Browsing by Author "Hasumi, Kazuhisa"
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Publication 3D measurement of 3D NAND memory hole with CD-SEM and tilted FIB
;Ohashi, Takeyoshi ;Yamaguchi, Atsuko ;Hasumi, Kazuhisa ;Ikota, MasamiTan, Chi LimProceedings paper2017, 43rd International Conference on Micro and Nanoengineering - MNE, 18/09/2017, p.OC073Publication Contact inspection and resistance - capacitance measurement of Si nanowire with SEM voltage contrast
Journal article2019, Journal of Micro/Nanolithography MEMS and MOEMS, (18) 2, p.21205Publication Contact inspection of Si nanowire with SEM voltage contrast
Proceedings paper2018, Metrology, Inspection, and Process Control for Microlithography XXXII, 25/02/2018, p.105850BPublication Cu Pad Height Evaluation Technique Using Four-Directional BSE Signal of SEM for Hybrid Bonding Applications
;Kasai, Hiroaki ;Doi, Yuki ;Osaki, Mayuka ;Hasumi, Kazuhisa ;Mise, NobuyukiTanaka, MakiProceedings paper2025, 2025 Conference on Metrology Inspection and Process Control-Annual, 2025-02-24, p.134261N-1-134261N-7Publication Cu Pad Surface Height Evaluation Technique by In-line SEM for Wafer Hybrid Bonding
;Kasai, Hiroaki ;Osaki, Mayuka ;Hasumi, Kazuhisa ;Mise, NobuyukiTanaka, MakiProceedings paper2024, Conference on Metrology, Inspection, and Process Control XXXVIII, FEB 26-29, 2024, p.Art. 129551NPublication EB metrology of Ge channel gate-all-around FET: buckling evaluation and EB damage assessment
Proceedings paper2020, Metrology, Inspection, and Process Control for Microlithography XXXIV, 23/02/2020, p.1132525Publication Enabling CD SEM metrology for 5nm technology node and beyond
Proceedings paper2017, Metrology, Inspection, and Process Control for Microlithography XXXI, 26/02/2017, p.1014512Publication High-throughput in-line SEM Metrology for Cu Pad Nanotopography for Hybrid Bonding Applications
; ; ; ; ; Proceedings paper2024, 10th IEEE Electronics System-Integration Technology Conference (ESTC), SEP 11-13, 2024Publication In-line SEM Evaluation Technique for Cu Pad Nanotopography for Hybrid Bonding Applications
Proceedings paper2024, 13th IEEE CPMT Symposium Japan, NOV 13-15, 2024, p.92-95Publication Precise measurement of thin film thickness in 3D-NAND device with CD-SEM
;Ohashi, Takeyoshi ;Atsuko, Yamaguchi ;Kobayashi, Takashi ;Inoue, OsamuHasumi, KazuhisaOral presentation2016, 42nd Micro and Nano Engineering ConferencePublication Precise measurement of thin-film thickness in 3D-NAND device with CD-SEM
Journal article2018, Journal of Micro/Nanolithography MEMS and MOEMS, (17) 2, p.24002Publication SEM based overlay measurement between resist and buried patterns
Proceedings paper2016, Metrology, Inspection, and Process Control for Microlithography XXX, 21/02/2016, p.97781DPublication SEM based overlay measurement between via patterns and buried M1 patterns using high voltage SEM
Proceedings paper2017, Metrology, Inspection, and Process Control for Microlithography XXXI, 26/02/2017, p.101451JPublication SEM Inspection of Nanowire Devices: Contact inspection, Resistance and Capacitance Measurement and Buckling Evaluation
Oral presentation2019, MNE 2019Publication Variability study with CD-SEM metrology for STT-MRAM: Correlation analysis between physical dimensions and electrical property of the memory element
;Ohashi, Takeyoshi ;Yamaguchi, Atusko ;Hasumi, Kazuhisa ;Inoue, OsamuIkata, MasamiMeeting abstract2017, Metrology, Inspection, and Process Control for Microlithography XXXI, 27/02/2017, p.101450HPublication Variability study with CD-SEM metrology for STT-MRAM: correlation analysis between physical dimensions and electrical property of the memory element
;Ohashi, Takeyoshi ;Yamaguchi, Atsuko ;Hasumi, Kazuhisa ;Inoue, OsamuIkota, MasamiProceedings paper2017, Metrology, Inspection, and Process Control for Microlithography XXXI, 26/02/2017, p.101450H