Browsing by Author "Torregiani, Cristina"
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Publication A comparison of spike, flash, SPER and laser annealing for 45nm CMOS
Proceedings paper2003, CMOS Front-End Materials and Process Technology, 21/04/2003, p.261-266Publication A finite element study of process induced stress in the transistor channel: effects of silicide contact and gate stack
Proceedings paper2004, EuroSimE: 5th Int. Conf. on Thermal & Mechanical Simulation and Experiments in Micro-Electronics and Micro-Systems, 9/05/2004, p.61-68Publication Addressing key concerns for implementation of Ni FUSI into manufacturing for 45/32 nm CMOS
Proceedings paper2007, Symposium on VLSI. Technology Digest of Technical Papers, 14/06/2007, p.158-159Publication Advanced physical analysis of 3D interconnect
Publication Characterization of the thermal impact of Cu-Cu bonds achieved using TSVs on hot spot dissipation in 3D stacked ICs
Proceedings paper2011, 61st Electronic Components and Technology Conference - ECTC, 31/05/2011, p.861-868Publication Compact thermal modeling of hot spots in advanced 3D-stacked structures
Proceedings paper2009, 11th Electronics Packaging Technology Conference - EPTC, 9/12/2009Publication Design issues and cosiderations for low-cost 3D TSV IC technology
Proceedings paper2010, IEEE International Solid-State Circuits Conference - ISSCC, 8/02/2010, p.148-149Publication Design of test structures for the characterization of thermal-mechanical stress in 3D stacked IC
Journal article2012, IEEE Transactions on Semiconductor Manufacturing, (25) 3, p.365-371Publication Effect of TSV presence on FEOL yield and reliability
Proceedings paper2013, IEEE International Reliability Physics Symposium - IRPS, 14/04/2013, p.5C.6Publication Fine grain thermal modelling and expermintal validation of 3D-ICs
Journal article2011, Microelectronics Journal, (42) 4, p.572-578Publication Gatestacks for scalable high-performance FinFETs
Proceedings paper2007, Technical Digest International Electron Devices Meeting - IEDM, 10/12/2007, p.681-684Publication Impact of mold compound filler particles on local thermo-mechanical stress variations
Publication Impact of Ni-silicide grain orientation on the strain and stress fields induced in patterned silicon
Journal article2007, Applied Physics Letters, (90) 5, p.54101Publication Kinetics of Ni3Si2 formation in the Ni2Si-NiSi thin film reaction from in situ measurements
Journal article2007, Applied Physics Letters, (91) 23, p.232102Publication Modelling and experimental investigation of silicide-induced mechanical stress and strain in transistors technology
Torregiani, CristinaPHD thesis2008Publication Nanometer scale characterisation of CoSi2 and NiSi induced strain in silicon by convergent beam electron diffraction
Journal article2004, Materials Science and Engineering B, 114-115, p.61-66Publication On the splitting of high order Laue zone lines in CBED analysis of stress in silicon
Journal article2007, Journal of the Electrochemical Society, (154) 3, p.H217-H224Publication Silicides and Germanides for Nano-CMOS Applications
Journal article2008, Materials Sience and Engineering B, 154-155, p.144-154Publication Silicides for advanced CMOS devices
Proceedings paper2005, Microscopy of Semiconducting Materials. Proceedings of the 14th Conference, 11/04/2005, p.379-388Publication Stress evolution during Ni-Si compound formation for fully silicided (FUSI) gates