn, Andrew; Augustin, M.; Shah, Kavita (2009) -
Impact of material/process interactions on the properties of a porous CVD-O3 low-k dielectric film
Travaly, Youssef; Eyckens, Brenda; Carbonell, Laure; Rothschild, Aude; Le, Quoc Toan; Brongersma, Sywert; Ciofi, Ivan; Struyf, Herbert; Furukawa, Yukiko; Stucchi, Michele; Schaekers, Marc; Bender, Hugo; Rosseel, Erik; Vanhaelemeersch, Serge; Maex, Karen; Gaillard, F.; Van Autryve, Luc; Rabinzohn, P. (2002) -
Implementation of Ru based barriers in 50 nm half pitch single damascene Cu/SiCOH (k=2.5) structures
Carbonell, Laure; Volders, Henny; Heylen, Nancy; Kellens, Kristof; Tokei, Zsolt; Hendrickx, Dirk; Struyf, Herbert; Vandervorst, Alain; Claes, Martine; Lux, Marcel; Versluijs, Janko; Alaerts, Wilfried; Van Besien, Els; Deweerdt, Bruno; Vaes, Jan; Caluwaerts, Rudy; Cockburn, Andrew; Gravey, Virginie; Shah, Kavita; Al-Bayati, A.; Fu, X.; Lubben, D.; Sundarrajan, A.; Beyer, Gerald (2008) -
Implementation of Ru based barriers in 50 nm half pitch single damascene Cu/SiCOH (k=2.5) structures
Carbonell, Laure; Volders, Henny; Heylen, Nancy; Kellens, Kristof; Tokei, Zsolt; Hendrickx, Dirk; Struyf, Herbert; Claes, Martine; Versluijs, Janko; Van Besien, Els; Caluwaerts, Rudy; Cockburn, Andrew; Gravey, Virginie; Shah, Kavita; Al-Bayati, Amir; Fu, X.; Lubben, D.; Sundarrajan, A.; Beyer, Gerald (2009) -
Increasing the mean grain size in copper films and features
Vanstreels, Kris; Brongersma, Sywert; Tokei, Zsolt; Carbonell, Laure; De Ceuninck, Ward; D'Haen, Jan; D'Olieslaeger, Marc (2008)