Browsing by author "Zhang, Liping"
Now showing items 21-40 of 68
-
Damage-free plasma etching of porous organo-silicate low-k using micro-capillary condensation above -50° C
Chanson, Romain; Zhang, Liping; Naumove, Sergei; Mankelevich, Yu.; Tillocher, Thomas; Lefaucheux, Phillipe; Dussart, Remi; De Gendt, Stefan; de Marneffe, Jean-Francois (2018) -
Effect of 147 nm radiation on a 2.0 porous organo-Silicon glass
de Marneffe, Jean-Francois; Lukaszewicz, Mikolaj; Porter, Stephen; Zhang, Liping; Heyne, Markus; Baklanov, Mikhaïl (2013) -
Effect of 147nm photons on porous Organo-Silicon Glass materials and damage improvement by optimized Cu/low-k integration approaches
Zhang, Liping; de Marneffe, Jean-Francois; Lukaszewicz, Mikolaj; Barry-Porter, Stephen; Vajda, Felim; Sun, Yiting; Heyne, Markus; Baklanov, Mikhaïl; Rutiqlian, Vito (2014) -
Etch challenges on single and dual SOI fins patterning for CFET at 25nm fin pitch
Chan, BT; Boemmels, Juergen; Ryckaert, Julien; Zhang, Liping; Tao, Zheng; Altamirano Sanchez, Efrain; de Marneffe, Jean-Francois (2019) -
FEOL dry etch process challenges of ultimate FinFET scaling and next generation device architectures beyond N3
Tao, Zheng; Zhang, Liping; Dupuy, Emmanuel; Chan, BT; Altamirano Sanchez, Efrain; Lazzarino, Frederic (2020) -
Fin bending in dimensional scaling
Zhang, Liping; Hellin, David; Sepulveda Marquez, Alfonso; Altamirano Sanchez, Efrain; Lazzarino, Frederic; Morin, Pierre; Wang, Shouhua; Hopf, Toby; Kenis, Karine; Lorant, Christophe; Sebaai, Farid; Batuk, Dmitry; Briggs, Basoene; Mertens, Hans; Demuynck, Steven (2020) -
First demonstration of monocrystalline silicon macaroni channel for 3-D NAND memory devices
Delhougne, Romain; Arreghini, Antonio; Rosseel, Erik; Hikavyy, Andriy; Vecchio, Emma; Zhang, Liping; Pak, Murat; Nyns, Laura; Raymaekers, Tom; Jossart, Nico; Breuil, Laurent; Vadakupudhu Palayam, Senthil; Tan, ChiLim; Van den Bosch, Geert; Furnemont, Arnaud (2018) -
First demonstration of MOVPE In1-xGaxAs macaroni channel for 3-D NAND memory devices
Ramesh, Siva; Vadakupudhu Palayam, Senthil; Rosseel, Erik; Arreghini, Antonio; Kunert, Bernardette; Baryshnikova, Marina; Zhang, Liping; Ong, Patrick; Teugels, Lieve; Pak, Murat; Jossart, Nico; Raymaekers, Tom; Stiers, Jimmy; Van den Bosch, Geert; Furnemont, Arnaud (2019) -
High thermal stability and high VUV absorption polymer for the P4/pore stuffing approach
Rutigliani, Vito; Zhang, Liping; de Marneffe, Jean-Francois; Cao, Yi; Noya, G.; Baklanov, Mikhaïl (2015) -
Impact of curing condition on chemical stability of ultralow-k PMO material
Krishtab, Mikhail; Zhang, Liping; Le, Quoc Toan; Vanstreels, Kris; Souriau, Laurent; Phillips, Mark; Baklanov, Mikhaïl (2012) -
Improved plasma resistance for porous low-k dielectrics by pore stuffing approach
Zhang, Liping; de Marneffe, Jean-Francois; Heyne, Markus; Naumov, Sergej; Sun, Yiting; Zotovich, Alexey; El Otell, Ziad; Vaida, Selim; De Gendt, Stefan; Baklanov, Mikhaïl (2015) -
Innovative solutions for advanced interconnects using ultralow-k dielectrics
Zhang, Liping (2017-02) -
Integration aspects of post-porosity low-k protection using PMMA sacrificial filler
Zhang, Liping; de Marneffe, Jean-Francois; Wen, Liang Gong; Wilson, Chris; Tokei, Zsolt; Boemmels, Juergen; De Gendt, Stefan; Baklanov, Mikhaïl (2016) -
Integration of a k=2.3 spin-on polymer for the sub-28nm technology node
Wilson, Chris; Lazzarino, Frederic; Truffert, Vincent; Kirimura, Tomoyuki; de Marneffe, Jean-Francois; Verdonck, Patrick; Hirai, M.; Nakatani, K.; Tada, M.; Heylen, Nancy; El-Mekki, Zaid; Vanstreels, Kris; Van Besien, Els; Ciofi, Ivan; Stucchi, Michele; Croes, Kristof; Zhang, Liping; Demuynck, Steven; Ercken, Monique; Xu, Kaidong; Baklanov, Mikhaïl; Tokei, Zsolt (2012) -
Integration of porous low-k dielectrics using post porosity pore protection
Zhang, Liping; de Marneffe, Jean-Francois; Verdonck, Patrick; Heylen, Nancy; Wen, Liang Gong; Wilson, Chris; Tokei, Zsolt; Boemmels, Juergen; De Gendt, Stefan; Baklanov, Mikhail (2016) -
Integration of Ruthenium-based Wordline in a 3-D NAND Memory Devices
Breuil, Laurent; El Hajjam, Gabriel; Ramesh, Siva; Ajaykumar, Arjun; Arreghini, Antonio; Zhang, Liping; Sebaai, Farid; Nyns, Laura; Raymaekers, Tom; Rosmeulen, Maarten; Van den Bosch, Geert; Furnemont, Arnaud (2020) -
Integration of ultralow-k dielectrics using a template replacement approach
Zhang, Liping; de Marneffe, Jean-Francois; Murdoch, Gayle; Vega Gonzalez, Victor; Verdonck, Patrick; Heylen, Nancy; Zha, Lichen; Wu, Chen; Lesniewska, Alicja; Tokei, Zsolt; Boemmels, Juergen; De Gendt, Stefan; Lefferts, Scott (2017) -
Low damage cryoetching of low-K materials
Dussart, Remi; Tillocher, Thomas; Leroy, Floriane; Lefaucheux, Philippe; yatsuda, koichi; Maekawa, Kaoru; Nishimura, Eiichi; Zhang, Liping; de Marneffe, Jean-Francois; Baklanov, Mikhaïl (2015) -
Low damage cryogenic etching of low-k materials for advanced interconnects
Baklanov, Mikhaïl; Zhang, Liping; de Marneffe, Jean-Francois; Dussart, Remi; Goodyear, Andy (2014) -
Low damage cryogenic etching of porous organosilicate low-k materials using SF6/O2/SiF4
Zhang, Liping; Ljazouli, Rami; Lefaucheux, Philippe; Tillocher, Thomas; Dussart, Remi; Mankelevich, Yuri; de Marneffe, Jean-Francois; De Gendt, Stefan; Baklanov, Mikhaïl (2013)