Browsing by author "Verbinnen, Greet"
Now showing items 1-20 of 22
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3D sequential stacked planar devices featuring low-temperature replacement metal gate junctionless top devices with improved reliability
Vandooren, Anne; Franco, Jacopo; Parvais, Bertrand; Wu, Zhicheng; Witters, Liesbeth; Walke, Amey; Li, Waikin; Peng, Lan; Deshpande, Veeresh Vidyadhar; Bufler, Fabian; Rassoul, Nouredine; Hellings, Geert; Jamieson, Geraldine; Inoue, Fumihiro; Verbinnen, Greet; Devriendt, Katia; Teugels, Lieve; Heylen, Nancy; Vecchio, Emma; Tao, Zheng; Rosseel, Erik; Vanherle, Wendy; Hikavyy, Andriy; Chan, BT; Ritzenthaler, Romain; Besnard, Guillaume; Schwarzenbach, Walter; Gaudin, Gweltaz; Radu, Ionut; Nguyen, Bich-Yen; Waldron, Niamh; De Heyn, Vincent; Mocuta, Dan; Collaert, Nadine (2018-11) -
3D sequential stacked planar devices on 300 mm wafers featuring replacement metal gate junction-less top devices processed at 525°C with improved reliability
Vandooren, Anne; Franco, Jacopo; Parvais, Bertrand; Wu, Zhicheng; Witters, Liesbeth; Walke, Amey; Li, Waikin; Peng, Lan; Deshpande, Veeresh Vidyadhar; Bufler, Fabian; Rassoul, Nouredine; Hellings, Geert; Jamieson, Geraldine; Inoue, Fumihiro; Verbinnen, Greet; Devriendt, Katia; Teugels, Lieve; Heylen, Nancy; Vecchio, Emma; Tao, Zheng; Rosseel, Erik; Vanherle, Wendy; Hikavyy, Andriy; Chan, BT; Ritzenthaler, Romain; Besnard, Guillaume; Schwarzenbach, Walter; Gaudin, Gweltaz; Radu, Ionut; Nguyen, Bich-Yen; Waldron, Niamh; De Heyn, Vincent; Mocuta, Dan; Collaert, Nadine (2018) -
A unique temporary bond solution based on a thermoplastic material tacky at room temperature and highly thermally resistant application extension from 3D-SIC to FO-WLP
Phommahaxay, Alain; Nakamura, Atsushi; Potoms, Goedele; Bertheau, Julien; Bex, Pieter; Duval, Fabrice; Podpod, Arnita; Verbinnen, Greet; Kamochi, Yoshitaka; Sawano, Mitsuru; Beyer, Gerald; Sleeckx, Erik; Beyne, Eric (2017) -
Advances in thin wafer debonding and ultra thin 28nm FinFET substrate transfer
Phommahaxay, Alain; Guerrero, Alice; Jourdain, Anne; Potoms, Goedele; Verbinnen, Greet; Bai, Dongshun; Yess, Kim; Arnold, Kim; Sleeckx, Erik; Beyer, Gerald; Beyne, Eric (2017) -
Cleaning requirement in the thinning module for 3D-Stacked IC (3D-SIC) integration
Wostyn, Kurt; Zhao, Ming; Cui, Hushan; Laermans, Patrick; Jourdain, Anne; Verbinnen, Greet; Struyf, Herbert; De Strycker, Steven; Claes, Martine; Travaly, Youssef; Leunissen, Peter (2010) -
Demonstration of a novel low cost single material temporary bond solution for high topography substrates based on a mechanical wafer debonding and innovative adhesive removal
Phommahaxay, Alain; Nakamura, Atsushi; Jourdain, Anne; Verbinnen, Greet; Kamochi, Yoshitaka; Koyama, Ichiro; Iwai, Yu; Sawano, Mitsuru; Tan, Shiro; Miller, Andy; Beyer, Gerald; Sleeckx, Erik; Beyne, Eric (2015) -
Demonstration of ultra-thin Si grinding process controlled by in-situ non-contact gauge for 3D stacked IC (3D-SIC)
Zhao, Ming; Verbinnen, Greet; Yoshida, Shinji; Hayakawa, Susumu; Tabuchi, Tomotaka; Jourdain, Anne; Beyne, Eric; Swinnen, Bart; Leunissen, Peter (2010) -
Dry etch challenges for implantable silicon-based semi-flexible neural probe fabrication
Tutunjyan, Nina; Andrei, Alexandru; Verbinnen, Greet; Slabbekoorn, John; Eberle, Wolfgang; Baier, Ulrich; Boullart, Werner (2011) -
Extremely low force debonding of thinned CMOS substrate by laser release of a temporary bond material
Phommahaxay, Alain; Potoms, Goedele; Verbinnen, Greet; Sleeckx, Erik; Beyer, Gerald; Beyne, Eric; Guerrero, Alice; Donghun, Bai; Xiao, Liu; Yess, Kim; Arnold, Kim; Spiess, Walter; Griesbach, Tim; Rapps, Thomas; Lutter, Stefan (2016) -
Fabrication and successful in-vivo implantation of a flexible neural implant with a hybrid polyimide-silicon design
Andrei, Alexandru; Tutunjyan, Nina; Verbinnen, Greet; Van Put, Steven; Krylychkina, Olga; Eberle, Wolfgang; Musa, Silke (2012-09) -
Integration and manufacturing aspects of moving from HT-10.10 to ZoneBOND™ in temporary wafer bonding and debonding for 3D applications
Jourdain, Anne; Phommahaxay, Alain; Verbinnen, Greet; Murdoch, Gayle; Miller, Andy; Rebibis, Kenneth June; Guerrero, Alice; McCutcheon, Jeremy; Privett, Mark; Neidrich, Jason; Beyer, Gerald; Beyne, Eric (2013) -
Integration challenges of Cu pillars with extreme wafer thinning for 3D stacking and packaging
Buisson, Thibault; Potoms, Goedele; Phommahaxay, Alain; Verbinnen, Greet; Jaenen, Patrick; La Manna, Antonio; Travaly, Youssef; Beyne, Eric (2011) -
Integration of the ZoneBOND™ temporary bonding material in backside processing for 3D applications
Jourdain, Anne; Phommahaxay, Alain; Verbinnen, Greet; Suhard, Samuel; Miller, Andy; Swinnen, Bart; Beyer, Gerald; Beyne, Eric (2012-09) -
Key challenges and opportunities for 3D sequential integration
Vandooren, Anne; Witters, Liesbeth; Franco, Jacopo; Mallik, Arindam; Parvais, Bertrand; Wu, Zhicheng; Li, Waikin; Rosseel, Erik; Hikavyy, Andriy; Peng, Lan; Rassoul, Nouredine; Jamieson, Geraldine; Inoue, Fumihiro; Verbinnen, Greet; Devriendt, Katia; Teugels, Lieve; Heylen, Nancy; Vecchio, Emma; Tao, Zheng; Waldron, Niamh; Boemmels, Juergen; De Heyn, Vincent; Mocuta, Dan; Ryckaert, Julien; Collaert, Nadine (2018-10) -
On the fabrication of backside illuminated image sensors: bonding oxide, edge trimming and CMP rework routes
Cavaco, Celso; Peng, Lan; Sebaai, Farid; Verbinnen, Greet; Visker, Jakob; Van Olmen, Jan; Sabuncuoglu Tezcan, Deniz; Osman, Haris (2015) -
Process characterization of thin wafer debonding with thermoplastic materials
Phommahaxay, Alain; Jourdain, Anne; Verbinnen, Greet; Woitke, Tobias; Stieber, Ralf; Bisson, Peter; Gabriel, Markus; Spiess, Walter; Guerrero, Alice; McCutcheon, Jeremy; Puligadda, Rama; Bex, Pieter; Van den Eede, Axel; Swinnen, Bart; Beyer, Gerald; Miller, Andy; Beyne, Eric (2012) -
Sequential 3D: Key integration challenges and opportunities for advanced semiconductor scaling
Vandooren, Anne; Witters, Liesbeth; Franco, Jacopo; Mallik, Arindam; Parvais, Bertrand; Wu, Z.; Walke, Amey; Deshpande, Paru; Rosseel, Erik; Hikavyy, Andriy; Li, Waikin; Peng, L.; Rassoul, Nouredine; Jamieson, Geraldine; Inoue, Fumihiro; Verbinnen, Greet; Devriendt, Katia; Teugels, Lieve; Heylen, Nancy; Vecchio, Emma; Zheng, T.; Waldron, Niamh; De Heyn, Vincent; Mocuta, Dan; Collaert, Nadine (2018) -
Silicon microfluidics: an enabling technology for life sciences application
Majeed, Bivragh; Zhang, Lei; Fiorentino, Giuseppe; Verbinnen, Greet; Ashraf, Huma; Walsby, Edward; Roberts, Kerry; Al Kuzee, Jafar; Dawe, Rhys; Thomas, Dave; Sabuncuoglu Tezcan, Deniz (2017) -
Temporary bonding for high-topography applications: spin-on material versus dry film
Jourdain, Anne; Phommahaxay, Alain; Verbinnen, Greet; Guerrero, Alice; Bailey, Susan; Privett, Mark; Arnold, Kim; Miller, Andy; Rebibis, Kenneth June; Beyer, Gerald; Beyne, Eric (2014) -
Temporary wafer bonding defect impact assessment on substrate thinning, process enhancement through systematic defect track down
Phommahaxay, Alain; Verbinnen, Greet; Suhard, Samuel; Bex, Pieter; Van den Eede, Axel; Pancken, Joris; Lismont, Mark; Jourdain, Anne; Woitke, Tobias; Bisson, Peter; Spiess, Walter; Swinnen, Bart; Beyer, Gerald; Miller, Andy; Beyne, Eric (2012)