Browsing by author "Ruythooren, Wouter"
Now showing items 1-20 of 94
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3D integration technology developments at IMEC
De Moor, Piet; Ruythooren, Wouter; Soussan, Philippe; Baert, Kris; Van Hoof, Chris; Swinnen, Bart; Beyne, Eric (2007-11) -
3D stacked IC demonstration using a through silicon via first approach
Van Olmen, Jan; Mercha, Abdelkarim; Katti, Guruprasad; Huyghebaert, Cedric; Van Aelst, Joke; Seppala, Emma; Zhao, Chao; Armini, Silvia; Vaes, Jan; Cotrin Teixeira, Ricardo; Van Cauwenberghe, Marc; Verdonck, Patrick; Verhemeldonck, Koen; Jourdain, Anne; Ruythooren, Wouter; de Potter de ten Broeck, Muriel; Opdebeeck, Ann; Chiarella, Thomas; Parvais, Bertrand; Debusschere, Ingrid; Hoffmann, Thomas Y.; De Wachter, Bart; Dehaene, Wim; Stucchi, Michele; Rakowski, Michal; Soussan, Philippe; Cartuyvels, Rudi; Beyne, Eric; Biesemans, Serge; Swinnen, Bart (2008) -
3D Wafer level packaging: processes and materials for through silicon-vias and thin die embedding
Soussan, Philippe; Sabuncuoglu Tezcan, Deniz; Iker, Francois; Ruythooren, Wouter; Swinnen, Bart; Majeed, Bivragh; Beyne, Eric (2009) -
Additive influence on filling microvias with copper
Luhn, Ole; Ruythooren, Wouter; Van Hoof, Chris; Celis, Jean-Pierre (2008) -
An overview of module fabrication technologies for back-contact solar cells
Govaerts, Jonathan; Baert, Kris; Poortmans, Jef; Borgers, Tom; Ruythooren, Wouter (2012) -
ATHENA, Epi-GaN and beyond :MOVPE growth and processing of AlGaN/GaN HEMT
Germain, Marianne; Leys, Maarten; Degroote, Stefan; Cheng, Kai; Boeykens, Steven; Derluyn, Joff; Das, Johan; Ruythooren, Wouter; Vandersmissen, Raf; Schreurs, Dominique; Wang, Wenfei; Xiao, Dongping; Borghs, Gustaaf (2005) -
Barrier and seed layer coverage in 3D structures with different aspect ratios using sputtering and ALD proecesses
Luhn, Ole; Van Hoof, Chris; Ruythooren, Wouter; Celis, Jean-Pierre (2008) -
Challenges for Capillary Self-Assembly of Microsystems
Mastrangeli, Massimo; Ruythooren, Wouter; Celis, Jean-Pierre; Van Hoof, Chris (2011) -
Changing superfilling mode for copper electrodeposition in blind holes from differential inhibition to differential acceleration
Luhn, Ole; Radisic, Alex; Vereecken, Philippe; Van Hoof, Chris; Ruythooren, Wouter; Celis, Jean-Pierre (2009) -
Characteristics of copper electrodeposits on featureless substrates and in microvias with aspect ratio up to 10
Luhn, Ole; Radisic, Alex; Vereecken, Philippe; Van Hoof, Chris; Ruythooren, Wouter; Celis, Jean-Pierre (2009) -
Characterization of interconnects resulting from capillary die-to-substrate self-assembly
Mastrangeli, Massimo; Ruythooren, Wouter; Van Hoof, Chris; Celis, Jean-Pierre (2008) -
Characterization of oxidation of the electroplated Sn for advanced flip-chip bonding
Zhang, Wenqi; Ruythooren, Wouter (2009) -
Comparison of the effect of gate dielectric layer on 2DEG carrier concentration in strained AlGaN/GaN heterostructure
Wang, Wenfei; Derluyn, Joff; Germain, Marianne; De Wolf, Ingrid; Leys, Maarten; Boeykens, Steven; Degroote, Stefan; Ruythooren, Wouter; Das, Johan; Schreurs, Dominique; Nauwelaers, Bart; Borghs, Gustaaf (2005) -
Conformal dip-coating of patterned surfaces for capillary die-to-substrate self-assembly
Mastrangeli, Massimo; Ruythooren, Wouter; Van Hoof, Chris; Celis, Jean-Pierre (2009) -
Copper plating for 3D interconnects
Radisic, Alex; Luhn, Ole; Philipsen, Harold; El-Mekki, Zaid; Honore, Mia; Rodet, Simon; Armini, Silvia; Drijbooms, Chris; Bender, Hugo; Ruythooren, Wouter (2011) -
Copper plating for 3D interconnects
Radisic, Alex; Luhn, Ole; Vaes, Jan; Armini, Silvia; El-Mekki, Zaid; Radisic, Dunja; Ruythooren, Wouter; Vereecken, Philippe (2009) -
Copper plating for 3d interconnects
Radisic, Alex; Luhn, Ole; Vaes, Jan; Armini, Silvia; El-Mekki, Zaid; Radisic, Dunja; Ruythooren, Wouter; Vereecken, Philippe (2010) -
Copper plating on resistive substrates, diffusion barrier and alternative seed layers
Radisic, Alex; Nagar, Magi; Strubbe, Katrien; Armini, Silvia; El-Mekki, Zaid; Volders, Henny; Ruythooren, Wouter; Vereecken, Philippe (2009) -
Copper plating on resistive substrates, diffusion barrier and alternative seed layers
Radisic, Alex; Nagar, Magi; Strubbe, K.; Armini, Silvia; El-Mekki, Zaid; Volders, Henny; Ruythooren, Wouter; Vereecken, Philippe (2010) -
Correlation of transport and structural properties in AlGaN/GaN HEMT: Strain modification by means of AlN interlayers
Germain, Marianne; Leys, Maarten; Boeykens, Steven; Ruythooren, Wouter; Schreurs, Dominique; Choi, Kang-Hoon; Borghs, Gustaaf; Van Daele, Benny; Van Tendeloo, Gustaaf; Farvacque, Jean-Louis; Carosella, Francesca (2003)