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Browsing by Author "Hasumi, Kazuhisa"

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    3D measurement of 3D NAND memory hole with CD-SEM and tilted FIB

    Ohashi, Takeyoshi
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    Yamaguchi, Atsuko
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    Hasumi, Kazuhisa
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    Ikota, Masami
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    Tan, Chi Lim
    Proceedings paper
    2017, 43rd International Conference on Micro and Nanoengineering - MNE, 18/09/2017, p.OC073
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    Contact inspection and resistance - capacitance measurement of Si nanowire with SEM voltage contrast

    Ohashi, Takeyoshi
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    Hasumi, Kazuhisa
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    Ikota, Masami
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    Lorusso, Gian  
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    Mertens, Hans  
    Journal article
    2019, Journal of Micro/Nanolithography MEMS and MOEMS, (18) 2, p.21205
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    Contact inspection of Si nanowire with SEM voltage contrast

    Ohashi, Takeyoshi
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    Yamaguchi, Atsuko
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    Hasumi, Kazuhisa
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    Ikota, Masami
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    Lorusso, Gian  
    Proceedings paper
    2018, Metrology, Inspection, and Process Control for Microlithography XXXII, 25/02/2018, p.105850B
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    Cu Pad Height Evaluation Technique Using Four-Directional BSE Signal of SEM for Hybrid Bonding Applications

    Kasai, Hiroaki
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    Doi, Yuki
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    Osaki, Mayuka
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    Hasumi, Kazuhisa
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    Mise, Nobuyuki
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    Tanaka, Maki
    Proceedings paper
    2025, 2025 Conference on Metrology Inspection and Process Control-Annual, 2025-02-24, p.134261N-1-134261N-7
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    Cu Pad Surface Height Evaluation Technique by In-line SEM for Wafer Hybrid Bonding

    Kasai, Hiroaki
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    Osaki, Mayuka
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    Hasumi, Kazuhisa
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    Mise, Nobuyuki
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    Tanaka, Maki
    Proceedings paper
    2024, Conference on Metrology, Inspection, and Process Control XXXVIII, FEB 26-29, 2024, p.Art. 129551N
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    EB metrology of Ge channel gate-all-around FET: buckling evaluation and EB damage assessment

    Ohashi, Takeyoshi
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    Hasumi, Kazuhisa
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    Ikota, Masami
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    Lorusso, Gian  
    ;
    Witters, Liesbeth  
    Proceedings paper
    2020, Metrology, Inspection, and Process Control for Microlithography XXXIV, 23/02/2020, p.1132525
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    Enabling CD SEM metrology for 5nm technology node and beyond

    Lorusso, Gian  
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    Ohashi, Takeyoshi
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    Yamaguchi, Astuko
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    Inoue, Osamu
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    Sutani, Takumichi
    Proceedings paper
    2017, Metrology, Inspection, and Process Control for Microlithography XXXI, 26/02/2017, p.1014512
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    High-throughput in-line SEM Metrology for Cu Pad Nanotopography for Hybrid Bonding Applications

    Tunca Altintas, Bensu  
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    Saib, Mohamed  
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    Moussa, Alain  
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    Chew, Soon Aik  
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    Zhang, Boyao  
    ;
    De Vos, Joeri  
    Proceedings paper
    2024, 10th IEEE Electronics System-Integration Technology Conference (ESTC), SEP 11-13, 2024
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    In-line SEM Evaluation Technique for Cu Pad Nanotopography for Hybrid Bonding Applications

    Kasai, Hiroaki
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    Hasumi, Kazuhisa
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    Mise, Nobuyuki
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    Osaki, Mayuka
    ;
    Chew, Soon Aik  
    Proceedings paper
    2024, 13th IEEE CPMT Symposium Japan, NOV 13-15, 2024, p.92-95
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    Precise measurement of thin film thickness in 3D-NAND device with CD-SEM

    Ohashi, Takeyoshi
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    Atsuko, Yamaguchi
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    Kobayashi, Takashi
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    Inoue, Osamu
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    Hasumi, Kazuhisa
    Oral presentation
    2016, 42nd Micro and Nano Engineering Conference
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    Precise measurement of thin-film thickness in 3D-NAND device with CD-SEM

    Ohashi, Takeyoshi
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    Yamaguchi, Atsuko
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    Hasumi, Kazuhisa
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    Ikota, Masami
    ;
    Lorusso, Gian  
    Journal article
    2018, Journal of Micro/Nanolithography MEMS and MOEMS, (17) 2, p.24002
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    SEM based overlay measurement between resist and buried patterns

    Inoue, Osamu
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    Okagawa, Yutaka
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    Hasumi, Kazuhisa
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    Shao, Chuanyu
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    Leray, Philippe  
    ;
    Halder, Sandip  
    Proceedings paper
    2016, Metrology, Inspection, and Process Control for Microlithography XXX, 21/02/2016, p.97781D
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    SEM based overlay measurement between via patterns and buried M1 patterns using high voltage SEM

    Hasumi, Kazuhisa
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    Inoue, Osamu
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    Okagawa, Yutaka
    ;
    Shao, Chuanyu
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    Leray, Philippe  
    ;
    Halder, Sandip  
    Proceedings paper
    2017, Metrology, Inspection, and Process Control for Microlithography XXXI, 26/02/2017, p.101451J
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    SEM Inspection of Nanowire Devices: Contact inspection, Resistance and Capacitance Measurement and Buckling Evaluation

    Ohashi, Takeyoshi
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    Hasumi, Kazuhisa
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    Masami, Ikota
    ;
    Lorusso, Gian  
    ;
    Mertens, Hans  
    Oral presentation
    2019, MNE 2019
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    Variability study with CD-SEM metrology for STT-MRAM: Correlation analysis between physical dimensions and electrical property of the memory element

    Ohashi, Takeyoshi
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    Yamaguchi, Atusko
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    Hasumi, Kazuhisa
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    Inoue, Osamu
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    Ikata, Masami
    Meeting abstract
    2017, Metrology, Inspection, and Process Control for Microlithography XXXI, 27/02/2017, p.101450H
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    Variability study with CD-SEM metrology for STT-MRAM: correlation analysis between physical dimensions and electrical property of the memory element

    Ohashi, Takeyoshi
    ;
    Yamaguchi, Atsuko
    ;
    Hasumi, Kazuhisa
    ;
    Inoue, Osamu
    ;
    Ikota, Masami
    Proceedings paper
    2017, Metrology, Inspection, and Process Control for Microlithography XXXI, 26/02/2017, p.101450H

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