Browsing by Author "Torregiani, Cristina"
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Publication A comparison of spike, flash, SPER and laser annealing for 45nm CMOS
Proceedings paper2003, CMOS Front-End Materials and Process Technology, 21/04/2003, p.261-266Publication A finite element study of process induced stress in the transistor channel: effects of silicide contact and gate stack
Proceedings paper2004, EuroSimE: 5th Int. Conf. on Thermal & Mechanical Simulation and Experiments in Micro-Electronics and Micro-Systems, 9/05/2004, p.61-68Publication Addressing key concerns for implementation of Ni FUSI into manufacturing for 45/32 nm CMOS
Proceedings paper2007, Symposium on VLSI. Technology Digest of Technical Papers, 14/06/2007, p.158-159Publication Advanced physical analysis of 3D interconnect
Publication Characterization of the thermal impact of Cu-Cu bonds achieved using TSVs on hot spot dissipation in 3D stacked ICs
Proceedings paper2011-05, 61st Electronic Components and Technology Conference - ECTC, 31/05/2011, p.861-868Publication Compact thermal modeling of hot spots in advanced 3D-stacked structures
Proceedings paper2009, 11th Electronics Packaging Technology Conference - EPTC, 9/12/2009Publication Design issues and cosiderations for low-cost 3D TSV IC technology
Proceedings paper2010, IEEE International Solid-State Circuits Conference - ISSCC, 8/02/2010, p.148-149Publication Design of test structures for the characterization of thermal-mechanical stress in 3D stacked IC
Journal article2012, IEEE Transactions on Semiconductor Manufacturing, (25) 3, p.365-371Publication Effect of TSV presence on FEOL yield and reliability
Proceedings paper2013, IEEE International Reliability Physics Symposium - IRPS, 14/04/2013, p.5C.6Publication Fine grain thermal modelling and expermintal validation of 3D-ICs
Journal article2011-04, Microelectronics Journal, (42) 4, p.572-578Publication Gatestacks for scalable high-performance FinFETs
Proceedings paper2007, Technical Digest International Electron Devices Meeting - IEDM, 10/12/2007, p.681-684Publication Impact of mold compound filler particles on local thermo-mechanical stress variations
Publication Impact of Ni-silicide grain orientation on the strain and stress fields induced in patterned silicon
Journal article2007, Applied Physics Letters, (90) 5, p.54101Publication Kinetics of Ni3Si2 formation in the Ni2Si-NiSi thin film reaction from in situ measurements
Journal article2007, Applied Physics Letters, (91) 23, p.232102Publication Modelling and experimental investigation of silicide-induced mechanical stress and strain in transistors technology
Torregiani, CristinaPHD thesis2008-03Publication Nanometer scale characterisation of CoSi2 and NiSi induced strain in silicon by convergent beam electron diffraction
Journal article2004, Materials Science and Engineering B, 114-115, p.61-66Publication On the splitting of high order Laue zone lines in CBED analysis of stress in silicon
Journal article2007, Journal of the Electrochemical Society, (154) 3, p.H217-H224Publication Silicides and Germanides for Nano-CMOS Applications
Journal article2008, Materials Sience and Engineering B, 154-155, p.144-154Publication Silicides for advanced CMOS devices
Proceedings paper2005, Microscopy of Semiconducting Materials. Proceedings of the 14th Conference, 11/04/2005, p.379-388Publication Stress evolution during Ni-Si compound formation for fully silicided (FUSI) gates