Browsing by Author "De Schepper, Peter"
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Publication Ar and H2 plasma and neutral/ion beam treatment of EUV resist
Proceedings paper2015-03, Advanced Etch Technology for Nanopatterning IV, 22/02/2015, p.94280CPublication Challenges for smoothing EUV photoresist line-width-roughness: plasma treatment from 40 to 22 nm half pitches
Oral presentation2013, China Semiconductor Technology International Conference (CSTIC) 2013Publication Characterizing and modeling electrical response to light for metal based EUV photoresists
Proceedings paper2016, Advances in Patterning Materials and Processes XXXIII, 21/02/2016, p.977906Publication Compact 2D OPC modeling of a metal oxide EUV resist for a 7nm node BEOL layer
Proceedings paper2017, Extreme Ultraviolet (EUV) Lithography VIII, 26/02/2017, p.101431EPublication Continued Optimization of Point-Of-Use Filtration for Metal Oxide Photoresists to Reduce Defect Density
Proceedings paper2023, Conference on Advances in Patterning Materials and Processes XL, FEB 27-MAR 01, 2023, p.Art. 124980APublication Demonstration of an N7 integrated fab process for metal oxide EUV photoresist
Proceedings paper2016, Extreme Ultraviolet (EUV) Lithography VII, 21/02/2016, p.97760BPublication Generation of plama in liquid using RF and ultrasounds
Meeting abstract2011, 4th International Workshop on Plasma Etch and Strip in Microelectronics - PESM, 5/05/2011Publication Hydrogen plasma treatment: the evolution of roughness in frequency domain
Proceedings paper2014, Advanced Etch Technology for Nanopatterning III, 23/02/2014, p.90540CPublication Integrated fab process for metal oxide EUV photoresist
Proceedings paper2015, Advances in Patterning Materials and Processes XXXII, 22/02/2015, p.94250SPublication Layer on photoresist lines with an Ar/SiCl4/O2 inductively coupled plasma: a modeling investigation
Journal article2014, Plasma Processes and Polymers, (11) 1, p.52-62Publication Line edge and width roughness mitigation at 22nm half pitch: plasma polymer interaction and roughness mitigation through etch
Meeting abstract2013, Plasma Etch and Strip in Microtechnology - PESM, 14/03/2013Publication Line edge and width roughness smoothing by plasma treatment
Proceedings paper2013, Advanced Etch Technology for Nanopatterning II, 24/02/2013, p.868505Publication Line edge and width roughness smoothing by plasma treatment
Journal article2014, Journal of Micro/Nanolithography MEMS and MOEMS, (13) 2, p.23006Publication Lloyd's Mirror Interference Lithography Below a 22-nm Pitch with an Accessible, Table-top, 13.5 nm High-Harmonic EUV Source
Proceedings paper2021, SPIE Advanced Lithography Novel Patterning Technologies 2021, 22/02/2021Publication Metal oxide EUV photoresist performance for N7 relevant patterns and processes
Proceedings paper2016, Advances in Patterning Materials and Processes XXXIII, 21/02/2016, p.977904Publication Modeling and experimental investigation of the plasma uniformity in CF4/O2 capacitively coupled plasmas, operating in single frequency and dual frequency regime
Journal article2015, Journal of Vacuum Science and Technology A, (33) 2, p.21310Publication Molecular glass resists for all-dry high-resolution scanning probe lithography
Publication Molecular glass resists for scanning probe lithography
Publication Numerical investigation of HBr/He transformer coupled plasmas used for silicon etching
Journal article2015, Journal of Physics D: Applied Physics, (48) 2, p.25202