Browsing by author "Luhn, Ole"
Now showing items 1-20 of 29
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A new scaled through Si via with polymer fill for 3D wafer level packaging
Sabuncuoglu Tezcan, Deniz; Duval, Fabrice; Luhn, Ole; Soussan, Philippe; Swinnen, Bart (2008) -
Additive influence on filling microvias with copper
Luhn, Ole; Ruythooren, Wouter; Van Hoof, Chris; Celis, Jean-Pierre (2008) -
Barrier and seed layer coverage in 3D structures with different aspect ratios using sputtering and ALD proecesses
Luhn, Ole; Van Hoof, Chris; Ruythooren, Wouter; Celis, Jean-Pierre (2008) -
Changing superfilling mode for copper electrodeposition in blind holes from differential inhibition to differential acceleration
Luhn, Ole; Radisic, Alex; Vereecken, Philippe; Van Hoof, Chris; Ruythooren, Wouter; Celis, Jean-Pierre (2009) -
Characteristics of copper electrodeposits on featureless substrates and in microvias with aspect ratio up to 10
Luhn, Ole; Radisic, Alex; Vereecken, Philippe; Van Hoof, Chris; Ruythooren, Wouter; Celis, Jean-Pierre (2009) -
Copper plating for 3D interconnects
Radisic, Alex; Luhn, Ole; Philipsen, Harold; El-Mekki, Zaid; Honore, Mia; Rodet, Simon; Armini, Silvia; Drijbooms, Chris; Bender, Hugo; Ruythooren, Wouter (2011) -
Copper plating for 3D interconnects
Radisic, Alex; Luhn, Ole; Vaes, Jan; Armini, Silvia; El-Mekki, Zaid; Radisic, Dunja; Ruythooren, Wouter; Vereecken, Philippe (2009) -
Copper plating for 3d interconnects
Radisic, Alex; Luhn, Ole; Vaes, Jan; Armini, Silvia; El-Mekki, Zaid; Radisic, Dunja; Ruythooren, Wouter; Vereecken, Philippe (2010) -
Cu electrodeposition for Through-Silicon Via Technology
Philipsen, Harold; Luhn, Ole; Sabuncuoglu Tezcan, Deniz; Civale, Yann; Ruythooren, Wouter (2009) -
Cu plating of through-Si vias for 3D-stacked integrated circuits
Radisic, Alex; Luhn, Ole; Swinnen, Bart; Bender, Hugo; Drijbooms, Chris; Doumen, Geert; Kellens, Kristof; Ruythooren, Wouter; Vereecken, Philippe (2008) -
Cu Plating of Through-Si Vias for 3D-Stacked Integrated Circuits
Radisic, Alex; Luhn, Ole; Swinnen, Bart; Bender, Hugo; Drijbooms, Chris; Doumen, Geert; Kellens, Kristof; Ruythooren, Wouter; Vereecken, Philippe (2009) -
Electrodeposition for 3D integration
Philipsen, Harold; Radisic, Alex; Luhn, Ole; Civale, Yann; Vandersmissen, Kevin; Rodet, Simon; Honore, Mia; Leunissen, Peter (2010) -
Filling of microvia with an aspect ratio of 5 by copper electrodeposition
Luhn, Ole; Van Hoof, Chris; Ruythooren, Wouter; Celis, Jean-Pierre (2009) -
High aspect ratio via metallization for 3D integration using CVD TiN barrier and electrografted Cu seed
Druais, Gael; Dilliway, G.; Fischer, P.; Guidotti, E.; Luhn, Ole; Radisic, Alex; Zahraoui, S. (2008) -
Improving the copper electroplating process for 3D-stacked integrated circuits
Luhn, Ole; Radisic, Alex; Ruythooren, Wouter; Vereecken, Philippe; Celis, Jean-Pierre; Van Hoof, Chris; Swinnen, Bart (2008) -
Influence of annealing conditions on the mechanical and microstructural behavior of electroplated Cu-TSV
Okoro, Chukwudi; Vanstreels, Kris; Labie, Riet; Luhn, Ole; Vandevelde, Bart; Verlinden, Bert; Vandepitte, Dirk (2010) -
Leveling of microvias for wafer level packaging
Luhn, Ole; Celis, Jean-Pierre; Van Hoof, Chris; Baert, Kris; Ruythooren, Wouter (2007-05) -
Metallization of 3D via structures in silicon for interconnect technology
Luhn, Ole; Van Hoof, Chris; Ruythooren, Wouter; Celis, Jean-Pierre (2008) -
Microvia-filling by copper electroplating
Luhn, Ole; Van Hoof, Chris; Ruythooren, Wouter; Celis, Jean-Pierre (2007)