Browsing by author "Beral, Christophe"

28nm pitch single exposure patterning readiness by metal oxide resist on 0.33NA EUV Lithography

Kim, Il Hwan; Kim, Insung; Park, Changmin; Lee, Jsiun; Ryu, Koungmin; De Schepper, P.; Doise, J.; Kocsis, M.; De Simone, Danilo; Kljucar, Luka; Das, Poulomi; Blanc, Romuald; Beral, Christophe; Severi, Joren; Vandenbroeck, Nadia; Foubert, Philippe; Charley, Anne-Laure; Oak, Apoorva; Xu, Dongbo; Gillijns, Werner; Mitard, Jerome; Tokei, Zsolt; van der Veen, Marleen; Heylen, Nancy; Teugels, Lieve; Le, Quoc Toan; Schleicher, Filip; Leray, Philippe; Ronse, Kurt (2021)

ABI tool performance confirmation by NXE3300 printing results for native EUV blank defects at 16nm half pitch

Jonckheere, Rik; Yamane, Takeshi; Takagi, Noriaki; Watanabe, Hidehiro; Beral, Christophe (2016-11)

Co-optimization of lithographic and patterning processes for improved EPE performance

Maslow, Mark; Timoshkov, Vadim; Kiers, Ton; Jee, Tae Kwon; de Loijer, Peter; Morikita, Shinya; Demand, Mark; Metz, Andrew W; Okada, Soichiro; Kumar, Kaushik A.; Biesemans, Serge; Yaegashi, Hidetami; Di Lorenzo, Paolo; Bekaert, Joost; Mao, Ming; Beral, Christophe; Lariviere, Stephane (2017)

Detection of bonding voids for 3D integration

Chen, Cong; Van den Heuvel, Dieter; Beggiato, Matteo; Tunca Altintas, Bensu; Moussa, Alain; Vandooren, Anne; Baudemprez, Bart; Schobitz, Michael; Khaldi, Wassim; Bogdanowicz, Janusz; Beral, Christophe; Charley, Anne-Laure (2023)

Dry Resist Metrology Readiness for High-NA EUVL

Lorusso, Gian; Van den Heuvel, Dieter; Zidan, Mohamed; Moussa, Alain; Beral, Christophe; Charley, Anne-Laure; De Simone, Danilo; De Silva, Anuja; Verveniotis, Elisseos; Haider, Ali; Kondo, Tsuyoshi; Shindo, Hiroyuki; Ebizuka, Yasushi; Isawa, Miki (2023)

Electrical comparison of iN7 EUV hybrid and EUV single patterning BEOL metal layers

Lariviere, Stephane; Wilson, Chris; Kutrzeba Kotowska, Bogumila; Versluijs, Janko; Decoster, Stefan; Mao, Ming; van der Veen, Marleen; Jourdan, Nicolas; El-Mekki, Zaid; Heylen, Nancy; Kesters, Els; Verdonck, Patrick; Beral, Christophe; Van Den Heuvel, Dieter; De Bisschop, Peter; Bekaert, Joost; Blanco, Victor; Ciofi, Ivan; Wan, Danny; Briggs, Basoene; Mallik, Arindam; Hendrickx, Eric; Kim, Ryan Ryoung han; McIntyre, Greg; Ronse, Kurt; Boemmels, Juergen; Tokei, Zsolt; Mocuta, Dan (2018)

EUV vote-taking lithography for mitigation of printing mask defects, CDU improvement, and stochastic failure reduction

Bekaert, Joost; De Bisschop, Peter; Beral, Christophe; Hendrickx, Eric; van de Kerkhof, Mark A..; Bouten, Sander; Kupers, Michiel; Schiffelers, Guido; Verduijn, Erik; Brunner, Timothy (2018)

EUV vote-taking lithography: Crazy.... or not ?

Bekaert, Joost; De Bisschop, Peter; Beral, Christophe; Hendrickx, Eric; van de Kerkhof, Mark A.; Bouten, Sander; Kupers, Michiel; Schiffelers, Guido; Verduijn, Erik; Brunner, Timothy (2018)

Exploring the readiness of EUV photo materials for patterning

De Simone, Danilo; Vesters, Yannick; Shehzad, Atif; Vandenberghe, Geert; Foubert, Philippe; Beral, Christophe; Van Den Heuvel, Dieter; Mao, Ming; Lazzarino, Frederic (2017)

Extreme contact shrink for back end of line connectivity

Schleicher, Filip; Paolillo, Sara; Decoster, Stefan; Wu, Chen; Vega Gonzalez, Victor; Hasan, Mahmudul; Beral, Christophe; Lazzarino, Frederic (2022-05-10)

Imec's defect reduction strategies for EUV single exposed 32nm pitch line and space patterns

Foubert, Philippe; De Bisschop, Peter; Bekaert, Joost; Beral, Christophe; Rincon Delgadillo, Paulina (2019)

Influence of photoresist thinning and underlayer film on e-beam using eP5 for High-NA patterning

Hasan, Mahmudul; Beral, Christophe; Lorusso, Gian; De Simone, Danilo; Moussa, Alain; Van den Heuvel, Dieter; Charley, Anne-Laure; Leray, Philippe (2022)

Low Landing Energy as an Enabler for Optimal Contour Based OPC Modeling in the EUV Era

Alkoken, Ran; Baram, Mor; Oron, Gadi; Schuch, Nivea; Robert, Frederic; Figueiro, Thiago; Brand, Omri; Geta, Matan; Saha, Kasturi; Miller, Elias; Zavhon, Tal; Tiwari, Dipayan; Singh, Deepakkumar; Sarkar, Sujan Kumar; Rincon Delgadillo, Paulina; Lorusso, Gian; Beral, Christophe; Wei, Chih-I; Curvacho, Gabriel; Kim, Young Chang; Fenger, Germain (2024)

Massive metrology and inspection solution for EUV by area inspection SEM with machine learning technology

Kondo, Tsuyoshi; Ban, N.; Ebizuka, Y.; Toyoda, Y.; Yamada, Y.; Kashiwa, T.; Koike, H.; Shindo, H.; Charley, Anne-Laure; Saib, Mohamed; Van Roey, Frieda; De Bisschop, Peter; De Simone, Danilo; Beral, Christophe; Lorusso, Gian (2021)

Material and process optimization for EUV pattern rectification by DSA

Verstraete, Lander; Suh, Hyo Seon; Van Bel, Julie; Bak, Byeong-U; Kim, Seong Eun; Vallat, Remi; Bezard, Philippe; Beggiato, Matteo; Beral, Christophe (2024)

Metrology of Thin Resist for High NA EUVL

Lorusso, Gian; Beral, Christophe; Bogdanowicz, Janusz; De Simone, Danilo; Hasan, Mahmudul; Jehoul, Christiane; Moussa, Alain; Saib, Mohamed; Zidan, Mohamed; Severi, Joren; Truffert, Vincent; Van Den Heuvel, Dieter; Goldenshtein, Alex; Houchens, Kevin; Santoro, Gaetano; Fischer, Daniel; Muellender, Angelika; Hung, Joey; Koret, Roy; Turovets, Igor; Ausschnitte, Kit; Mack, Chris; Kondo, Tsuyoshi; Shohjoh, Tomoyasu; Ikota, Masami; Charley, Anne-Laure; Leray, Philippe (2022)