Browsing by author "Claes, Martine"

A controlled deposition of organic contamination and the removal with ozone based cleaning

Claes, Martine; De Gendt, Stefan; Kenens, Conny; Conard, Thierry; Bender, Hugo; Storm, Wolfgang; Bauer, T.; Lagrange, Sébastien; Mertens, Paul; Heyns, Marc (2001)

A high-reliable Cu/ULK integration scheme using Metal Hard Mask and Low-k capping film

Travaly, Youssef; Tsutsue, M.; Ikeda, Atsushi; Verdonck, Patrick; Tokei, Zsolt; Willegems, Myriam; Van Aelst, Joke; Struyf, Herbert; Vereecke, Guy; Kesters, Els; Le, Quoc Toan; Claes, Martine; Heylen, Nancy; Sinapi, Fabrice; Richard, Olivier; De Roest, David; Kaneko, S; Kemeling, N; Fukazawa, A; Matsuki, N; Matsushita, K; Tsuji, N; Kagami, K; Sprey, Hessel; Beyer, Gerald (2007)

Acoustic cleaning in nano-electronics

Mertens, Paul; Janssens, Tom; Holsteyns, Frank; Zijlstra, Aaldert; Halder, Sandip; Wostyn, Kurt; Andreas, Michael; Hoyer, Ronald; Barbagini, Francesca; Wada, Masayuki; Franklin, Cole; Kim, Tae-Gon; Kim, K; Kenis, Karine; Le, Quoc Toan; Claes, Martine; Kesters, Els; Vos, Rita; Vereecke, Guy; Bearda, Twan; Heyns, Marc (2008)

Advanced metrologies for cleans characterization: ARXPS, GIXF and NEXAFS

Conard, Thierry; List, Scott; Claes, Martine; Beckhoff, Buckard (2008)

Advanced wafer surface cleaning technology

Mertens, Paul; Vos, Rita; Vereecke, Guy; Arnauts, Sophia; Bearda, Twan; De Waele, Rita; Eitoku, Atsuro; Fyen, Wim; Geckiere, J.; Hellin, David; Holsteyns, Frank; Kesters, Els; Claes, Martine; Kenis, Karine; Kraus, Harald; Malhouitre, Stephane; Lee, Kuntack; Kocsis, Michael; Onsia, Bart; Garaud, Sylvain; Rip, Jens; Snow, Jim; Teerlinck, I.; Van Hoeymissen, Jan; Barbagini, Francesca; Xu, Kaidong; Paraschiv, Vasile; De Gendt, Stefan; Mannaert, Geert; Heyns, Marc (2004)

ALD deposition of high-k and metal gate stacks for advanced CMOS applications

Heyns, Marc; Beckx, Stephan; Caymax, Matty; Claes, Martine; De Gendt, Stefan; Degraeve, Robin; Delabie, Annelies; Deweerd, Wim; Groeseneken, Guido; Hooker, Jacob; Houssa, Michel; Kwak, Dong Hwa; Lander, Rob; Lujan, Guilherme; Maes, Jan; Niwa, Masaaki; Pantisano, Luigi; Puurunen, R.; Ragnarsson, Lars-Ake; Rohr, Erika; Schram, Tom; Van Elshocht, Sven; Vandervorst, Wilfried (2004)

All wet strip approaches for post-etch photoresist layers after low-k patterning

Claes, Martine; Le, Quoc Toan; Kesters, Els; Lux, Marcel; Urionabarrenetxea, Ainara; Vereecke, Guy; Mertens, Paul; Carleer, R.; Adriaensens, P. (2007)

Alternative photoresist removal process to minimize damage of low-k material induced by ash plasma

Le, Quoc Toan; Keldermans, Johan; Chiodarelli, Nicolo; Kesters, Els; Lux, Marcel; Claes, Martine; Vereecke, Guy (2008)

Alternative photoresist removal process to minimize damage of low-k material induced by ash plasma

Le, Quoc Toan; Keldermans, Johan; Chiodarelli, Nicolo; Kesters, Els; Lux, Marcel; Claes, Martine; Vereecke, Guy (2007-11)

An environment friendly wet strip process for 193 nm lithography patterning in BEOL applications

Vereecke, Guy; Kesters, Els; Le, Quoc Toan; Claes, Martine; Lux, Marcel; Struyf, Herbert; Carleer, Robert; Adriaensens, Peter (2012)

An environment friendly wet strip process for 193 nm lithography patterning in BEOL applications

Vereecke, Guy; Kesters, Els; Le, Quoc Toan; Claes, Martine; Lux, Marcel; Struyf, Herbert; Carleer, Robert; Adriaensens, Peter (2013)

Application of moist ozone gasphase for removal of resist and organic contamination in a novel tank-type processor

Haug, Rainer; Cornelissen, Ingrid; Claes, Martine; De Gendt, Stefan; Wolke, K.; Meuris, Marc; Heyns, Marc (1999)

Bulk properties of MOCVD-deposited HfO2 layers for high-k dielectric applications

Van Elshocht, Sven; Baklanov, Mikhaïl; Brijs, Bert; Carter, R.; Caymax, Matty; Carbonell, Laure; Claes, Martine; Conard, Thierry; Cosnier, Vincent; Date, Lucien; De Gendt, Stefan; Kluth, J.; Pique, Didier; Richard, Olivier; Vanhaeren, Danielle; Vereecke, Guy; Witters, Thomas; Zhao, Chao; Heyns, Marc (2004)