Browsing by author "Kesters, Els"
Now showing items 1-20 of 117
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21 nm Pitch dual-damascene BEOL process integration with full barrierless Ru metallization
Vega Gonzalez, Victor; Wilson, Chris; Paolillo, Sara; Decoster, Stefan; Mao, Ming; Versluijs, Janko; Blanco, Victor; Kesters, Els; Le, Quoc Toan; Lorant, Christophe; Varela Pedreira, Olalla; Lesniewska, Alicja; Heylen, Nancy; El-Mekki, Zaid; van der Veen, Marleen; Webers, Tomas; Vats, Hemant; Rynders, Luc; Cupak, Miroslav; Lee, Jae Uk; Drissi, Youssef; Halipre, Luc; Charley, Anne-Laure; Verdonck, Patrick; Witters, Thomas; Van Gompel, Sander; Kimura, Yosuke; Jourdan, Nicolas; Ciofi, Ivan; Contino, Antonino; Boccardi, Guillaume; Lariviere, Stephane; De Wachter, Bart; Vancoille, Eric; Lazzarino, Frederic; Ercken, Monique; Kim, Ryan Ryoung han; Trivkovic, Darko; Croes, Kristof; Leray, Philippe; Pardons, Katrien; Barla, Kathy; Tokei, Zsolt (2019) -
A high-reliable Cu/ULK integration scheme using Metal Hard Mask and Low-k capping film
Travaly, Youssef; Tsutsue, M.; Ikeda, Atsushi; Verdonck, Patrick; Tokei, Zsolt; Willegems, Myriam; Van Aelst, Joke; Struyf, Herbert; Vereecke, Guy; Kesters, Els; Le, Quoc Toan; Claes, Martine; Heylen, Nancy; Sinapi, Fabrice; Richard, Olivier; De Roest, David; Kaneko, S; Kemeling, N; Fukazawa, A; Matsuki, N; Matsushita, K; Tsuji, N; Kagami, K; Sprey, Hessel; Beyer, Gerald (2007) -
A study in interactions of plasmas and wet cleans with ULK materials
Xu, Kaidong; Vereecke, Guy; Kesters, Els; Le, Quoc Toan; Lux, Marcel; Kraus, Harald; Henry, Sally - Ann; Archer, L.; Gaulhofer, E.; Kovacs, F.; Dalmer, M.; Mertens, Paul; Luo, S. J; Han, Q. Y (2007) -
Acoustic cleaning in nano-electronics
Mertens, Paul; Janssens, Tom; Holsteyns, Frank; Zijlstra, Aaldert; Halder, Sandip; Wostyn, Kurt; Andreas, Michael; Hoyer, Ronald; Barbagini, Francesca; Wada, Masayuki; Franklin, Cole; Kim, Tae-Gon; Kim, K; Kenis, Karine; Le, Quoc Toan; Claes, Martine; Kesters, Els; Vos, Rita; Vereecke, Guy; Bearda, Twan; Heyns, Marc (2008) -
Advanced wafer surface cleaning technology
Mertens, Paul; Vos, Rita; Vereecke, Guy; Arnauts, Sophia; Bearda, Twan; De Waele, Rita; Eitoku, Atsuro; Fyen, Wim; Geckiere, J.; Hellin, David; Holsteyns, Frank; Kesters, Els; Claes, Martine; Kenis, Karine; Kraus, Harald; Malhouitre, Stephane; Lee, Kuntack; Kocsis, Michael; Onsia, Bart; Garaud, Sylvain; Rip, Jens; Snow, Jim; Teerlinck, I.; Van Hoeymissen, Jan; Barbagini, Francesca; Xu, Kaidong; Paraschiv, Vasile; De Gendt, Stefan; Mannaert, Geert; Heyns, Marc (2004) -
All wet strip approaches for post-etch photoresist layers after low-k patterning
Claes, Martine; Le, Quoc Toan; Kesters, Els; Lux, Marcel; Urionabarrenetxea, Ainara; Vereecke, Guy; Mertens, Paul; Carleer, R.; Adriaensens, P. (2007) -
Alternative metal recess for fully-self-aligned-vias
Contino, Antonino; Le, Quoc Toan; Sakamoto, Kei; Schleicher, Filip; Paolillo, Sara; Pacco, Antoine; Kesters, Els; Lorant, Christophe; Murdoch, Gayle; Lariviere, Stephane; Vega Gonzalez, Victor; Versluijs, Janko; Jaenen, Patrick; Teugels, Lieve; van der Veen, Marleen; Jourdan, Nicolas; Ciofi, Ivan; Boccardi, Guillaume; Tokei, Zsolt; Wilson, Chris (2020) -
Alternative photoresist removal process to minimize damage of low-k material induced by ash plasma
Le, Quoc Toan; Keldermans, Johan; Chiodarelli, Nicolo; Kesters, Els; Lux, Marcel; Claes, Martine; Vereecke, Guy (2008) -
Alternative photoresist removal process to minimize damage of low-k material induced by ash plasma
Le, Quoc Toan; Keldermans, Johan; Chiodarelli, Nicolo; Kesters, Els; Lux, Marcel; Claes, Martine; Vereecke, Guy (2007-11) -
An environment friendly wet strip process for 193 nm lithography patterning in BEOL applications
Vereecke, Guy; Kesters, Els; Le, Quoc Toan; Claes, Martine; Lux, Marcel; Struyf, Herbert; Carleer, Robert; Adriaensens, Peter (2012) -
An environment friendly wet strip process for 193 nm lithography patterning in BEOL applications
Vereecke, Guy; Kesters, Els; Le, Quoc Toan; Claes, Martine; Lux, Marcel; Struyf, Herbert; Carleer, Robert; Adriaensens, Peter (2013) -
Application of surface and interface characterization of materials in back-end-of-line interconnect
Le, Quoc Toan; Kesters, Els; Altamirano Sanchez, Efrain; Holsteyns, Frank (2019) -
Application of UV irradiation in removal of post-etch 193 nm photoresist
Le, Quoc Toan; Kesters, Els; Prager, Lutz; Lux, Marcel; Marsik, Premysl; Vereecke, Guy (2009) -
Aqueous photoresist and BARC wet strip in BEOL MHM patterning using UV and ozonated chemistry
Kesters, Els; Vereecke, Guy; Lux, Marcel; Pittevils, Joris; Struyf, Herbert (2011) -
BEOL pre-metallization wet clean: post-etch residue removal and metal compatibility
Le, Quoc Toan; Kesters, Els; Akanishi, Yuya; Iwasaki, Akihisa; Holsteyns, Frank (2018) -
Challenges and novel approaches for photo resist removal and post-etch residue removal for 22 nm interconnects
Mertens, Paul; Kim, Tae-Gon; Claes, Martine; Le, Quoc Toan; Vereecke, Guy; Kesters, Els; Suhard, Samuel; Pacco, Antoine; Lux, Marcel; Kenis, Karine; Urbanowicz, Adam; Tokei, Zsolt; Beyer, Gerald (2009) -
Challenges in BEOL cleaning for the 10 nm node and beyond
Yu, David; Le, Quoc Toan; Braun, Simon; Kesters, Els; Shen, Mary; Klipp, Andreas; Holsteyns, Frank (2014) -
Challenges of clean/strip processing for Cu/LowK technology
Baklanov, Mikhaïl; Le, Quoc Toan; Kesters, Els; Iacopi, Francesca; Van Aelst, Joke; Struyf, Herbert; Boullart, Werner; Vanhaelemeersch, Serge; Maex, Karen (2004) -
Characterization of etch residues generated on damascene structures
Le, Quoc Toan; Kesters, Els; Hoflijk, Ilse; Conard, Thierry; Shen, M.; Braun, S.; Burk, Y.; Holsteyns, Frank (2016) -
Characterization of modification of 193-nm photoresist by HBr plasma
Vereecke, Guy; Claes, Martine; Le, Quoc Toan; Kesters, Els; Struyf, Herbert; Carleer, Robert; Adriaensens, Peter (2011)