Browsing by Author "Inoue, Fumihiro"
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Publication 10 and 7 mu m Pitch Thermo-compression Solder Joint, Using A Novel Solder Pillar And Metal Spacer Process
Proceedings paper2020, 70th IEEE Electronic Components and Technology Conference (ECTC), JUN 03-30, 2020, p.617-622Publication 3D IC assembly using thermal compression bonding and wafer-level underfill – strategies for quality improvement and throughput enhancement
Proceedings paper2016, IEEE 18th Electronic Packaging Technology Conference - EPTC, 30/11/2016, p.791-796Publication 3D sequential stacked planar devices featuring low-temperature replacement metal gate junctionless top devices with improved reliability
; ; ; ; ; Journal article2018-11, IEEE Transactions on Electron Devices, (65) 11, p.5165-5171Publication 3D sequential stacked planar devices on 300 mm wafers featuring replacement metal gate junction-less top devices processed at 525°C with improved reliability
; ; ; ; ; Proceedings paper2018, IEEE Symposium on VLSI Technology, 18/06/2018, p.69-70Publication 3D stacking using bump-less process for sub 10μm pitches
Proceedings paper2016, IEEE 66th Electronic Components and Technology Conference - ECTC, 31/05/2016, p.128-133Publication A study on IMC morphology and integration flow for low temperature and high throughput TCB down to 10 mu m pitch microbumps
Proceedings paper2021, IEEE 71st Electronic Components and Technology Conference (ECTC), JUN 01-JUL 04, 2021, p.1119-1124Publication Advanced dicing technologies for combination of wafer to wafer and collective die to wafer fusion bonding
Proceedings paper2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 28/05/2018, p.437Publication Advances in SiCN-SiCN bonding with high accuracy wafer-to-wafer (W2W) stacking technology
Proceedings paper2018, IEEE International Interconnect Technology Conference - IITC, 4/06/2018, p.985-992Publication Area-Selective Electroless Deposition of Cu for Hybrid Bonding
Journal article2021, IEEE ELECTRON DEVICE LETTERS, (42) 12, p.1826-1829Publication Bath stability monitoring for electroless Cu seed formation in high aspect ratio TSV
Meeting abstract2012, ECS Fall Meeting Symposium E8: Processing Materials of 3D Interconnects, 7/10/2012, p.2727Publication Buried metal line compatible with 3D sequential integration for top tier planar devices dynamic Vth tuning and RF shielding applications
Proceedings paper2019, 2019 Symposia on VLSI Technology and Circuits, 9/06/2019, p.T56-T57Publication Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding
Publication Characterization of extreme Si thinning proces for wafer-to-wafer stacking
Proceedings paper2016, IEEE 66th Electronic Components and Technology Conference - ECTC, 31/05/2016, p.2095-2102Publication Characterization of inorganic dielectric layers for low thermal budget wafer to wafer bonding
Proceedings paper2017, 5th International Workshop on Low Temperature Bonding for 3D Integration - LTB-3D, 16/05/2017, p.24Publication Characterization of silicon carbon nitride for low temperature wafer-to-wafer direct bonding
Meeting abstract2020, PRiME 2020: Semiconductor Wafer Bonding: Science, Technology, and Applications 16, 4/10/2020, p.G01-1650Publication Characterization of silicon carbon nitride for low temperature wafer-to-wafer direct bonding
Proceedings paper2020, PRiME 2020: Semiconductor Wafer Bonding: Science, Technology, and Applications 16, 4/10/2020Publication Cobalt-Tin Intermetallic Compounds as Alternative Surface Finish for Low Temperature Die-to-Wafer Solder Stacking
Proceedings paper2021, 20th International Conference on Electronics Packaging (ICEP), MAY 12-14, 2021, p.9-10Publication Conformal Cu electroless seed on Co and Ru liners enables Cu fill by plating for advanced interconnects
Meeting abstract2016, 25th Advanced Materials for Metalization Conference - MAM, 21/03/2016, p.MT1Publication Cu seeding using electroless deposition on Ru liner for high aspect ratio through-Si vias
Proceedings paper2014, IEEE 3D System Integration Conference - 3DIC, 1/12/2014, p.1-4Publication Defect identification in bonding surface layer by positron annihilation spectroscopy
Proceedings paper2019, 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2019), 21/05/2019