Browsing by Author "Shamiryan, Denis"
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Publication 25% drive current improvement for p-type Multiple Gate FET (MuGFET) devices by the introduction of recessed Si0.8Ge0.2 in the source and drain regions
Proceedings paper2005, Symposium on VLSI Technology. Digest of Technical Papers, 14/06/2005, p.194-195Publication 8Å Tinv gate-first dual channel technology achieving low-Vt high performance CMOS
Proceedings paper2010, IEEE Symposium on VLSI Technology, 15/06/2010, p.181-182Publication A discussion of the practical importance of positron annihilation lifetime spectroscopy percolation threshold in evaluation of porous low-k dielectrics
;Mogilnikov, K.P. ;Baklanov, Mikhaïl ;Shamiryan, DenisPetkov, M.P.Journal article2004-01, Japanese Journal of Applied Physics. Part 1: Regular Papers, (43) 1, p.247-248Publication A plasma etch process for bulk finFET manufacturing
Proceedings paper2007-10, International Conference on Micro- and Nanoelectronics, 1/10/2007Publication Atomic layer deposited barriers for copper interconnects
Meeting abstract2004, AVS 51 International Symposium, 14/11/2004, p.TF-MoM1Publication Barrier deposition on porous low-k films
Proceedings paper2003, Proceedings of the Advanced Metallization Conference 2002, 1/10/2002, p.829-833Publication Bulk FinFET fabrication with new approaches for oxide topography control using dry removal techniques
Proceedings paper2011-03, 12th International Conference on Ultimate Integration on Silicon - ULIS, 14/03/2011, p.31-33Publication Bulk FinFET fabrication with new approaches for oxide topography control using dry removal techniques
Journal article2012, Solid-State Electronics, 71, p.106-112Publication C2H4-based plasma-assisted CD shrink and contact patterning for RRAM application
; ;Lisoni, Judit; ; ; Shamiryan, DenisProceedings paper2010, Advanced Interconnects and Chemical Planarization for Micro- and Nanoelectronics, 5/04/2010, p.F04.09Publication Characterisation of Cu surface cleaning by downstream N2/H2 plasma
Proceedings paper2001, Advanced Metallization Conference 2000, 3/10/2000, p.153-159Publication Characteristics of Selective Epitaxial SiGe and Si Deposition processes for recessed source/drain applications
Proceedings paper2005, ASM Users Meeting, 29/09/2005Publication Characteristics of selective epitaxial SiGe deposition processes for recesssed source/drain applications
Proceedings paper2005, 4th International conference on Silicon Epitaxy and Heterostructures - ICSI-4, 23/05/2005, p.112-113Publication Characterization of Cu surface cleaning by hydrogen plasma
Journal article2001, Journal of Vacuum Science & Technology B, (19) 4, p.1201-1211Publication Charging and the secondary electron-electron emission on a trench surface: broadening and shift of ion energy spectrum at plasma trench etching
;Palov, A P ;Mankelevich, Yu A ;Rakhimova, T VShamiryan, DenisJournal article2010, Journal of Physics D: Applied Physics, (43) 7, p.75203Publication Charging of submicron structures during silicon dioxide etching in one
;Palov, P.A. ;Mankelevich, Yu. A. ;Rakhimova, T. V.Shamiryan, DenisJournal article2010, Plasma Physics Reports, (36) 10, p.891-901Publication Comparative study of PECVD SiOCH low-k films obtained at different deposition conditions
Journal article2002, Microelectronic Engineering, (64) 1_4, p.361-366Publication Comparative study of SiOCH low-k films with varied porosity interacting with etching and cleaning plasma
Journal article2002, Journal of Vacuum Science & Technology B, (20) 5, p.1923-1928Publication Controllable change of porosity of 3-methylsilane low-k dielectric film
Journal article2001, Electrochemical and Solid-State Letters, (4) 1, p.F3-F5Publication Controllable change of porosity of SiOCH low-k dielectric film
Proceedings paper2001, Advanced Metallization Conference 2000, 2/10/2000, p.635-640