Browsing Conference contributions by imec author "dfef90a5cc9853e542c56c798ca862233dd6279e"

3D chip package interaction thermo-mechanical challenges: proximity effects of through silicon vias and μ-bumps

Guo, Wei; Van der Plas, Geert; Ivankovic, Andrej; Eneman, Geert; Cherman, Vladimir; De Wachter, Bart; Mercha, Abdelkarim; Gonzalez, Mario; Civale, Yann; Redolfi, Augusto; Buisson, Thibault; Jourdain, Anne; Vandevelde, Bart; Rebibis, Kenneth June; De Wolf, Ingrid; La Manna, Antonio; Beyer, Gerald; Beyne, Eric; Swinnen, Bart (2012)

3D integration challenges for fine pitch back side micro-bumping on ZoneBOND™ wafers

Buisson, Thibault; De Preter, Inge; Suhard, Samuel; Vandersmissen, Kevin; Jaenen, Patrick; Witters, Thomas; Jamieson, Geraldine; Jourdain, Anne; Van Huylenbroeck, Stefaan; La Manna, Antonio; Beyer, Gerald; Beyne, Eric (2012)

3D stacking induced mechanical stress effects

Cherman, Vladimir; Van der Plas, Geert; De Vos, Joeri; Ivankovic, Andrej; Lofrano, Melina; Simons, Veerle; Gonzalez, Mario; Vanstreels, Kris; Wang, Teng; Daily, Robert; Guo, Wei; Beyer, Gerald; La Manna, Antonio; De Wolf, Ingrid; Beyne, Eric (2014)

3D stacking using Cu-Cu direct bonding

Hu, Yu-Hsiang; Liu, C.S.; Lii, M.J.; Rebibis, Kenneth June; Jourdain, Anne; La Manna, Antonio; Beyer, Gerald; Beyne, Eric; Yu, (2012-02)

3D stacking using Cu-Cu direct bonding for 40μm pitch and beyond

Hu, Yu-Hsiang; Rebibis, Kenneth June; Zhao, Ming; La Manna, Antonio; Beyne, Eric; Liu, C.S.; Lii, M.J.; Yu, C.H. (2012)

3D stacking using ultra thin dies

La Manna, Antonio; Velenis, Dimitrios; Buisson, Thibault; Detalle, Mikael; Rebibis, Kenneth June; Zhang, Wenqi; Beyne, Eric (2012)

3D technology roadmap and status

Marchal, Pol; Van der Plas, Geert; Eneman, Geert; Moroz, V.; Badaroglu, Mustafa; Mercha, Abdelkarim; Thijs, Steven; Linten, Dimitri; Katti, Guruprasad; Stucchi, Michele; Vandevelde, Bart; Oprins, Herman; Cherman, Vladimir; Croes, Kris; Redolfi, Augusto; La Manna, Antonio; Travaly, Youssef; Beyne, Eric; Cartuyvels, Rudi (2011)

Active-lite interposer for 2.5 & 3D integration

Hellings, Geert; Scholz, Mirko; Detalle, Mikael; Velenis, Dimitrios; de Potter de ten Broeck, Muriel; Roda Neve, Cesar; Li, Yunlong; Van Huylenbroeck, Stefaan; Chen, Shih-Hung; Marinissen, Erik Jan; La Manna, Antonio; Van der Plas, Geert; Linten, Dimitri; Beyne, Eric; Thean, Aaron (2015)

An IC-centric biocompatible chip encapsulation fabrication process

Op de Beeck, Maaike; La Manna, Antonio; Buisson, Thibault; Dy, Eric; Velenis, Dimitrios; Axisa, Fabrice; Soussan, Philippe; Van Hoof, Chris (2010)

An investigation into damage-free thin die pick and place for 3D stacking

Malachowski, Karl; Gonzales, Dennis; Miller, Andy; La Manna, Antonio; Hajdarevic, Zlatko; Schnegg, Fabian; Arzberger, Anton (2011-12)

Analysis of microbump induced stress effects in 3D stacked IC technologies

Ivankovic, Andrej; Van der Plas, Geert; Moroz, V.; Choi, M.; Cherman, Vladimir; Mercha, Abdelkarim; Marchal, Pol; Gonzalez, Mario; Eneman, Geert; Zhang, Wenqi; Buisson, Thibault; Detalle, Mikael; La Manna, Antonio; Verkest, Diederik; Beyer, Gerald; Beyne, Eric; Vandevelde, Bart; De Wolf, Ingrid; Vandepitte, Dirk (2012)

Biocompatibility assessment of advanced wafer-level based chip encapsulation

Dy, Eric; Vos, Rita; Rip, Jens; La Manna, Antonio; Op de Beeck, Maaike (2010)

Challenges and improvements for 3D-IC integration using ultra thin (25μm) devices

La Manna, Antonio; Buisson, Thibault; Detalle, Mikael; Rebibis, Kenneth June; Velenis, Dimitrios; Zhang, Wenqi; Beyne, Eric (2012-06)

Co-Sn intermetallic compoundsfor potential integration in 3D interconnects

Vakanas, George; O, Minho; Dimcic, Biljana; Vandecasteele, Bjorn; Vanstreels, Kris; De Messemaeker, Joke; De Preter, Inge; Derakhshandeh, Jaber; Guerrieri, Stefano; Rebibis, Kenneth June; La Manna, Antonio; Kajihara, Masanori; De Wolf, Ingrid; Beyne, Eric (2014)