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Browsing by Author "Shamiryan, Denis"

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    25% drive current improvement for p-type Multiple Gate FET (MuGFET) devices by the introduction of recessed Si0.8Ge0.2 in the source and drain regions

    Verheyen, Peter  
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    Collaert, Nadine  
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    Rooyackers, Rita
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    Loo, Roger  
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    Shamiryan, Denis
    Proceedings paper
    2005, Symposium on VLSI Technology. Digest of Technical Papers, 14/06/2005, p.194-195
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    8Å Tinv gate-first dual channel technology achieving low-Vt high performance CMOS

    Witters, Liesbeth  
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    Takeoka, Shinji
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    Yamaguchi, Shinpei
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    Hikavyy, Andriy  
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    Shamiryan, Denis
    Proceedings paper
    2010, IEEE Symposium on VLSI Technology, 15/06/2010, p.181-182
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    A discussion of the practical importance of positron annihilation lifetime spectroscopy percolation threshold in evaluation of porous low-k dielectrics

    Mogilnikov, K.P.
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    Baklanov, Mikhaïl
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    Shamiryan, Denis
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    Petkov, M.P.
    Journal article
    2004-01, Japanese Journal of Applied Physics. Part 1: Regular Papers, (43) 1, p.247-248
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    A plasma etch process for bulk finFET manufacturing

    Shamiryan, Denis
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    Redolfi, Augusto  
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    Boullart, Werner  
    Proceedings paper
    2007-10, International Conference on Micro- and Nanoelectronics, 1/10/2007
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    Atomic layer deposited barriers for copper interconnects

    Schuhmacher, Jorg
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    Martin Hoyas, Ana
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    Ernur, Didem  
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    Tokei, Zsolt  
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    Travaly, Youssef
    Meeting abstract
    2004, AVS 51 International Symposium, 14/11/2004, p.TF-MoM1
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    Barrier deposition on porous low-k films

    Shamiryan, Denis
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    Yanovitskaya, Z.S.
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    Iacopi, Francesca
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    Maex, Karen  
    Proceedings paper
    2003, Proceedings of the Advanced Metallization Conference 2002, 1/10/2002, p.829-833
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    Bulk FinFET fabrication with new approaches for oxide topography control using dry removal techniques

    Redolfi, Augusto  
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    Sleeckx, Erik  
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    Devriendt, Katia  
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    Shamiryan, Denis
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    Vandeweyer, Tom  
    Proceedings paper
    2011-03, 12th International Conference on Ultimate Integration on Silicon - ULIS, 14/03/2011, p.31-33
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    Bulk FinFET fabrication with new approaches for oxide topography control using dry removal techniques

    Redolfi, Augusto  
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    Kubicek, Stefan  
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    Rooyackers, Rita
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    Kim, Min-Soo  
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    Sleeckx, Erik  
    Journal article
    2012, Solid-State Electronics, 71, p.106-112
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    C2H4-based plasma-assisted CD shrink and contact patterning for RRAM application

    Milenin, Alexey  
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    Lisoni, Judit
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    Jossart, Nico  
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    Jurczak, Gosia  
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    Struyf, Herbert  
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    Shamiryan, Denis
    Proceedings paper
    2010, Advanced Interconnects and Chemical Planarization for Micro- and Nanoelectronics, 5/04/2010, p.F04.09
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    Characterisation of Cu surface cleaning by downstream N2/H2 plasma

    Baklanov, Mikhaïl
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    Shamiryan, Denis
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    Beyer, Gerald  
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    Conard, Thierry  
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    Vanhaelemeersch, Serge  
    Proceedings paper
    2001, Advanced Metallization Conference 2000, 3/10/2000, p.153-159
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    Characteristics of Selective Epitaxial SiGe and Si Deposition processes for recessed source/drain applications

    Loo, Roger  
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    Verheyen, Peter  
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    Eneman, Geert  
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    Rooyackers, Rita
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    Leys, Frederik
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    Shamiryan, Denis
    Proceedings paper
    2005, ASM Users Meeting, 29/09/2005
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    Characteristics of selective epitaxial SiGe deposition processes for recesssed source/drain applications

    Loo, Roger  
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    Verheyen, Peter  
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    Eneman, Geert  
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    Rooyackers, Rita
    ;
    Leys, Frederik
    ;
    Shamiryan, Denis
    Proceedings paper
    2005, 4th International conference on Silicon Epitaxy and Heterostructures - ICSI-4, 23/05/2005, p.112-113
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    Characterization of Cu surface cleaning by hydrogen plasma

    Baklanov, Mikhaïl
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    Shamiryan, Denis
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    Tokei, Zsolt  
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    Beyer, Gerald  
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    Conard, Thierry  
    Journal article
    2001, Journal of Vacuum Science & Technology B, (19) 4, p.1201-1211
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    Charging and the secondary electron-electron emission on a trench surface: broadening and shift of ion energy spectrum at plasma trench etching

    Palov, A P
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    Mankelevich, Yu A
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    Rakhimova, T V
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    Shamiryan, Denis
    Journal article
    2010, Journal of Physics D: Applied Physics, (43) 7, p.75203
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    Charging of submicron structures during silicon dioxide etching in one

    Palov, P.A.
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    Mankelevich, Yu. A.
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    Rakhimova, T. V.
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    Shamiryan, Denis
    Journal article
    2010, Plasma Physics Reports, (36) 10, p.891-901
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    Cleaning challenges of high-k/metal gate structures

    Hussain, Muhammad M.
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    Shamiryan, Denis
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    Paraschiv, Vasile  
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    Sano, Kenichi
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    Reinhardt, Karen A.
    Book chapter
    2011
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    Comparative study of PECVD SiOCH low-k films obtained at different deposition conditions

    Shamiryan, Denis
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    Weidner, K.
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    Gray, W.D.
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    Baklanov, Mikhaïl
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    Vanhaelemeersch, Serge  
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    Maex, Karen  
    Journal article
    2002, Microelectronic Engineering, (64) 1_4, p.361-366
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    Comparative study of SiOCH low-k films with varied porosity interacting with etching and cleaning plasma

    Shamiryan, Denis
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    Baklanov, Mikhaïl
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    Vanhaelemeersch, Serge  
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    Maex, Karen  
    Journal article
    2002, Journal of Vacuum Science & Technology B, (20) 5, p.1923-1928
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    Controllable change of porosity of 3-methylsilane low-k dielectric film

    Shamiryan, Denis
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    Baklanov, Mikhaïl
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    Vanhaelemeersch, Serge  
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    Maex, Karen  
    Journal article
    2001, Electrochemical and Solid-State Letters, (4) 1, p.F3-F5
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    Controllable change of porosity of SiOCH low-k dielectric film

    Shamiryan, Denis
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    Baklanov, Mikhaïl
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    Vanhaelemeersch, Serge  
    ;
    Maex, Karen  
    Proceedings paper
    2001, Advanced Metallization Conference 2000, 2/10/2000, p.635-640
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